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Title	Document #	Date
Registration - 3-Tier Family. PQFP-B. Item 11.11-473.	MO-198-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Small Outline J-Lead Package (LSOJ). Addition of 66 Lead Variation. Item 11.11-512.	MO-199-B
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Registration - Small Outline J-Lead Package Assembly 2 High/4 High Stack. Item 11.11-513.	MO-200-B
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Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496.	MO-202-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Thin Shrink Fine Pitch Small Outline No Lead (TFSON) Package. Item 11.11-507.	MO-209-A
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Registration - Rectangular Plastic Quad Flat Package, 1.0 mm Thick Body, 3.2 mm Footprint. Item 11.11-511.	MO-212-A
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Registration - Plastic Flange-Mounted Staggered Header Family, 7 & 9 Lead TO Style Package. Item 11.10-393	MO-218-A
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Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402.	MO-223-A
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Standard - .050 inch Leadless Chip Carrier, Type A. Variations AA-AH.	MS-002-A
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Standard - .050 inch Leadless Chip Carrier, Type B. Variation BA-BH.	MS-003-A
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Standard - .050 inch Center Leadless Chip Carrier, Type C. Variations CA-CH. Item 11.10-237.	MS-004-B
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Standard - .050 inch Center Leaded Chip Carrier, 24 Terminal Leaded, Type A.	MS-006-A
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Standard - .050inch Center Leadless Chip Carrier, Type D. Variations DA-DH.	MS-005-A
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Standard - .050 inch Center Lead Chip Carrier, Type B. Variations BA-BH.	MS-008-A
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Standard - .050 inch Center Lead Chip Carrier, Type A. Variations AA-AH.	MS-007-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic DIP .400 inch Row Spacing, 28 and 32 Leads. Addition of Variations AC and AD. Item 11.11-306.	MS-010-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .040 inch Center Leadless Chip Carrier Packages. Variations AA-AJ.	MS-009-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic DIP .600 inch Row Spacing, 48 Lead. Addition of Variation AD. Item 11.4-238.	MS-011-B
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Standard - Single Layer Chip Carrier Family, .040 inch Terminal Spacing, Ceramic. Variations AA-AJ. Item 11.3-112.	MS-014-A
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Standard - Side Brazed Ceramic DIPs in .300 inch, .400 inch and .900 inch Center Line Row-to-Row Spacing. Item 11.10-272.	MS-015-A
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Standard - Plastic Chip Carrier (PCC) Family, 1.27 mm/0.050 inch Lead Spacing, Rectangular. Item 11.11-241.	MS-016-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Square Plastic Chip Carrier Family, 1.27 mm/.050 inch Pitch. Item 11.11-252S.	MS-018-A
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Standard - Ceramic PGA .100 inch Pitch Cavity Down . Item 11.10-315.	MS-017-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .300 inch Row Spacing. R-PDIP-T. Item 11.11-290S.	MS-019-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .750 inch Row Spacing. R-PDIP-T. Item 11.11-292S.	MS-021-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .600 inch Row Spacing. R-PDIP-T. Item 11.11-291S	MS-020-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic SOJ, .300 inch Body, .050 inch Lead Spacing. Item 11.11-330S.	MS-023-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Metric Plastic Quad Flat Pack 1.0,0.8,0.65 mm. Item 11.11-450S.	MS-022-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - TSOP II, 7.62 mm Body. Change to the Max. Bend Radius and Foot Angle. Item 11.11-518S	MS-025-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Small Outline J-Lead (SOJ) Family, .400 inch Wide Body. PDSO-J. Item 11.11-404S	MS-027-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Fine Pitch Plastic Quad Flat Package Outline 2.6 mm Footprint. Item 11.11-484S	MS-029-A
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Standard - Addition of Rectangular BGA Variations to BGA Family. Item 11.11-550s.	MS-028-C
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Standard - Ceramic Dual-In-Line (CDIP) Family, .400 inch Row Spacing. Item 11.10-375S.	MS-031-A
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Standard - Ceramic Dual-In-Line (CDIP) Family, .300 inch Row Spacing. Item 11.10-374S.	MS-030-A
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Standard - Ceramic Dual Flatpack (CerPak) Package Family, .050 inch Pitch. Item 11.10-382S.	MS-033-A
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Standard - Ceramic Dual-In-Line (CDIP) Family, .600 inch Row Spacing. Item 11.10-376S.	MS-032-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Document Procedure.	SPP-001
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Pin #1 Mark Function and Location.	SPP-002
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Lead Finish and base Metal Specification.	SPP-004
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Pin #1 orientation for TAB Packages.	SPP-005
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Definition of DAMBAR Protrusion and Intrusion.	SPP-006
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - J Lead; Dimensioning of Lead Contact Points.	SPP-011
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Pin #1 Mark and Lead-Numbering Convention for Dual-In-Line Packages with Standard and Reverse-Bend Lead Form.	SPP-012
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Requirements for Applying Material and Finish Specifications to Selected Mechanical Outlines.	SPP-015
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Inactivation and Rescission.	SPP-016
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Procedure for Making Editorial Corrections to Published Documents.	SPP-018
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Disc Type Family. Variations AE-AF. Item 92-3/119.	TO-200-J
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flange-Mounted Header Family .430 inch Pin Spacing. Variations AA-AD. Ref. TO-3, TO-41.	TO-204-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Tape Automated Bonding (TAB) Mounted Family Peripheral Leads.	TO-202-F
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family, .100 Pin Circle. Variations AA-AG. Item 11.2-109.	TO-206-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family, .200 Pin Circle. Variations AA-AG. Item 11.2-109.	TO-205-E
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Stud Hex Base Family, Flexible Leads. Variations AA-AE. Ref. TO-49, TO-93, TO-94, TO108, TO-118.	TO-209-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Stud Hex Base Family, Solid Terminals. Variations AE-AG. Ref. TO-103.	TO-208-C
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Registration - Flange-Mounted Header Family, .200 Pin Spacing. Variations AA-AC. Ref. TO-66, TO-123, TO-124	TO-213-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Coaxial package Outline. Item 269G.	TO-215-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Stud-Mounted Stripline Header Family. Item 270G	TO-216-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flange-Mounted Header Family, Axial and Peripheral Leads. Variations AA-AD.	TO-218-E
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Registration - Flange-Mounted Header Family, Axial and Peripheral Leads. Variations AA-AB. Item 240-G.	TO-219-B
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Registration - Flange-Mounted Header Family, Rectangular Body. Variations AA-AC. Item 11.2-80-64/81-60.	TO-238-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Terminal Strip Family Power Module. Variations AA-AB.	TO-240-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - 3-Tier Family. PQFP-B. Item 11.11-473.

Registration - Low Profile Small Outline J-Lead Package (LSOJ). Addition of 66 Lead Variation. Item 11.11-512.

Registration - Small Outline J-Lead Package Assembly 2 High/4 High Stack. Item 11.11-513.

Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496.

Registration - Plastic Thin Shrink Fine Pitch Small Outline No Lead (TFSON) Package. Item 11.11-507.

Registration - Rectangular Plastic Quad Flat Package, 1.0 mm Thick Body, 3.2 mm Footprint. Item 11.11-511.

Registration - Plastic Flange-Mounted Staggered Header Family, 7 & 9 Lead TO Style Package. Item 11.10-393

Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402.

Standard - .050 inch Leadless Chip Carrier, Type A. Variations AA-AH.

Standard - .050 inch Leadless Chip Carrier, Type B. Variation BA-BH.

Standard - .050 inch Center Leadless Chip Carrier, Type C. Variations CA-CH. Item 11.10-237.

Standard - .050 inch Center Leaded Chip Carrier, 24 Terminal Leaded, Type A.

Standard - .050inch Center Leadless Chip Carrier, Type D. Variations DA-DH.

Standard - .050 inch Center Lead Chip Carrier, Type B. Variations BA-BH.

Standard - .050 inch Center Lead Chip Carrier, Type A. Variations AA-AH.

Standard - Plastic DIP .400 inch Row Spacing, 28 and 32 Leads. Addition of Variations AC and AD. Item 11.11-306.

Standard - .040 inch Center Leadless Chip Carrier Packages. Variations AA-AJ.

Standard - Plastic DIP .600 inch Row Spacing, 48 Lead. Addition of Variation AD. Item 11.4-238.

Standard - Single Layer Chip Carrier Family, .040 inch Terminal Spacing, Ceramic. Variations AA-AJ. Item 11.3-112.

Standard - Side Brazed Ceramic DIPs in .300 inch, .400 inch and .900 inch Center Line Row-to-Row Spacing. Item 11.10-272.

Standard - Plastic Chip Carrier (PCC) Family, 1.27 mm/0.050 inch Lead Spacing, Rectangular. Item 11.11-241.

Standard - Square Plastic Chip Carrier Family, 1.27 mm/.050 inch Pitch. Item 11.11-252S.

Standard - Ceramic PGA .100 inch Pitch Cavity Down . Item 11.10-315.

Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .300 inch Row Spacing. R-PDIP-T. Item 11.11-290S.

Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .750 inch Row Spacing. R-PDIP-T. Item 11.11-292S.

Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .600 inch Row Spacing. R-PDIP-T. Item 11.11-291S

Standard - Plastic SOJ, .300 inch Body, .050 inch Lead Spacing. Item 11.11-330S.

Standard - Metric Plastic Quad Flat Pack 1.0,0.8,0.65 mm. Item 11.11-450S.

Standard - TSOP II, 7.62 mm Body. Change to the Max. Bend Radius and Foot Angle. Item 11.11-518S

Standard - Small Outline J-Lead (SOJ) Family, .400 inch Wide Body. PDSO-J. Item 11.11-404S

Standard - Fine Pitch Plastic Quad Flat Package Outline 2.6 mm Footprint. Item 11.11-484S

Standard - Addition of Rectangular BGA Variations to BGA Family. Item 11.11-550s.

Standard - Ceramic Dual-In-Line (CDIP) Family, .400 inch Row Spacing. Item 11.10-375S.

Standard - Ceramic Dual-In-Line (CDIP) Family, .300 inch Row Spacing. Item 11.10-374S.

Standard - Ceramic Dual Flatpack (CerPak) Package Family, .050 inch Pitch. Item 11.10-382S.

Standard - Ceramic Dual-In-Line (CDIP) Family, .600 inch Row Spacing. Item 11.10-376S.

Standard Practices and Procedures - Document Procedure.

Standard Practices and Procedures - Pin #1 Mark Function and Location.

Standard Practices and Procedures - Lead Finish and base Metal Specification.

Standard Practices and Procedures - Pin #1 orientation for TAB Packages.

Standard Practices and Procedures - Definition of DAMBAR Protrusion and Intrusion.

Standard Practices and Procedures - J Lead; Dimensioning of Lead Contact Points.

Standard Practices and Procedures - Pin #1 Mark and Lead-Numbering Convention for Dual-In-Line Packages with Standard and Reverse-Bend Lead Form.

Standard Practices and Procedures - Requirements for Applying Material and Finish Specifications to Selected Mechanical Outlines.

Standard Practices and Procedures - Inactivation and Rescission.

Standard Practices and Procedures - Procedure for Making Editorial Corrections to Published Documents.

Registration - Disc Type Family. Variations AE-AF. Item 92-3/119.

Registration - Flange-Mounted Header Family .430 inch Pin Spacing. Variations AA-AD. Ref. TO-3, TO-41.

Registration - Tape Automated Bonding (TAB) Mounted Family Peripheral Leads.

Registration - Header Family, .100 Pin Circle. Variations AA-AG. Item 11.2-109.

Registration - Header Family, .200 Pin Circle. Variations AA-AG. Item 11.2-109.

Registration - Stud Hex Base Family, Flexible Leads. Variations AA-AE. Ref. TO-49, TO-93, TO-94, TO108, TO-118.

Registration - Stud Hex Base Family, Solid Terminals. Variations AE-AG. Ref. TO-103.

Registration - Flange-Mounted Header Family, .200 Pin Spacing. Variations AA-AC. Ref. TO-66, TO-123, TO-124

Registration - Coaxial package Outline. Item 269G.

Registration - Stud-Mounted Stripline Header Family. Item 270G

Registration - Flange-Mounted Header Family, Axial and Peripheral Leads. Variations AA-AD.

Registration - Flange-Mounted Header Family, Axial and Peripheral Leads. Variations AA-AB. Item 240-G.

Registration - Flange-Mounted Header Family, Rectangular Body. Variations AA-AC. Item 11.2-80-64/81-60.

Registration - Terminal Strip Family Power Module. Variations AA-AB.

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