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STANDARD DESCRIPTION OF 1.2 V CMOS LOGIC DEVICES (NORMAL RANGE OPERATION):

 JESD76-2 Jun 2001

This standard defines dc interface, switching parameters and test loading for digital logic devices based on 1.2 V (normal range) power supply levels. The purpose is to provide a standard specification for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

Committee(s): JC-40

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STANDARD DATA TRANSFER FORMAT BETWEEN DATA PREPARATION SYSTEM AND PROGRAMMABLE LOGIC DEVICE PROGRAMMER:

 JESD3-C Jun 1994

This standard was developed to prevent the proliferation of data transfer formats that occurred with microprocessor development systems. The focus of the standard is on field programmable devices and their support tools. It is not intended for other types of semicustom logic devices or other types of fabrication or testing equipment.

Committee(s): JC-42.1

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Standard - TSOP-I, Thin Matrix Tray for Shipping and Handling. Item 11.4-437S.

 CS-008-A Mar 1996

Committee(s): JC-11, JC-11.5

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Standard - TSOP II, Thin Matrix Tray for Shipping and Handling of FBGA's. Item 11.5-519.

 CS-005-B Nov 1998

Committee(s): JC-11, JC-11.5

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Standard - TSOP II, 7.62 mm Body. Change to the Max. Bend Radius and Foot Angle. Item 11.11-518S

 MS-025-B

Committee(s): JC-11

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Standard - Thin Small Outline Package. TSOPII Package. This revision modifies leadframe thickness for 10.16 mm body SOIC family. Item 11.11-753(S)

 MS-024H Jun 2006

Committee(s): JC-11.11

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Standard - Thin Matrix Tray for TQFP.

 CS-007-A

Committee(s): JC-11

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Standard - Thin Matrix Tray for MQFP Shipping. Item 11.5-436S

 CS-004-B Apr 1996

Committee(s): JC-11, JC-11.5

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Standard - Thin Matrix Tray for Handling and Shipping PLCC Packages. Variations AA-AL. Item 11.5-312.

 CS-003-B Apr 1993

Committee(s): JC-11, JC-11.5

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Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Item 11.5-311.

 CS-002-A Mar 1993

Committee(s): JC-11, JC-11.5

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Standard - Tape Automated Bonding (TAB) Package Family. S-PQUC-X/TAB.

 US-001-B

Committee(s): JC-11

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Standard - Surface Mounted Header Family, 2 Leads, Peripheral Terminals. R-PSFM-G. Item 11.10-327S.

 TS-005-A

Committee(s): JC-11

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Standard - Square Plastic Chip Carrier Family, 1.27 mm/.050 inch Pitch. Item 11.11-252S.

 MS-018-A

Committee(s): JC-11

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Standard - SMT DDR3 DIMM Socket Coplanarity Measurement Gauge. Item 11.14-124.

 GS-009A Jan 2009

Committee(s): JC-11

JEP95 Registrations Main Page

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Standard - SMT DDR2 DIMM Socket, Coplanarity Measurement Gauge. Item 11.14-102.

 GS-006-A Jun 2007

Committee(s): JC-11

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Standard - Small Outline J-Lead (SOJ) Family, .400 inch Wide Body. PDSO-J. Item 11.11-404S

 MS-027-A

Committee(s): JC-11

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Standard - Single Layer Chip Carrier Family, .040 inch Terminal Spacing, Ceramic. Variations AA-AJ. Item 11.3-112.

 MS-014-A

Committee(s): JC-11

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Standard - Side Brazed Ceramic DIPs in .300 inch, .400 inch and .900 inch Center Line Row-to-Row Spacing. Item 11.10-272.

 MS-015-A

Committee(s): JC-11

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Standard - Plastic SOJ, .300 inch Body, .050 inch Lead Spacing. Item 11.11-330S.

 MS-023-A

Committee(s): JC-11

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Standard - Plastic Single-in-Line Flange-Mounted, 5 Leads. PSFM. Item 11.10-220.

 TS-001-A

Committee(s): JC-11

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Standard - Plastic DIP .600 inch Row Spacing, 48 Lead. Addition of Variation AD. Item 11.4-238.

 MS-011-B

Committee(s): JC-11

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Standard - Plastic DIP .400 inch Row Spacing, 28 and 32 Leads. Addition of Variations AC and AD. Item 11.11-306.

 MS-010-C

Committee(s): JC-11

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Standard - Plastic Chip Carrier (PCC) Family, 1.27 mm/0.050 inch Lead Spacing, Rectangular. Item 11.11-241.

 MS-016-A

Committee(s): JC-11

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Standard - Metric Tape Automated Bonding (TAB) Tape Carrier Family. (Supersedes CO-018). Item 11.11-353S

 CS-006-A

Committee(s): JC-11

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Standard - Metric Tape Automated Bonding (TAB) Magazine Family, 50, 100 Leads. Variations AA-AC. Replaces CO-017. Item 11.5-428S

 CS-001-B

Committee(s): JC-11

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Standard - Metric Plastic Quad Flat Pack 1.0,0.8,0.65 mm. Item 11.11-450S.

 MS-022-B

Committee(s): JC-11

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Standard - Low/Thin Profile Plastic Quad Flat Package, 2.00 mm Footprint, Optional Heat. Item 11.11-521S.

 MS-026-D Jan 2001

Clarification to note 15 of the Low Profile PQFP registration MS-026 as issue D. Item 11.11-577s

Committee(s): JC-11

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Standard - Header Family, Surface Mounted, Peripheral Terminals. R-PSFM-G2. Item 11.10-323S.

 TS-003-B

Committee(s): JC-11

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Standard - Header Family, Insertion Mount, Peripheral Terminals. Item 11.10-322S

 TS-002-A

Committee(s): JC-11

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Standard - Flange-Mounted Header Family. R-PSFM-F3. Item 11.10-326S.

 TS-004-A

Committee(s): JC-11

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Standard - Fine Pitch Plastic Quad Flat Package Outline 2.6 mm Footprint. Item 11.11-484S

 MS-029-A

Committee(s): JC-11

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STANDARD - FBDIMM Socket Insertion and Extraction Force Gauge. Item 11.14-083(S)

 GS-004A Oct 2006

Committee(s): JC-11

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Standard - Dual-In-Line Plastic Family .300 inch Row Spacing. R-PDIP-T. Item 11.11-271S

 MS-001-D

Committee(s): JC-11

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Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .750 inch Row Spacing. R-PDIP-T. Item 11.11-292S.

 MS-021-A

Committee(s): JC-11

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Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .600 inch Row Spacing. R-PDIP-T. Item 11.11-291S

 MS-020-B

Committee(s): JC-11

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Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .300 inch Row Spacing. R-PDIP-T. Item 11.11-290S.

 MS-019-B

Committee(s): JC-11

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STANDARD - Dual In-Line Gauge. (Ties with all Shrink P-DIPs). Variations AA-BD. Item 11.11-315.

 GS-003C Mar 1993

Committee(s): JC-11

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STANDARD - DDR5 288 Pin U/R/LR DIMM Connector Performance Standard, DDR5

 PS-005B Oct 2022

This standard defines the form, fit and function of DDR5 connectors for U/R/LR modules supporting channels with transfer rates up to 6.4 GT/S. It contains mechanical, electrical and reliability requirements for connector mated to a module with nominal thickness of 1.27 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the DDR5 connectors in client and server platforms. Item 11.14-213S

Committee(s): JC-11.14

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Standard - DDR4 DIMM Socket Insertion and Extraction Force Gauge

 GS-010C Nov 2017

Item 11.14-185

Committee(s): JC-11, JC-11.14

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Standard - DDR3 DIMM Socket Insertion and Extraction Force Gauge. Item 11.14-098

 GS-005A Jul 2006

Committee(s): JC-11

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Standard - DDR2 DIMM Socket Insertion and Extraction Force Gauge. Item 11.14-103.

 GS-007-A Jun 2007

Committee(s): JC-11

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Standard - Ceramic PGA .100 inch Pitch Cavity Down . Item 11.10-315.

 MS-017-B

Committee(s): JC-11

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Standard - Ceramic Dual-In-Line (CDIP) Family, .600 inch Row Spacing. Item 11.10-376S.

 MS-032-A

Committee(s): JC-11

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Standard - Ceramic Dual-In-Line (CDIP) Family, .400 inch Row Spacing. Item 11.10-375S.

 MS-031-A

Committee(s): JC-11

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Standard - Ceramic Dual-In-Line (CDIP) Family, .300 inch Row Spacing. Item 11.10-374S.

 MS-030-A

Committee(s): JC-11

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Standard - Ceramic Dual Flatpack (CerPak) Package Family, .050 inch Pitch. Item 11.10-382S.

 MS-033-A

Committee(s): JC-11

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Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA.

 MS-034G Jan 2017

Item No. 11.11-933 (S)
Item No. 11.11-723(S), Elevated MO-151 to Standard and included and increased Ax dimensions to allow for thicker packages.

Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581.

Committee(s): JC-11, JC-11.11

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Standard - Addition of Rectangular BGA Variations to BGA Family. Item 11.11-550s.

 MS-028-C

Committee(s): JC-11

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Standard - .050inch Center Leadless Chip Carrier, Type D. Variations DA-DH.

 MS-005-A

Committee(s): JC-11

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Standard - .050 inch Leadless Chip Carrier, Type B. Variation BA-BH.

 MS-003-A

Committee(s): JC-11

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Standard - .050 inch Leadless Chip Carrier, Type A. Variations AA-AH.

 MS-002-A

Committee(s): JC-11

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Standard - .050 inch Center Leadless Chip Carrier, Type C. Variations CA-CH. Item 11.10-237.

 MS-004-B

Committee(s): JC-11

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Standard - .050 inch Center Leaded Chip Carrier, 24 Terminal Leaded, Type A.

 MS-006-A

Committee(s): JC-11

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Standard - .050 inch Center Lead Chip Carrier, Type B. Variations BA-BH.

 MS-008-A

Committee(s): JC-11

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Standard - .050 inch Center Lead Chip Carrier, Type A. Variations AA-AH.

 MS-007-A

Committee(s): JC-11

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Standard - .040 inch Center Leadless Chip Carrier Packages. Variations AA-AJ.

 MS-009-A

Committee(s): JC-11

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SRAM Introduction

 SRAM3.7 Oct 2001

Release No. 11

Committee(s): JC-42.2

JESD21-C Solid State Memory Documents Main Page

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SPI Safety Extensions (CRC) for Non Volatile SPI Flash Memories (QPI and xSPI)

 JESD255 Mar 2024

The JESD255 document defines CRC modes supported with 8-bit aligned and 16-bit aligned data transactions. It is limited to logical bus transactions and does not cover the electrical properties of the IO bus.

Committee(s): JC-42, JC-42.4

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SPECIALITY DDR2-1066 SDRAM

 JESD208 Nov 2007

This document defines the Specialty DDR2-1066 SDRAM specification, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this Specification is to define the minimum set of requirements for JEDEC compliant 256 Mb through 4 Gb for x4, x8, and x16 Specialty DDR2-1066 SDRAM devices.

Committee(s): JC-42.3

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SPECIAL REQUIREMENTS FOR MAVERICK PRODUCT ELIMINATION AND OUTLIER MANAGEMENT

Status: Reaffirmed 		JESD50C Jan 2018

This standard applies to the identification and control of Maverick Product that can occur during fabrication, assembly, packaging, or test of any electronic component. It can be implemented for an entire product line or to segregate product that has a higher probability of adversely impacting quality or reliability.

Committee(s): JC-14, JC-14.3

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