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Displaying 1 - 5 of 5 documents.

Title	Document #	Date
PRECONDITIONING OF NONHERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING	JESD22-A113I	Apr 2020
This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence of this document by the semiconductor manufacturer prior to being submitted to specific in-house reliability testing (qualification and reliability monitoring) to evaluate long term reliability (which might be impacted by solder reflow). Committee(s): JC-14.1 Free download. Registration or login required.
CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPERATURES Status: Reaffirmed September 2019	JEP153A	Mar 2014
This document provides an industry standard method for characterization and monitoring thermal stress test oven temperatures. The procedures described in this document should be used to insure thermal stress test conditions are being achieved and maintained during various test procedures. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
HIGH TEMPERATURE STORAGE LIFE	JESD22-A103E.01	Jul 2021
The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices. The high temperature storage test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure mechanisms and time-to failure distributions of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). Thermally activated failure mechanisms are modeled using the Arrhenius Equation for acceleration. During the test, accelerated stress temperatures are used without electrical conditions applied. This test may be destructive, depending on time, temperature and packaging (if any). Committee(s): JC-14.1 Available for purchase: $55.00 Add to Cart To help cover the costs of producing standards, JEDEC is now charging for non-member access to selected standards and design files. Most of the content on this site remains free to download with registration. Paying JEDEC member companies enjoy free access to all content. Learn more and apply today. Paying JEDEC Members may login for free access.
RELIABILITY QUALIFICATION OF POWER AMPLIFIER MODULES Status: Reaffirmed October 2024	JESD237	Mar 2014
This standard is intended to identify a core set of qualification tests that apply specifically for Power Amplifier Modules and their primary application in mobile devices such as cellular phones. This standard is intended to describe specific stresses and failure mechanisms that are specific to compound semiconductors and power amplifier modules. It is intended to establish more meaningful and efficient qualification testing. Committee(s): JC-14.7 Free download. Registration or login required.
GUIDELINES FOR THE PACKING, HANDLING, AND REPACKING OF MOISTURE-SENSITIVE COMPONENTS - SUPERSEDED BY J-STD-033, May 1999. Status: RescindedNovember 1999	JEP124	Dec 1995
Committee(s): JC-14.4 Free download. Registration or login required.