Global Standards for the Microelectronics Industry
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RELIABILITY QUALIFICATION OF POWER AMPLIFIER MODULES
This standard is intended to identify a core set of qualification tests that apply specifically for Power Amplifier Modules and their primary application in mobile devices such as cellular phones. This standard is intended to describe specific stresses and failure mechanisms that are specific to compound semiconductors and power amplifier modules. It is intended to establish more meaningful and efficient qualification testing.
SOLDER BALL SHEARStatus: Reaffirmed September 2020
The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.
STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS
This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed.
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