Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 1 of 1 documents.
MECHANICAL COMPRESSIVE STATIC STRESS TEST METHOD
This test method is intended for customers to determine the ability of a device to withstand the mechanical compressive static stress generated when a heat sink is being initially attached to the device, and to help the customer generate design rules for their heat sink design and validate their thermal solution. This test method does not assess the long-term effects of static stress.