Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
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TERMS, DEFINTIONS, AND LETTER SYMBOLS FOR MICROCOMPUTERS AND MEMORY INTEGRATED CIRCUITS: ELEVATED TO JESD100, August 1993.Status: Rescinded |
JEP100 | Sep 1979 |
Committee(s): JC-10 Free download. Registration or login required. |
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TERMS, DEFINITIONS, AND LETTER SYMBOLS FOR MICROCOMPUTERS, MICROPROCESSORS, AND MEMORY INTEGRATED CIRCUITS: |
JESD100B.01 | Dec 2002 |
A revised reference for technical writers and educators, manufacturers, buyers and users of microprocessors, microcomputers, mircocontrollers, memory ICs, and other complex devices. The terms and their definitions in this standard have been updated and are in general agreement with the latest publications of the IEEE and the IEC. The companion standard for other integrated circuits is JESD99A. Also included is a system for generating symbols for time intervals found in complex sequential circuits, including memories. JESD100B.01 is the first minor revision of JESD100-B, December 1999. Annex A briefly shows entries that have changed. Committee(s): JC-10 Free download. Registration or login required. |
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MULTIMEDIACARD (MMC) ELECTRICAL STANDARD, STANDARD CAPACITY (MMCA, 4.1) |
JESD84-B41 | Jun 2007 |
This document provides a comprehensive definition of the MultiMediaCard, its environment, and handling. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce design-in costs. Patents(): Samsung; Qimonda; Nokia Free download. Registration or login required. |
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MULTIMEDIACARD (MMC) ELECTRICAL STANDARD, HIGH CAPACITY (MMCA, 4.2) |
JESD84-B42 | Jul 2007 |
The purpose of the specification is the definition of the e•MMC, its environment and handling. It provides guidelines for systems designers. The specification also defines a tool box (a set of macro functions and algorithms) that contributes to reducing design-in costs. Free download. Registration or login required. |
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EMBEDDED MULTIMEDIACARD (e·MMC) e·MMC/CARD PRODUCT STANDARD, HIGH CAPACITY, INCLUDING RELIABLE WRITE, BOOT, AND SLEEP MODES (MMCA, 4.3) |
JESD84-A43 | Dec 2007 |
This document is a complete specification for embedded memory devices and removable memory cards using the MMC interface version 4.3. New features developed through the Electrical Joint Task Group include: Sleep mode, Boot mode and Reliable Write. Free download. Registration or login required. |
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MULTIMEDIACARD (MMC) MECHANICAL STANDARD |
JESD84-C01 | Dec 2007 |
This document is a mechanical product specification for a removable non-volatile flash memory device using the MMC interface version 4.2 The electrical specification for the MMC interface version 4.2 is document JESD84-B42 Free download. Registration or login required. |
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EMBEDDED MULTIMEDIACARD (e·MMC) MECHANICAL STANDARD |
JESD84-C43 | Dec 2007 |
This document is a mechanical product specification for a high capacity embedded memory device using the MMC interface version 4.2 and a BGA package Free download. Registration or login required. |
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EMBEDDED MULTIMEDIACARD(e·MMC) e·MMC/CARD PRODUCT STANDARD, HIGH CAPACITY, Including Reliable Write, Boot, Sleep Modes, Dual Data Rate, Multiple Partitions Supports and Security Enhancement (MMCA, 4.4) - SUPERSEDED BY JESD84-A441, March 2010Status: Superseded April 2010 |
JESD84-A44 | Mar 2009 |
Committee(s): JC-64 Free download. Registration or login required. |
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EMBEDDED MULTIMEDIACARD (e·MMC) MECHANICAL STANDARD, WITH OPTIONAL RESET SIGNAL |
JESD84-C44 | Jul 2009 |
JEDEC has taken the basic MMCA specification and adopted it for embedded applications, calling it (e·MMC). In addition to the packaging differences, (e·MMC) devices use a reduced voltage interface. These specifications are detailed in the JEDEC Standard for Embedded MultiMediaCard e•MMC/Card Product Standard, JESD84-Axx. The purpose of the standard is the mechanical definition of the e•MMC. Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-64 Free download. Registration or login required. |
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EMBEDDED MULTIMEDIACARD(e•MMC) e•MMC/CARD PRODUCT STANDARD, HIGH CAPACITY, including Reliable Write, Boot, Sleep Modes, Dual Data Rate, Multiple Partitions Supports, Security Enhancement, Background Operation and High Priority Interrupt (MMCA, 4.41) |
JESD84-A441 | Mar 2010 |
The purpose of this standard is the definition of the MMC/e•MMC Electrical Interface, its environment and handling. It provides guidelines for systems designers. The standard also defines a tool box (a set of macro functions and algorithms) that contributes to reducing design-in costs. Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-64.1 Free download. Registration or login required. |
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GUIDE TO STANDARDS AND PUBLICATIONS RELATING TO QUALITY AND RELIABILITY OF ELECTRONIC HARDWARE |
JEP70C | Oct 2013 |
This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. This will have a positive effect on quality and reliability as users gain more access to proper methods in designing, producing, and testing parts. Committee(s): JC-14.4 Free download. Registration or login required. |
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PRELIMINARY RELEASE FOR JESD21: DDR3 MINI-RDIMM ANNEX D (x8 2R, Planar) |
PRN13-NM3 | Oct 2013 |
Item No. 2207.14 (JC-45.1-12-284, JCB-12-63) Committee(s): JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Universal Flash Storage (UFS), Version 2.1Status: Superseded August 2020 |
JESD220C-2.1 | Mar 2016 |
This document has been superseded by JESD220C-2.2, August 2020, and is provided here for reference purposes only. This standard specifies the characteristics of the UFS electrical interface and the memory device. Such characteristics include (among others) low power consumption, high data throughput, low electromagnetic interference and optimization for mass memory subsystem efficiency. The UFS electrical interface is based on an advanced differential interface by MIPI M-PHY specification which together with the MIPI UniPro specification forms the interconnect of the UFS interface. The architectural model is referencing the INCITS T10 (SCSI) SAM standard and the command protocol is based on INCITS T10 (SCSI) SPC and SBC standards. Item 133.00B Committee(s): JC-64.1 Free download. Registration or login required. |
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UNIVERSAL FLASH STORAGE HOST CONTROLLER INTERFACE (UFSHCI), Version 2.1Status: Supersededby JESD223D, January 2018 |
JESD223C | Mar 2016 |
This document has been superseded by JESD223D, January 2018, however is available for reference only. Committee(s): JC-64.1 Free download. Registration or login required. |
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UNIVERSAL FLASH STORAGE (UFS) UNIFIED MEMORY EXTENSION, Version 1.1 |
JESD220-1A | Mar 2016 |
This UFS Unified Memory Support Extension standard is an extension to the UFS standard, JESD220, This standard defines a managed storage device. UFS devices are designed to offer a high performance with low power consumption. The UFS device contains features that support both high throughput for large data transfers and performance for small random data accesses. This standard describes the requirements to implement unified memory functionality in an UFS device. Unified Memory Support is not mandatory but optional. Item 133.11 Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-64.1 Free download. Registration or login required. |
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UNIVERSAL FLASH STORAGE HOST CONTROLLER INTERFACE (UFSHCI), UNIFIED MEMORY EXTENSION, Version 1.1A |
JESD223-1B | May 2016 |
This Unified Memory Extension standard is an extension to the UFSHCI standard, JESD223. The UFSHCI standard defines the interface between the UFS driver and the UFS host controller. In addition to the register interface, it defines data structures inside the system memory, which are used to exchange data, control and status information. Furthermore the UFSHCI standard defines the protocol layer structure and abstract entities within these layers. Unified Memory offers the possibility to move Device internal working memory into the system memory to reduce overall system cost and to improve Device performance. Item 203.25 Patents(): Apple: 2010/0250836; Toshiba: P2011-252001, 13/561392, 101126675, 201210272624.X, 13/758090, 101132071, 201210332970.2, P2012-194380, P2012-194380, P2012-194380; Memory Technology: 2013/0198434, 2010/0312947 Committee(s): JC-64.1 Free download. Registration or login required. |
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UNDERSTANDING ELECTRICAL OVERSTRESS - EOSStatus: Reaffirmed May 2022 |
JEP174 | Sep 2016 |
This purpose of this white paper will be to introduce a new perspective about EOS to the electronics industry. As failures exhibiting EOS damage are commonly experienced in the industry, and these severe overstress events are a factor in the damage of many products, the intent of the white paper is to clarify what EOS really is and how it can be mitigated once it is properly comprehended. Committee(s): JC-14.3 Free download. Registration or login required. |
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FAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICES |
JEP122H | Sep 2016 |
This publication provides a list of failure mechanisms and their associated activation energies or acceleration factors that may be used in making system failure rate estimations when the only available data is based on tests performed at accelerated stress test conditions. The method to be used is the Sum-of-the-Failure-Rates method. This publication also provides guidance in the selection of reliability modeling parameters, namely functional form, apparent thermal activation energy values and sensitivity to stresses such as power supply voltage, substrate current, current density, gate voltage, relative humidity, temperature cycling range, mobile ion concentration, etc. Committee(s): JC-14.2 Available for purchase: $163.00 Add to Cart Paying JEDEC Members may login for free access. |
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UNIVERSAL FLASH STORAGE (UFS) SECURITY EXTENSIONItem 112.99 |
JESD225 | Nov 2016 |
This document provides a comprehensive definition of the UFS security requirements for implementation of IEEE 1667 and TCG Opal security functionality. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce design-in overhead. Committee(s): JC-64.1 Free download. Registration or login required. |
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UNIVERSAL FLASH STORAGE (UFS) TEST |
JESD224A | Jul 2017 |
JESD224A is valid only for UFS 2.1 and should not be referenced for other versions of the UFS standard. The primary objective of this test standard is to specify the test cases for UFS device protocol conformance testing. This test standard provides test cases for checking the functions defined in the following target standard: JESD220. Universal Flash Storage (UFS) Standard version 1.1A. MIPI M-PHY and MIPI UniPro test cases are not in the scope of this document. Item 400.36 Committee(s): JC-64.5 Free download. Registration or login required. |