Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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Temperature Range and Measurement Standards for Components and Modules |
JESD402-1B | Sep 2024 |
This document specifies standard temperature ranges that may be used, by way of referencing JESD402-1, in other standards, specifications, and datasheets when defining temperature related specifications. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42 Free download. Registration or login required. |
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DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 7th Edition |
JESD88G | Mar 2025 |
This reference for technical writers and educators, manufacturers, and buyers and users of discrete solid state devices is now available. It should aid the technical committees of JEDEC in the avoidance of multiple definitions and reduce the proliferation of redundant definitions. The long-term goal is to include definitions from all JEDEC publications and standards. Each of the approximately two thousand entries is referenced to its source publication, and an annex listing the names of the source publications and their releases dates is included. All entries were reviewed for punctuation, grammar, and clarity, as well as accuracy, and reworded if such was considered warranted. The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-10 Free download. Registration or login required. |
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EMBEDDED MULTI-MEDIA CARD (e•MMC), ELECTRICAL STANDARD (5.1) |
JESD84-B51A | Jan 2019 |
This document provides a comprehensive definition of the e•MMC Electrical Interface, its environment, and handling. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce design-in overhead. The purpose of this standard is the definition of the e•MMC Electrical Interface, its environment and handling. It provides guidelines for systems designers. Item 67.14. This document replaces all past versions, however links to the replaced versions are provided here for reference only: JESD84-B51, February 2015; JESD84-B50.1, July 2014 (Editorial revision of JESD84-B50); JESD84-B50, September 2013 (Revision of JESD84-B451); JESD84-B451, June 2012 (Revision of JESD84-B45, June 2011) A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-64 Available for purchase: $327.00 Add to Cart Paying JEDEC Members may login for free access. |
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EMBEDDED MULTIMEDIACARD (e·MMC) e·MMC/CARD PRODUCT STANDARD, HIGH CAPACITY, INCLUDING RELIABLE WRITE, BOOT, AND SLEEP MODES (MMCA, 4.3) |
JESD84-A43 | Dec 2007 |
This document is a complete specification for embedded memory devices and removable memory cards using the MMC interface version 4.3. New features developed through the Electrical Joint Task Group include: Sleep mode, Boot mode and Reliable Write. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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EMBEDDED MULTIMEDIACARD (e·MMC) MECHANICAL STANDARD |
JESD84-C43 | Dec 2007 |
This document is a mechanical product specification for a high capacity embedded memory device using the MMC interface version 4.2 and a BGA package A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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EMBEDDED MULTIMEDIACARD (e·MMC) MECHANICAL STANDARD, WITH OPTIONAL RESET SIGNAL |
JESD84-C44 | Jul 2009 |
JEDEC has taken the basic MMCA specification and adopted it for embedded applications, calling it (e·MMC). In addition to the packaging differences, (e·MMC) devices use a reduced voltage interface. These specifications are detailed in the JEDEC Standard for Embedded MultiMediaCard e•MMC/Card Product Standard, JESD84-Axx. The purpose of the standard is the mechanical definition of the e•MMC. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-64 Free download. Registration or login required. |
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EMBEDDED MULTIMEDIACARD(e·MMC) e·MMC/CARD PRODUCT STANDARD, HIGH CAPACITY, Including Reliable Write, Boot, Sleep Modes, Dual Data Rate, Multiple Partitions Supports and Security Enhancement (MMCA, 4.4) - SUPERSEDED BY JESD84-A441, March 2010Status: Superseded April 2010 |
JESD84-A44 | Mar 2009 |
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-64 Free download. Registration or login required. |
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EMBEDDED MULTIMEDIACARD(e•MMC) e•MMC/CARD PRODUCT STANDARD, HIGH CAPACITY, including Reliable Write, Boot, Sleep Modes, Dual Data Rate, Multiple Partitions Supports, Security Enhancement, Background Operation and High Priority Interrupt (MMCA, 4.41) |
JESD84-A441 | Mar 2010 |
The purpose of this standard is the definition of the MMC/e•MMC Electrical Interface, its environment and handling. It provides guidelines for systems designers. The standard also defines a tool box (a set of macro functions and algorithms) that contributes to reducing design-in costs. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-64.1 Free download. Registration or login required. |
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FAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICES |
JEP122H | Sep 2016 |
This publication provides a list of failure mechanisms and their associated activation energies or acceleration factors that may be used in making system failure rate estimations when the only available data is based on tests performed at accelerated stress test conditions. The method to be used is the Sum-of-the-Failure-Rates method. This publication also provides guidance in the selection of reliability modeling parameters, namely functional form, apparent thermal activation energy values and sensitivity to stresses such as power supply voltage, substrate current, current density, gate voltage, relative humidity, temperature cycling range, mobile ion concentration, etc. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14.2 Available for purchase: $163.00 Add to Cart Paying JEDEC Members may login for free access. |
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GUIDE TO STANDARDS AND PUBLICATIONS RELATING TO QUALITY AND RELIABILITY OF ELECTRONIC HARDWARE |
JEP70C | Oct 2013 |
This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. This will have a positive effect on quality and reliability as users gain more access to proper methods in designing, producing, and testing parts. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14.4 Free download. Registration or login required. |
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JEDEC COMMITTEE SCOPE MANUAL |
JM18U | Oct 2023 |
The JEDEC Board of Directors is responsible for establishing appropriate committees to conduct its standardization activities. This publication identifies the service and product committees established by the Board of Directors and defines their scopes. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-COUN Free download. Registration or login required. |
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Low Power Double Data Rate Interface for Non-Volatile Memory (LPDDR4X-NVM) Standard |
JESD326-4 | Nov 2024 |
This standard defines the Low Power Double Data Rate interface for Non-Volatile Memory (LPDDR4XNVM) Standard. This standard describes features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this specification is to define the minimum set of requirements for a JEDEC compliant 16 bit single channel LPDDR4X-NVM device. LPDDR4X-NVM density ranges from 128Mb through 32Gb. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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MULTIMEDIACARD (MMC) ELECTRICAL STANDARD, HIGH CAPACITY (MMCA, 4.2) |
JESD84-B42 | Jul 2007 |
The purpose of the specification is the definition of the e•MMC, its environment and handling. It provides guidelines for systems designers. The specification also defines a tool box (a set of macro functions and algorithms) that contributes to reducing design-in costs. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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MULTIMEDIACARD (MMC) ELECTRICAL STANDARD, STANDARD CAPACITY (MMCA, 4.1) |
JESD84-B41 | Jun 2007 |
This document provides a comprehensive definition of the MultiMediaCard, its environment, and handling. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce design-in costs. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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MULTIMEDIACARD (MMC) MECHANICAL STANDARD |
JESD84-C01 | Dec 2007 |
This document is a mechanical product specification for a removable non-volatile flash memory device using the MMC interface version 4.2 The electrical specification for the MMC interface version 4.2 is document JESD84-B42 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-E100G | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. For more information visit the main JEP30 webpage. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.2, JC-16 Free download. Registration or login required. |
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PRELIMINARY RELEASE FOR JESD21: DDR3 MINI-RDIMM ANNEX D (x8 2R, Planar) |
PRN13-NM3 | Oct 2013 |
Item No. 2207.14 (JC-45.1-12-284, JCB-12-63) A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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SILICON RECTIFIER DIODES: |
JESD282B.02 | Mar 2023 |
Terminology update. This legacy document is a comprehensive users’ guide for silicon rectifier diode applications. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-22.2 Free download. Registration or login required. |
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SYSTEM LEVEL ESD: PART II: IMPLEMENTATION OF EFFECTIVE ESD ROBUST DESIGNSThis is an editorial revision, details can be found in Annex F. |
JEP162A.01 | Jan 2021 |
This document, while establishing the complex nature of System Level ESD, proposes that an efficient ESD design can only be achieved when the interaction of the various components under ESD conditions are analyzed at the system level. This objective requires an appropriate characterization of the components and a methodology to assess the entire system using simulation data. This is applicable to system failures of different categories (such as hard, soft, and electromagnetic interference (EMI)). This type of systematic approach is long overdue and represents an advanced design approach which replaces the misconception, as discussed in detail in JEP161, that a system will be sufficiently robust if all components exceed a certain ESD level. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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TERMS, DEFINITIONS, AND LETTER SYMBOLS FOR MICROCOMPUTERS, MICROPROCESSORS, AND MEMORY INTEGRATED CIRCUITS: |
JESD100B.01 | Dec 2002 |
A revised reference for technical writers and educators, manufacturers, buyers and users of microprocessors, microcomputers, mircocontrollers, memory ICs, and other complex devices. The terms and their definitions in this standard have been updated and are in general agreement with the latest publications of the IEEE and the IEC. The companion standard for other integrated circuits is JESD99A. Also included is a system for generating symbols for time intervals found in complex sequential circuits, including memories. JESD100B.01 is the first minor revision of JESD100-B, December 1999. Annex A briefly shows entries that have changed. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-10 Free download. Registration or login required. |