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This document describes design of test structures needed to assess the reliability of aluminum-copper, refractory metal barrier interconnect systems. This includes any metal interconnect system where a refractory metal barrier or other barrier material prevents the flow of aluminum and/or copper metal ions from moving between interconnect layers. This document is not intended to show design of test structures to assess aluminum or aluminum-copper alloy systems, without barriers to Al and Cu ion movement, nor for Cu only metal systems. Some total interconnect systems might not include barrier materials on all metal layers. The structures in this standard are designed for cases where a barrier material separates two Al or Al alloy metal layers. The purpose of this document is to describe the design of test structures needed to assess electromigration (EM) and stress-induced-void (SIV) reliability of AlCu barrier metal systems.

Committee(s): JC-14.2, JC-14.21

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Designator: N/A
Item: 11.5-1001, Access STP File for CO-038A
Cross Reference: N/A

Committee(s): JC-11.5

JEP95 Registrations Main Page

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This standard defines the specifications of interface parameters, signaling protocols, and features for PMIC device as

used for memory module applications. The designation PMIC5000, PMIC5010 refers to the device specified by this document. The purpose is to provide a standard for the PMIC5000, PMIC5010 device for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

Committee(s): JC-40.1

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Designator: PQFP-E#_I0p65-R...
Item: 11.11-1028
Cross Reference: N/A

Committee(s): JC-11.11

JEP95 Registrations Main Page

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Terminology update.  

This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTUB32869 registered buffer with parity for driving heavy load on high density DDR2 RDIMM applications. A typical application would be a 36 SDRAM planar DIMM.

Committee(s): JC-40

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Terminology update.  

This document establishes an interface standard for the data path and control plane interface functions for an RFIC component and/or a BBIC component.

Committee(s): JC-61

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Terminology update.   

This legacy document is a comprehensive users’ guide for silicon rectifier diode applications.

Committee(s): JC-22.2

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Terminology update.  

This document sets forth the best judgment of the standards of conduct and legal restraints that must be observed to protect against violations of the law.

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Terminology update.  

This standard establishes the requirements for an interface between Radio Front End (RF) and Baseband (BB) integrated circuits (IC).

Committee(s): JC-61

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Designator: PBGA-B#[#}_I0p4...
Item: 11.11-1006E (Minor editorial Change), Access STP File for MO-352A.01
Cross Reference: N/A

Committee(s): JC-11.11

JEP95 Registrations Main Page

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This specification defines the electrical and mechanical requirements for Raw Card F, 288-pin, 1.2 Volt (VDD), Unbuffered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM UDIMMs). These DDR4 Unbuffered DIMMs (UDIMMs) are intended for use as main memory when installed in PCs. Item 2231.43.

Committee(s): JC-45.3

JESD21-C Solid State Memory Documents Main Page

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This standard defines specifications of DC interface parameters, switching parameters, and test loading for definition of the DDR5 Registering Clock Driver (RCD) with parity for driving address and control nets on DDR5 RDIMM and LRDIMM applications. The DDR5RCD02 Device ID is DID = 0x0052.

Committee(s): JC-40, JC-40.4

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This document provides guidelines for evaluating gate reliability and lifetime testing for silicon carbide (SiC) based power devices with a gate oxide or gate dielectric.

Committee(s): JC-70, JC-70.2

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(Terminology update.)  

This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTUA32S868 and SSTUA32D868 registered buffer with parity test for DDR2 RDIMM applications.

Committee(s): JC-40, JC-40.3

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Terminology update.
This device is a one-chip spectrum analyzer that operates in the frequency range from 1 to 2 GHz.It requires no external components except some filtering of the voltage supply (one inductor, one bypass capacitor).
The frequency of the VCO is adjusted by an internal DAC. No PLL loop is used to lock the VCO to a reference frequency. A counter is used to determine the VCO frequency.

Committee(s): JC-40, JC-40.4

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Terminology update.
This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTE32882 registered buffer with parity for driving address and control nets on DDR3/DDR3L/DDR3U RDIMM applications.

The purpose is to provide a standard for the SSTE32882 (see Note) logic device, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

Committee(s): JC-40, JC-40.3, JC-40.4

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Terminology update.
This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTVN16857 14-bit SSTL_2 registered buffer for PC1600, PC2100, PC2700, and PC3200 DDR DIMM applications.

Committee(s): JC-40, JC-40.3

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Terminology update.

This document defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the DDR4 Registering Clock Driver (RCD) with parity for driving address and control nets on DDR4 RDIMM and LRDIMM applications.

Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office.

Committee(s): JC-40.4

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Terminology update.
This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of the SSTUB32866 registered buffer with parity test for DDR2 RDIMM applications.

Committee(s): JC-40

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Terminology update. 
This document defines the Graphics Double Data Rate 5 (GDDR5) Synchronous Graphics Random Access Memory (SGRAM), including features, functionality, package, and pin assignments. The purpose of this Standard is to define the minimum set of requirements for JEDEC standard compatible 512 Mb through 8 Gb x32 GDDR5 SGRAM devices. System designs based on the required aspects of this standard will be supported by all GDDR5 SGRAM vendors providing JEDEC standard compatible devices. Some aspects of the GDDR5 standard such as AC timings and capacitance values were not standardized. Some features are optional and therefore may vary among vendors. In all cases, vendor data sheets should be consulted for specifics. Item 1733.70B

Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office.

Committee(s): JC-42.3C

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This report only covers the procedures and requirements specified in ANSI/ESDA/JEDEC JS-002.

Committee(s): JC-14, JC-14.1

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The HBM3 DRAM is tightly coupled to the host compute die with a distributed interface. The interface is divided into independent channels. Each channel is completely independent of one another. Channels are not necessarily synchronous to each other. The HBM3 DRAM uses a wide-interface architecture to achieve high-speed, low power operation. Each channel interface maintains a 64 bit data bus operating at double data rate (DDR).

Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office.

Committee(s): JC-42, JC-42.2

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This publication defines a QGS, TOT, QGD and QGS, TH which can be extracted from a measured QG waveform for SiC MOSFETs.

Committee(s): JC-70, JC-70.2

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This is a re-publication of a white paper which reports on a survey that has been conducted to better understand how the latch-up standard JESD78 revision E (JESD78E) is interpreted and has been used in the industry.

Committee(s): JC-14, JC-14.1

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The purpose of this standard is to identify the classification level of non-hermetic SMDs that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.

Committee(s): JC-14, JC-14.1

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This guideline provides a methodology to characterize a new or existing process and is applicable to any manufacturing or service process. It describes when to use specific tools such as failure mode effects analysis (FEMA), design or experiments (DOE), measurement system evaluation (MSE), capability analysis (CpK), statistical process control (SPC), and problem solving tools. It also provides a brief description of each tool.

Committee(s): JC-13

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This standard describes SPI bus transactions intended to support Secure Flash operation on a serial memory device. The on-chip SFDP database described in JESD216 has been revised to include details about the secure transactions. This ballot does not describe the SFDP revisions or the secure packet structure.

Patents(): Infineon- US 10868679B1 and Micron- US 9009394B2

Committee(s): JC-42, JC-42.4

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This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this document.

Committee(s): JC-14, JC-14.1

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This standard is invoked when a supplier becomes aware that a product’s environmental compliance declaration they provided or made available to their customers had an error that might cause a customer to draw an incorrect conclusion about the compliance of the product to legal requirements.

Committee(s): JC-14.4

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