Standards & Documents Search

Displaying 1 - 3 of 3 documents.

Title	Document #	Date
SOLDER BALL SHEAR Status: Reaffirmed September 2020	JESD22-B117B	May 2014
The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS	JESD47L	Dec 2022
This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. Committee(s): JC-14, JC-14.3 Available for purchase: $87.38 Add to Cart To help cover the costs of producing standards, JEDEC is now charging for non-member access to selected standards and design files. Most of the content on this site remains free to download with registration. Paying JEDEC member companies enjoy free access to all content. Learn more and apply today. Paying JEDEC Members may login for free access.
RELIABILITY QUALIFICATION OF POWER AMPLIFIER MODULES	JESD237	Mar 2014
This standard is intended to identify a core set of qualification tests that apply specifically for Power Amplifier Modules and their primary application in mobile devices such as cellular phones. This standard is intended to describe specific stresses and failure mechanisms that are specific to compound semiconductors and power amplifier modules. It is intended to establish more meaningful and efficient qualification testing. Committee(s): JC-14.7 Free download. Registration or login required.