Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
TEMPERATURE, BIAS, AND OPERATING LIFE |
JESD22-A108G | Nov 2022 |
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this document. Free download. Registration or login required. |
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Customer Notification for Environmental Compliance Declaration Deviations |
JESD262 | Nov 2022 |
This standard is invoked when a supplier becomes aware that a product’s environmental compliance declaration they provided or made available to their customers had an error that might cause a customer to draw an incorrect conclusion about the compliance of the product to legal requirements. Committee(s): JC-14.4 Free download. Registration or login required. |
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OVERVIEW OF METHODOLOGIES FOR THE THERMAL MEASUREMENT OF SINGLE- AND MULTI-CHIP, SINGLE- AND MULTI-PN-JUNCTION LIGHT-EMITTING DIODES (LEDS) |
JESD51-50A | Nov 2022 |
This document provides an overview of the methodology necessary for making meaningful thermal measurements on high-power light-emitting diodes (LEDs) built on single or multiple chips with one or more pn-junctions per chip. The actual methodology components are contained in separate detailed documents. Committee(s): JC-15 Free download. Registration or login required. |
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TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES |
JESD217A.01 | Nov 2022 |
This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures. Committee(s): JC-14.1 Free download. Registration or login required. |
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IMPLEMENTATION OF THE ELECTRICAL TEST METHOD FOR THE MEASUREMENT OF REAL THERMAL RESISTANCE AND IMPEDANCE OF LIGHT-EMITTING DIODES WITH EXPOSED COOLING SURFACE |
JESD51-51A | Nov 2022 |
The purpose of this document is to specify, how LEDs thermal metrics and other thermally-related data are best identified by physical measurements using well established testing procedures defined for thermal testing of packaged semiconductor devices (published and maintained by JEDEC) and defined for characterization of light sources (published and maintained by CIE – the International Commission on Illumination). Committee(s): JC-15 Free download. Registration or login required. |
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Serial NOR Security Hardware Abstraction Layer |
JESD261 | Nov 2022 |
This standard provides a comprehensive definition of the NOR cryptographic security hardware abstraction layer (HAL). It also provides design guidelines and reference software to reduce design-in overhead and facilitate the second sourcing of secure memory devices. It does not attempt to standardize any other interaction to the NOR device that is not related to cryptographic security functionality within the device. Committee(s): JC-42.4 Free download. Registration or login required. |
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SYSTEM LEVEL ESD Part III: Review of ESD Testing and Impact on System-Efficient ESD Design (SEED) |
JEP164 | Oct 2022 |
This white paper presents the recent knowledge of system ESD field events and air discharge testing methods. Testing experience with the IEC 61000-4-2 (2008) and the ISO 10605 ESD standards has shown a range of differing interpretations of the test method and its scope. This often results in misapplication of the test method and a high test result uncertainty. This white paper aims to explain the problems observed and to suggest improvements to the ESD test standard and to enable a correlation with a SEED IC/PCB co-design methodology. Committee(s): JC-14.3 Free download. Registration or login required. |
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STANDARD - DDR5 288 Pin U/R/LR DIMM Connector Performance Standard, DDR5 |
PS-005B | Oct 2022 |
This standard defines the form, fit and function of DDR5 connectors for U/R/LR modules supporting channels with transfer rates up to 6.4 GT/S. It contains mechanical, electrical and reliability requirements for connector mated to a module with nominal thickness of 1.27 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the DDR5 connectors in client and server platforms. Item 11.14-213S Committee(s): JC-11.14 Free download. Registration or login required. |
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TERMS, DEFINITIONS AND UNITS GLOSSARY FOR LED THERMAL TESTING |
JESD51-53A | Oct 2022 |
This document provides a unified collection of the commonly used terms and definitions in the area of LED thermal measurements. The terms and definitions provided herein extend beyond those used in the JESD51 family of documents, especially in JESD51-13, in order to include other often used terms and definitions in the area of light output measurements of LEDs. Definitions, symbols and notations regarding light output measurements used here are consistent with those defined in JESD77C.01 and with those defined by CIE (International Commission on Illumination), especially in the International Lighting Vocabulary, CIE S 017/E:2011 ILV and in the CIE 127-2007 document as well as in some other relevant standards of other standardization bodies from the solid-state lighting industry, e.g., ANSI/IESNA RP 16-05. Committee(s): JC-15 Free download. Registration or login required. |
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PMIC5100 POWER MANAGEMENT IC STANDARD, Rev 1.03 |
JESD301-2 | Oct 2022 |
This standard defines the specification of interface parameters, signaling protocols, and features for PMIC devices used for memory module applications. The designation PMIC5100 refers to the device specified by this document. The purpose is to provide a standard for the PMIC5100 device for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Item 336.01C Committee(s): JC-40.1 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid Array Ball, 0.80 mm X 0.65 mm Pitch Rectangular Family Package |
MO-311F | Oct 2022 |
Designator: PBGA-B#[#]_I0p65... Committee(s): JC-11.11 Free download. Registration or login required. |
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TEST METHOD FOR ESTABLISHING X-RAY TOTAL DOSE LIMIT FOR DRAM DEVICES |
JESD22-B130 | Sep 2022 |
This test method is offered as a standardized procedure to determine the total dose limit of DRAMs by measuring its refresh time tRef degradation after the device is irradiated with an X-Ray dose. This test method is applicable to any packaged device that contains a DRAM die or any embedded DRAM structure. Some indirect test methods such as wafer level characterization of total dose induced changes in leakage of access transistors are not described in this standard but are permissible as long as a good correlation is established. Committee(s): JC-14.1 Free download. Registration or login required. |
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Guideline for Evaluating dv/dt Robustness of SiC Power Devices, Version 1.0 |
JEP190 | Aug 2022 |
This document provides stress procedures, general failure criteria and documentation guidelines such that the dv/dt robustness can be demonstrated, evaluated and documented. This document gives examples for test setups which can be used and the corresponding test conditions. Additionally, criteria are explained under which device manufacturers can select an appropriate test setup. Committee(s): JC-70.2 Free download. Registration or login required. |
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POD15 - 1.5 V PSEUDO OPEN DRAIN I/O |
JESD8-20A.01 | Aug 2022 |
Terminology Update. This standard defines the dc and ac single-ended (data) and differential (clock) operating conditions, I/O impedance, and the termination and calibration scheme for 1.5 V Pseudo Open Drain I/Os. The 1.5 V Pseudo Open Drain interface, also known as POD15, is primarily used to communicate with GDDR4 and GDDR5 SGRAM devices. Item 135.01 Committee(s): JC-16 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid Array Ball, 0.75 MM x 0.73 MM Pitch Rectangular Family Package |
MO-353A | Aug 2022 |
Item 11-993 Designator: PBGA-B#[#]_I0p73... Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Multi Connector 32 Pin, 1.00 MM Pitch 19.35 MM x 21.00 MM Socket |
SO-031A | Aug 2022 |
Item 11.14-209A Designator: PMXC-G32[39]_1p0-R19p35x21p0Z3p2-N23p4T# Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - Silicon Bottom Grid Array Column, 0.048 mm x 0.055 mm Pitch Square Package |
MO-349A.01 | Aug 2022 |
Item: 11.4-996E Designator: SBGA-M7775[23828]_D0p073...
Item: 11.4-996 Access STP Files for MO-349A Cross Reference: DR4.26 Committee(s): JC-11.4 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid Array Ball, 0.65 MM Pitch Rectangular Family Package |
MO-246I | Aug 2022 |
Designator: PBGA-B#[#]_I0p65... Item: 11.11-1024, Access STP Files for MO-246I Cross Reference: N/A
Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Multi Flange Mount Rectangular Family |
TO-247F | Aug 2022 |
Item 11.10-460 Designator: PMFM K#_I... Committee(s): JC-11.10 Free download. Registration or login required. |
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Universal Flash Storage (UFS) File Based Optimizations (FBO) Extension, Version 1.0Status: Superseded |
JESD231 | Aug 2022 |
JESD231 was superseded by the renumbered JESD220-4 Version 1.01. Committee(s): JC-64.1 |
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DDR5 SODIMM Raw Card Annex B. Version 1.0 |
JESD309-S0-RCB | Aug 2022 |
This annex JESD309-S0-RCB, DDR5 Small Outline Dual Inline Memory Module with 0-bit ECC (EC0 SODIMM) Raw Card B Annex" defines the design detail of x8, 2 Package Ranks DDR5 NECC SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard. Committee(s): JC-45.3 Free download. Registration or login required. |
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Universal Flash Storage Host Controller Interface (UFSHCI), Version 4.0Status: Superseded December 2024 by JESD223F |
JESD223E | Aug 2022 |
NOTE: This document has been superseded by JESD223F published in December 2024, but remains available for reference purposes. Committee(s): JC-64.1 Available for purchase: $163.00 Add to Cart Paying JEDEC Members may login for free access. |
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UNIVERSAL FLASH STORAGE, Version 4.0Status: Superseded December 2024 by JESD220G |
JESD220F | Aug 2022 |
NOTE: This document has been superseded by JESD220G published in December 2024, but remains available for reference purposes.
Committee(s): JC-64.1 Available for purchase: $369.00 Add to Cart Paying JEDEC Members may login for free access. |
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LONG-TERM STORAGE GUIDELINES FOR ELECTRONIC SOLID-STATE WAFERS, DICE, AND DEVICES |
JEP160A | Aug 2022 |
This publication examines the LTS requirements of wafers, dice, and packaged solid-state devices. The user should evaluate and choose the best practices to ensure their product will maintain as-received device integrity and minimize age- and storage-related degradation effects. Free download. Registration or login required. |
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DDR5 UDIMM Raw Card Annex BRelease Number: Version 1.0 |
JESD308-U0-RCB | Jul 2022 |
This annex JESD308-U0-RCB, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Raw Card B Annex defines the design detail of x8, 2 Package Ranks DDR5 UDIMM. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard. Item 2265.11A Committee(s): JC-45.3 Free download. Registration or login required. |
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DDR5 UDIMM Raw Card Annex ERelease Number: Version 1.0 |
JESD308-U4-RCE | Jul 2022 |
This annex JESD308-U4-RCE, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) with 4-bit ECC (EC4 SODIMM) Raw Card E Annex" defines the design detail of x8, 2 Package Ranks DDR5 ECC UDIMM. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard. Item 2265.12A Committee(s): JC-45.3 Free download. Registration or login required. |
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DDR5 UDIMM Raw Card Annex ARelease Number: Version 1.0 |
JESD308-U0-RCA | Jul 2022 |
This annex JESD308-U0-RCA, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Raw Card A Annex defines the design detail of x8, 1 Package Rank DDR5 UDIMM. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard. Item 2265.13A Committee(s): JC-45.3 Free download. Registration or login required. |
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DDR5 UDIMM Raw Card Annex ARelease Number: Version 1.0 |
JESD308-U0-RCA | Jul 2022 |
This annex JESD308-U0-RCA, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Raw Card A Annex defines the design detail of x8, 1 Package Rank DDR5 UDIMM. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard. Item 2265.13A Committee(s): JC-45.3 Free download. Registration or login required. |
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DDR5 UDIMM Raw Card Annex DRelease Number: Version 1.0 |
JESD308-U4-RCD | Jul 2022 |
This annex JESD308-U4-RCD, DDR5 Unbuffered Dual Inline Memory Module with 4-bit ECC (EC4 UDIMM) Raw Card D Annex defines the design detail of x8, 1 Package Rank DDR5 UDIMM with 4-bit ECC. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard. Item 2265.14A Free download. Registration or login required. |
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DDR5 UDIMM Raw Card Annex CRelease Number: Version 1.0 |
JESD308-U0-RCC | Jul 2022 |
This annex JESD308-U0-RCC, “DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Raw Card C Annex” defines the design detail of x16, 1 Package Ranks DDR5 UDIMM. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard. Item 2265.08A Committee(s): JC-45.3 Free download. Registration or login required. |
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Registration - Plastic Dual Small Outline, 1.00 MM pitch5.48 MM width Rectangular Family Package |
MO-351A | Jun 2022 |
PDSO-G10_I1p)... Item 11.11-1005 Committee(s): JC-11.11 Free download. Registration or login required. |
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POD125 - 1.25 V PSEUDO OPEN DRAIN I/O |
JESD8-30A.01 | Jun 2022 |
Editorial Terminology Update. This standard defines the DC and AC single-ended (data) and differential (clock) operating conditions, I/O impedances, and the termination and calibration scheme for 1.25 V Pseudo Open Drain I/Os. The 1.25 V Pseudo Open Drain interface, also known as POD125, is primarily used to communicate with GDDR6 SGRAM devices. Committee(s): JC-16 Free download. Registration or login required. |
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POD135 - 1.35 V PSEUDO OPEN DRAIN I/O |
JESD8-21C.01 | Jun 2022 |
Editorial, Terminology Update. This standard defines the dc and ac single-ended (data) and differential (clock) operating conditions, I/O impedance's, and the termination and calibration scheme for 1.35 V Pseudo Open Drain I/Os. The 1.35 V Pseudo Open Drain interface, also known as POD135, is primarily used to communicate with GDDR5 or GDDR5M SGRAM devices. Item 146.01B Committee(s): JC-16 Free download. Registration or login required. |
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DDR5 SODIMM Raw Card Annex E |
JESD309-S4-RCE | Jun 2022 |
This annex JESD309-S4-RCE, DDR5 Small Outline Dual Inline Memory Module with 4-bit ECC (EC4SODIMM) Raw Card E Annex" defines the design detail of x8, 2 Package Ranks DDR5 ECC SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard. Free download. Registration or login required. |
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DDR5 SODIMM Raw Card Annex C Version 1 |
JESD309-S0-RCC | Jun 2022 |
This annex JESD309-S0-RCC, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Raw Card Free download. Registration or login required. |
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DDR5 SODIMM Raw Card Annex A Version 1 |
JESD309-S0-RCA | Jun 2022 |
This annex JESD309-S0-RCA, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Raw Card A Annex defines the design detail of x8, 1 Package Rank DDR5 SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard. Free download. Registration or login required. |
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DDR5 SODIMM Raw Card Annex D Version 1.0 |
JESD309-S4-RCD | Jun 2022 |
This annex JESD309-S4-RCD, DDR5 Small Outline Dual Inline Memory Module with 4-bit ECC (EC4 SODIMM) Raw Card D Annex defines the design detail of x8, 1 Package Rank DDR5 SODIMM with 4-bit ECC. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard. Committee(s): JC-45.3 Free download. Registration or login required. |
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JEDEC COMMITTEE SPECIFIC ADDITIONAL POLICIES |
JM12B | Jun 2022 |
In some cases, JEDEC Committees have established additional policies and guidelines to facilitate the operation of a particular committee. Additional policies and guidelines are set forth here as an addendum to JM21 to facilitate the operation of particular committees. These policies are in addition to the requirements set forth in JM21 and in no case shall these additions contradict or supersede the requirements in JM21. Committee(s): JC-JEDC Free download. Registration or login required. |
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SOLID-STATE DRIVE (SSD) ENDURANCE WORKLOADS |
JESD219A.01 | Jun 2022 |
Terminology update, see Annex. This standard defines workloads for the endurance rating and endurance verification of SSD application classes. These workloads shall be used in conjunction with the Solid State Drive (SSD) Requirements and Endurance Test Method standard, JESD218. Also see JESD219A_MT and JESD219A_TT for the supporting trace files. Free download. Registration or login required. |
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DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard |
JESD309 | May 2022 |
This standard defines the electrical and mechanical requirements for 262-pin, 1.1 V (VDD), Small Outline, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR5 SDRAM SODIMMs). These DDR5 SODIMMs are intended for use as main memory when installed in Computers, laptops and other systems. Item 2262.06B Free download. Registration or login required. |
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EXPANDED SERIAL PERIPHERAL INTERFACE (xSPI) FOR NONVOLATILE MEMORY DEVICES |
JESD251C | May 2022 |
This standard specifies the eXpanded Serial Peripheral Interface (xSPI) for Non Volatile Memory Devices, which provides high data throughput, low signal count, and limited backward compatibility with legacy Serial Peripheral Interface (SPI) devices. It is primarily for use in computing, automotive, Internet Of Things (IOT), embedded systems and mobile systems, between host processing and peripheral devices. The xSPI electrical interface can deliver up to 400 MBytes per second raw data throughput. Item 1775.74. Committee(s): JC-42.4 Free download. Registration or login required. |
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Definition of the EE1002 and EE1002A Serial Presence Detect (SPD) EEPROMs |
SPD4.1.3-01 | May 2022 |
Release No. 19.01. Item 1739.02E, Terminology update. This standard defines the specifications of interface parameters, signaling protocols, and features for Serial Presence Detect (SPD) EEPROMs as used for memory module applications. JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Mobile Platform Memory Module Thermal Sensor Component Specification |
MODULE4.7 | May 2022 |
Release No. 16. This replaces Release 15 and includes the following editorial changes: 1) Replaced master/slave with controller/target 2) Checked for presence of other sensitive words 3) Added Tables and Figures in Table of Contents (Release 15, Item 1640.07) Committee(s): JC-42.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Definitions of the EE1004-v 4 Kbit Serial Presence Detect (SPD) EEPROM and TSE2004av 4 Kbit SPD EEPROM with Temperature Sensor (TS) for Memory Module Applications |
SPD4.1.6-01 | May 2022 |
Release 26.01, Terminology update This standard defines the specifications of interface parameters, signaling protocols, and features for Serial Presence Detect (SPD) EEPROM (EE) and Temperature Sensor (TS) as used for memory module applications. Committee(s): JC-42.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Definition of the TSE2002av Serial Presence Detect (SPD) EEPROM with Temperature Sensor (TS) for Memory Module Applications |
SPD4.1.4-01 | May 2022 |
Release No. 21.01, Terminology update. This standard defines the specifications of interface parameters, signaling protocols, and features for Serial Presence Detect (SPD) EEPROMs and Temperature Sensor (TS) as used for memory module applications. The designation TSE2002av refers to the family of devices specified by this document. Committee(s): JC-42.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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EXTERNAL VISUAL |
JESD22-B101D | Apr 2022 |
External visual inspection is an examination of the external surfaces, construction, marking, and workmanship of a finished package or component. External visual is a noninvasive and nondestructive test. It is functional for qualification, quality monitoring, and lot acceptance. Committee(s): JC-14.1 Free download. Registration or login required. |
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RECOMMENDED ESD-CDM TARGET LEVELS |
JEP157A | Apr 2022 |
This document was written with the intent to provide information for quality organizations in both semiconductor companies and their customers to assess and make decisions on safe ESD CDM level requirements. Free download. Registration or login required. |
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DDR5 RDIMM Standard Annex ERelease Number: Version 1.0 |
JESD305-R8-RCE | Apr 2022 |
This standard, JESD305-R8-RCE, DDR5 Registered Dual Inline Memory Module with 8-bit ECC (EC8 RDIMM) Raw Card E Annex, defines the design detail of x8, 2 Package Ranks DDR5 RDIMM with 8-bit ECC. The common feature of DDR5 RDIMM, such as the connector pinout, can be found in the JESD305, DDR5 Load Reduced (LRDIMM) and Registered Dual Inline Memory Module (RDIMM) Common Standard. Item 2273.13. Committee(s): JC-45.1 Free download. Registration or login required. |
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DDR5 RDIMM Standard, Annex FRelease Number: Version 1.0 |
JESD305-R4-RCF | Apr 2022 |
This standard, JESD305-R4-RCF, DDR5 Registered Dual Inline Memory Module with 4-bit ECC (EC4 RDIMM) Raw Card F Annex, defines the design detail of x4, 1 Package Rank DDR5 RDIMM with 4-bit ECC. The common feature of DDR5 RDIMM, such as the connector pinout, can be found in the JESD305, DDR5 Load Reduced (LRDIMM) and Registered Dual Inline Memory Module (RDIMM) Common Standard. Item 2273.10. Committee(s): JC-45.1 Free download. Registration or login required. |
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DDR5 RDIMM Standard, Annex CRelease Number: Version 1.0 |
JESD305-R8-RCC | Apr 2022 |
This standard, JESD305-R8-RCC, DDR5 Registered Dual Inline Memory Module with 8-bit ECC (EC8 RDIMM) Raw Card C Annex, defines the design detail of x4, 1 Package Rank DDR5 RDIMM with 8-bit ECC. The common feature of DDR5 RDIMM, such as the connector pinout, can be found in the JESD305, DDR5 Load Reduced (LRDIMM) and Registered Dual Inline Memory Module (RDIMM) Common Standard. Item 2273.12. Committee(s): JC-45.1 Free download. Registration or login required. |
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BYTE ADDRESSABLE ENERGY BACKED INTERFACE |
JESD245E | Apr 2022 |
This standard specifies the host and device interface for a DDR4 NVDIMM-N, which is a DIMM that achieves non-volatility by copying SDRAM contents into non-volatile memory (NVM) when host power is lost using an Energy Source managed by either the module or the host. This standard is used in conjunction with JESD248. Item 2233.54G Committee(s): JC-45.6 Free download. Registration or login required. |
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DDR5 RDIMM Standard Annex DRelease Number: Version 1.0 |
JESD305-R8-RCD | Apr 2022 |
This standard, JESD305-R8-RCD, DDR5 Registered Dual Inline Memory Module with 8-bit ECC (EC8 RDIMM) Raw Card D Annex, defines the design detail of x8, 1 Package Rank DDR5 RDIMM with 8-bit ECC. The common feature of DDR5 RDIMM, such as the connector pinout, can be found in the JESD305, DDR5 Load Reduced (LRDIMM) and Registered Dual Inline Memory Module (RDIMM) Common Standard. Item 2273.03 Committee(s): JC-45.1 Free download. Registration or login required. |
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DDR5 RDIMM Standard Annex BRelease Number: Version 1.0 |
JESD305-R4-RCB | Apr 2022 |
This standard, JESD305-R4-RCB, DDR5 Registered Dual Inline Memory Module with 4-bit ECC (EC4 RDIMM) Raw Card B Annex, defines the design detail of x4, 2 Package Ranks DDR5 RDIMM with 4-bit ECC. The common feature of DDR5 RDIMM, such as the connector pinout, can be found in the JESD305, DDR5 Load Reduced (LRDIMM) and Registered Dual Inline Memory Module (RDIMM) Common Standard. Item 2273.14. Committee(s): JC-45.1 Free download. Registration or login required. |
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DDR5 RDIMM Standard Annex ARelease Number: Version 1.0 |
JESD305-R8-RCA | Mar 2022 |
Item 2273.16 Committee(s): JC-45.1 Free download. Registration or login required. |
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METHOD FOR DEVELOPING ACCELERATION MODELS FOR ELECTRONIC DEVICE FAILURE MECHANISMS |
JESD91B | Mar 2022 |
The method described in this document applies to all reliability mechanisms associated with electronic devices. The purpose of this standard is to provide a reference for developing acceleration models for defect-related and wear-out mechanisms in electronic devices. Committee(s): JC-14.3 Free download. Registration or login required. |
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Annex F, R/C F, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Registered DIMM Design SpecificationRelease Number: 31 |
MODULE4.20.28.F | Mar 2022 |
This specification defines the electrical and mechanical requirements for Raw Card F, 288-pin, 1.2 Volt (VDD), Registered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM RDIMMs). These DDR4 Registered DIMMs (RDIMMs) are intended for use as main memory when installed in PCs. Item 2241.11B JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Annex D, Raw Card D, in 260-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM SODIMM Design SpecificationRelease Number: 31 |
MODULE4.20.25.D | Mar 2022 |
This specification defines the electrical and mechanical requirements for Raw Card D, 260-pin, 1.2 Volt (VDD), Small Outline, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM SO-DIMMs). These DDR4 SO-DIMMs are intended for use as main memory when installed in PCs, laptops, and other systems. Item 2228.60. Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Registration - Plastic Dual Small Outline Surface, 2 Terminal, Wettable Flank Package |
MO-343B | Mar 2022 |
Designator: PDSO-N2-I#-R#x#Z#-CturET0p04
Item: 11.11-1000, Access STP File for MO-343B
Cross Reference: DG4.20
Patents(): Nexperia BV: US8809121 B2 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Dual Connector |
SO-025B | Mar 2022 |
Designator: PDXC-PP2-I8p9-R107p6xp15Z26p0-DD2p95x1p1
Item: 11.14-208, Access STP Files for SO-025B Cross Reference: TBD Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - Enclosure Form Factor for Automotive SSD Connector, Board Mount |
SO-030A | Feb 2022 |
Designator: PBCX-K4_...
Item: 11.14-211,
Access STP Files for SO-030A Cross Reference: MO-348 Committee(s): JC-11.14 Free download. Registration or login required. |
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