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Title	Document #	Date
SOLID-STATE DRIVE (SSD) ENDURANCE WORKLOADS	JESD219A.01	Jun 2022
Terminology update, see Annex. This standard defines workloads for the endurance rating and endurance verification of SSD application classes. These workloads shall be used in conjunction with the Solid State Drive (SSD) Requirements and Endurance Test Method standard, JESD218. Also see JESD219A_MT and JESD219A_TT for the supporting trace files. Committee(s): JC-64, JC-64.8 Free download. Registration or login required.
SON/QFN PACKAGE PINOUTS STANDARDIZED FOR 1-, 2-, AND 3-BIT LOGIC FUNCTIONS	JESD75-5	Jul 2004
This standard defines device pinout for 1-, 2- and 3-bit wide logic functions. This pinout specifically applies to the conversion of Dual-Inline-Packaged (DIP) 1-, 2- and 3-bit logic devices to SON/QFN packaged 1-, 2- and 3-bit logic devices. The purpose of this document is to provide a pinout standard for 1-, 2- and 3-bit logic devices offered in 5-, 6- or 8-land SON/QFN packages for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Committee(s): JC-40, JC-40.1 Free download. Registration or login required.
SPD Annex A, Table of Memory Types	SPD4.1.2.1	Apr 2003
Release No.12 Committee(s): JC-42.5 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD Annex B, Table of Superset Memory Types	SPD4.1.2.2	Oct 2001
Release No.11 Committee(s): JC-42.5 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD Annex C, Fast Page and Extended Data Out RAM	SPD4.1.2.3	Jan 1998
Release No.8 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD Annex D, DDR Synchronous DRAM (DDR SDRAM)	SPD4.1.2.4	Jan 2004
Release No.13 Committee(s): JC-42, JC-42.5 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD Annex E, SDRAM	SPD4.1.2.5	May 2003
Release No. 12 Committee(s): JC-42.5 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD Annex F, Address Multiplexed ROM	SPD4.1.2.6	Jun 1998
Release No.8 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD Annex G, Serial Presence Detect for FBDIMM, Revision 1.1	SPD4.1.2.7	Jun 2006
Release No. 16A. Item 2003.02A Committee(s): JC-45 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD Annex H, ESDRAM Superset	SPD4.1.2.8	Jun 1999
Release No.9 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD Annex I, Serial Presence Detect for Virtual Channel SDRAM, Revision 2	SPD4.1.2.9	Jun 2006
Release No.9A Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD Annex J: Serial Presence Detect for DDR2 SDRAM	SPD4.1.2.10	Jan 2007
Release No. 17 Committee(s): JC-42, JC-45 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD Annex K - Serial Presence Detect (SPD) for DDR3 SDRAM Modules, Release 6	SPD4.1.2.11	Feb 2014
Release No. 24. Item 2065.47A Committee(s): JC-45 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD Annex L, Serial Presence Detect (SPD) for DDR4 SDRAM Modules, Release 4 Release Number: 27A	SPD4.1.2.L-4	Aug 2019
This annex describes the serial presence detect (SPD) values for all DDR4 modules covered in Document Release 4. Differences between module types are encapsulated in subsections of this annex. These presence detect values are those referenced in the SPD standard document for ‘Specific Features’. Item 2220.01G. This is an editorial revision to the publication in January 2017. Committee(s): JC-45 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules, Release 1 Release Number: 23	SPD4.1.2.L-1	Nov 2013
This annex describes the serial presence detect (SPD) values for all DDR4 modules covered in Document Release 1. Differences between module types are encapsulated in subsections of this annex. These presence detect values are those referenced in the SPD standard document for ‘Specific Features’. Item 2220.01 Committee(s): JC-45 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules, Release 2 Release Number: 23A	SPD4.1.2.L-2	Jan 2014
This annex describes the serial presence detect (SPD) values for all DDR4 modules covered in Document Release 2. Differences between module types are encapsulated in subsections of this annex. These presence detect values are those referenced in the SPD standard document for ‘Specific Features’. (This release is editorial changes only). Committee(s): JC-45 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules, Release 3 Release Number: 25	SPD4.1.2.L-3	Sep 2015
This annex describes the serial presence detect (SPD) values for all DDR4 modules. Differences between module types are encapsulated in subsections of this annex. These presence detect values are those referenced in the SPD standard document for ‘Specific Features’. The following SPD fields will be documented in the order presented in section 1.1 with the exception of bytes 128~255 which are documented in separate annexes, one for each family of module types. Further description of Byte 2 is found in Annex A of the SPD standard. Item 2220.01F. Committee(s): JC-45 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules, Release 5 Release Number: 29	SPD4.1.2.L-5	Aug 2019
This annex describes the serial presence detect (SPD) values for all DDR4 modules covered in Document Release 5. Differences between module types are encapsulated in subsections of this annex. These presence detect values are those referenced in the SPD standard document for ‘Specific Features’. Item 2276.05. Committee(s): JC-45 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules, Release 6 Release Number: 30	SPD4.1.2.L-6	Nov 2020
This annex describes the serial presence detect (SPD) values for all DDR4 modules covered in Document Release 6. Differences between module types are encapsulated in subsections of this annex. These presence detect values are those referenced in the SPD standard document for ‘Specific Features’. Item 2220.01H. Committee(s): JC-45 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD General Standard.	SPD4.1.2	Jul 2008
Release No. 19. Item 2065.26 Committee(s): JC-45 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
SPD5118 HUB and SERIAL PRESENCE DETECT DEVICE STANDARD Release Number: Version 1.5.1	JESD300-5B.01	May 2023
This standard defines the specifications of interface parameters, signaling protocols, and features for DDR5 Serial Presence Detect EEPROM with Hub function (SPD5 Hub) and integrated Temperature Sensor (TS) as used for memory module applications. The Hub feature allows isolation of a local bus from a Controller host bus. The designation SPD5118 or generic term SPD5 Hub refers to the devices specified by this standard. Committee(s): JC-40.1 Free download. Registration or login required.
SPECIAL REQUIREMENTS FOR MAVERICK PRODUCT ELIMINATION AND OUTLIER MANAGEMENT Status: Reaffirmed	JESD50C	Jan 2018
This standard applies to the identification and control of Maverick Product that can occur during fabrication, assembly, packaging, or test of any electronic component. It can be implemented for an entire product line or to segregate product that has a higher probability of adversely impacting quality or reliability. Committee(s): JC-14, JC-14.3 Free download. Registration or login required.
SPECIALITY DDR2-1066 SDRAM	JESD208	Nov 2007
This document defines the Specialty DDR2-1066 SDRAM specification, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this Specification is to define the minimum set of requirements for JEDEC compliant 256 Mb through 4 Gb for x4, x8, and x16 Specialty DDR2-1066 SDRAM devices. Committee(s): JC-42.3 Free download. Registration or login required.
SPI Safety Extensions (CRC) for Non Volatile SPI Flash Memories (QPI and xSPI)	JESD255	Mar 2024
The JESD255 document defines CRC modes supported with 8-bit aligned and 16-bit aligned data transactions. It is limited to logical bus transactions and does not cover the electrical properties of the IO bus. Committee(s): JC-42, JC-42.4 Free download. Registration or login required.
SRAM Introduction	SRAM3.7	Oct 2001
Release No. 11 Committee(s): JC-42.2 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Standard - .040 inch Center Leadless Chip Carrier Packages. Variations AA-AJ.	MS-009-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050 inch Center Lead Chip Carrier, Type A. Variations AA-AH.	MS-007-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050 inch Center Lead Chip Carrier, Type B. Variations BA-BH.	MS-008-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050 inch Center Leaded Chip Carrier, 24 Terminal Leaded, Type A.	MS-006-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050 inch Center Leadless Chip Carrier, Type C. Variations CA-CH. Item 11.10-237.	MS-004-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050 inch Leadless Chip Carrier, Type A. Variations AA-AH.	MS-002-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050 inch Leadless Chip Carrier, Type B. Variation BA-BH.	MS-003-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050inch Center Leadless Chip Carrier, Type D. Variations DA-DH.	MS-005-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Addition of Rectangular BGA Variations to BGA Family. Item 11.11-550s.	MS-028-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA.	MS-034G	Jan 2017
Item No. 11.11-933 (S) Item No. 11.11-723(S), Elevated MO-151 to Standard and included and increased Ax dimensions to allow for thicker packages. Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ceramic Dual Flatpack (CerPak) Package Family, .050 inch Pitch. Item 11.10-382S.	MS-033-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ceramic Dual-In-Line (CDIP) Family, .300 inch Row Spacing. Item 11.10-374S.	MS-030-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ceramic Dual-In-Line (CDIP) Family, .400 inch Row Spacing. Item 11.10-375S.	MS-031-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ceramic Dual-In-Line (CDIP) Family, .600 inch Row Spacing. Item 11.10-376S.	MS-032-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ceramic PGA .100 inch Pitch Cavity Down . Item 11.10-315.	MS-017-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - DDR2 DIMM Socket Insertion and Extraction Force Gauge. Item 11.14-103.	GS-007-A	Jun 2007
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - DDR3 DIMM Socket Insertion and Extraction Force Gauge. Item 11.14-098	GS-005A	Jul 2006
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - DDR4 DIMM Socket Insertion and Extraction Force Gauge	GS-010C	Nov 2017
Item 11.14-185 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
STANDARD - DDR5 288 Pin U/R/LR DIMM Connector Performance Standard, DDR5	PS-005B	Oct 2022
This standard defines the form, fit and function of DDR5 connectors for U/R/LR modules supporting channels with transfer rates up to 6.4 GT/S. It contains mechanical, electrical and reliability requirements for connector mated to a module with nominal thickness of 1.27 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the DDR5 connectors in client and server platforms. Item 11.14-213S Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
STANDARD - Dual In-Line Gauge. (Ties with all Shrink P-DIPs). Variations AA-BD. Item 11.11-315.	GS-003C	Mar 1993
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .300 inch Row Spacing. R-PDIP-T. Item 11.11-290S.	MS-019-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .600 inch Row Spacing. R-PDIP-T. Item 11.11-291S	MS-020-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .750 inch Row Spacing. R-PDIP-T. Item 11.11-292S.	MS-021-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Dual-In-Line Plastic Family .300 inch Row Spacing. R-PDIP-T. Item 11.11-271S	MS-001-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
STANDARD - FBDIMM Socket Insertion and Extraction Force Gauge. Item 11.14-083(S)	GS-004A	Oct 2006
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Fine Pitch Plastic Quad Flat Package Outline 2.6 mm Footprint. Item 11.11-484S	MS-029-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Flange-Mounted Header Family. R-PSFM-F3. Item 11.10-326S.	TS-004-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Header Family, Insertion Mount, Peripheral Terminals. Item 11.10-322S	TS-002-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Header Family, Surface Mounted, Peripheral Terminals. R-PSFM-G2. Item 11.10-323S.	TS-003-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Low/Thin Profile Plastic Quad Flat Package, 2.00 mm Footprint, Optional Heat. Item 11.11-521S.	MS-026-D	Jan 2001
Clarification to note 15 of the Low Profile PQFP registration MS-026 as issue D. Item 11.11-577s Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Metric Plastic Quad Flat Pack 1.0,0.8,0.65 mm. Item 11.11-450S.	MS-022-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Metric Tape Automated Bonding (TAB) Magazine Family, 50, 100 Leads. Variations AA-AC. Replaces CO-017. Item 11.5-428S	CS-001-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Metric Tape Automated Bonding (TAB) Tape Carrier Family. (Supersedes CO-018). Item 11.11-353S	CS-006-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic Chip Carrier (PCC) Family, 1.27 mm/0.050 inch Lead Spacing, Rectangular. Item 11.11-241.	MS-016-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic DIP .400 inch Row Spacing, 28 and 32 Leads. Addition of Variations AC and AD. Item 11.11-306.	MS-010-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

SOLID-STATE DRIVE (SSD) ENDURANCE WORKLOADS

SON/QFN PACKAGE PINOUTS STANDARDIZED FOR 1-, 2-, AND 3-BIT LOGIC FUNCTIONS

SPD Annex A, Table of Memory Types

SPD Annex B, Table of Superset Memory Types

SPD Annex C, Fast Page and Extended Data Out RAM

SPD Annex D, DDR Synchronous DRAM (DDR SDRAM)

SPD Annex E, SDRAM

SPD Annex F, Address Multiplexed ROM

SPD Annex G, Serial Presence Detect for FBDIMM, Revision 1.1

SPD Annex H, ESDRAM Superset

SPD Annex I, Serial Presence Detect for Virtual Channel SDRAM, Revision 2

SPD Annex J: Serial Presence Detect for DDR2 SDRAM

SPD Annex K - Serial Presence Detect (SPD) for DDR3 SDRAM Modules, Release 6

SPD Annex L, Serial Presence Detect (SPD) for DDR4 SDRAM Modules, Release 4

SPD Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules, Release 1

SPD Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules, Release 2

SPD Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules, Release 3

SPD Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules, Release 5

SPD Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules, Release 6

SPD General Standard.

SPD5118 HUB and SERIAL PRESENCE DETECT DEVICE STANDARD

SPECIAL REQUIREMENTS FOR MAVERICK PRODUCT ELIMINATION AND OUTLIER MANAGEMENT

SPECIALITY DDR2-1066 SDRAM

SPI Safety Extensions (CRC) for Non Volatile SPI Flash Memories (QPI and xSPI)

SRAM Introduction

Standard - .040 inch Center Leadless Chip Carrier Packages. Variations AA-AJ.

Standard - .050 inch Center Lead Chip Carrier, Type A. Variations AA-AH.

Standard - .050 inch Center Lead Chip Carrier, Type B. Variations BA-BH.

Standard - .050 inch Center Leaded Chip Carrier, 24 Terminal Leaded, Type A.

Standard - .050 inch Center Leadless Chip Carrier, Type C. Variations CA-CH. Item 11.10-237.

Standard - .050 inch Leadless Chip Carrier, Type A. Variations AA-AH.

Standard - .050 inch Leadless Chip Carrier, Type B. Variation BA-BH.

Standard - .050inch Center Leadless Chip Carrier, Type D. Variations DA-DH.

Standard - Addition of Rectangular BGA Variations to BGA Family. Item 11.11-550s.

Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA.

Standard - Ceramic Dual Flatpack (CerPak) Package Family, .050 inch Pitch. Item 11.10-382S.

Standard - Ceramic Dual-In-Line (CDIP) Family, .300 inch Row Spacing. Item 11.10-374S.

Standard - Ceramic Dual-In-Line (CDIP) Family, .400 inch Row Spacing. Item 11.10-375S.

Standard - Ceramic Dual-In-Line (CDIP) Family, .600 inch Row Spacing. Item 11.10-376S.

Standard - Ceramic PGA .100 inch Pitch Cavity Down . Item 11.10-315.

Standard - DDR2 DIMM Socket Insertion and Extraction Force Gauge. Item 11.14-103.

Standard - DDR3 DIMM Socket Insertion and Extraction Force Gauge. Item 11.14-098

Standard - DDR4 DIMM Socket Insertion and Extraction Force Gauge

STANDARD - DDR5 288 Pin U/R/LR DIMM Connector Performance Standard, DDR5

STANDARD - Dual In-Line Gauge. (Ties with all Shrink P-DIPs). Variations AA-BD. Item 11.11-315.

Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .300 inch Row Spacing. R-PDIP-T. Item 11.11-290S.

Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .600 inch Row Spacing. R-PDIP-T. Item 11.11-291S

Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .750 inch Row Spacing. R-PDIP-T. Item 11.11-292S.

Standard - Dual-In-Line Plastic Family .300 inch Row Spacing. R-PDIP-T. Item 11.11-271S

STANDARD - FBDIMM Socket Insertion and Extraction Force Gauge. Item 11.14-083(S)

Standard - Fine Pitch Plastic Quad Flat Package Outline 2.6 mm Footprint. Item 11.11-484S

Standard - Flange-Mounted Header Family. R-PSFM-F3. Item 11.10-326S.

Standard - Header Family, Insertion Mount, Peripheral Terminals. Item 11.10-322S

Standard - Header Family, Surface Mounted, Peripheral Terminals. R-PSFM-G2. Item 11.10-323S.

Standard - Low/Thin Profile Plastic Quad Flat Package, 2.00 mm Footprint, Optional Heat. Item 11.11-521S.

Standard - Metric Plastic Quad Flat Pack 1.0,0.8,0.65 mm. Item 11.11-450S.

Standard - Metric Tape Automated Bonding (TAB) Magazine Family, 50, 100 Leads. Variations AA-AC. Replaces CO-017. Item 11.5-428S

Standard - Metric Tape Automated Bonding (TAB) Tape Carrier Family. (Supersedes CO-018). Item 11.11-353S

Standard - Plastic Chip Carrier (PCC) Family, 1.27 mm/0.050 inch Lead Spacing, Rectangular. Item 11.11-241.

Standard - Plastic DIP .400 inch Row Spacing, 28 and 32 Leads. Addition of Variations AC and AD. Item 11.11-306.

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