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TRANSIENT DUAL INTERFACE TEST METHOD FOR THE MEASUREMENT OF THE THERMAL RESISTANCE JUNCTION-TO-CASE OF SEMICONDUCTOR DEVICES WITH HEAT FLOW THROUGH A SINGLE PATH
This document specifies a test method (referred to herein as “Transient Dual Interface Measurement”) to determine the conductive thermal resistance “Junction-to-Case” RθJC (θJC) of semiconductor devices with a heat flow through a single path, i.e., semiconductor devices with a high conductive heat flow path from the die surface that is heated to a package case surface that can be cooled by contacting it to an external heat sink. TDIM Master Software: http://www.jedec.org/download/search/TDIM-Master-2011-04-06.zip