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Title	Document #	Date
Definition of the SSTUB32869 Registered Buffer with Parity for DDR2 RDIMM Applications	JESD82-27.01	Mar 2023
Terminology update. This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTUB32869 registered buffer with parity for driving heavy load on high density DDR2 RDIMM applications. A typical application would be a 36 SDRAM planar DIMM. Committee(s): JC-40 Free download. Registration or login required.
Fully Buffered DIMM Design for Test, Design for Validation (DFx)	JESD82-28A.01	Mar 2023
Terminology update. This FBDIMM DFx standard covers Design for Test, Design for Manufacturing, and Design for Validation (“DFx”) requirements and implementation guidelines for Fully Buffered DIMM technology. Patents(): There are known patent issues that are common to all FBDIMM related specifications. See document for link to FBDIMM Patents. Committee(s): JC-40, JC-40.5 Free download. Registration or login required.
RADIO FRONT END - BASEBAND DIGITAL PARALLEL (RBDP) INTERFACE	JESD207.01	Mar 2023
Terminology update. This document establishes an interface standard for the data path and control plane interface functions for an RFIC component and/or a BBIC component. Committee(s): JC-61 Free download. Registration or login required.
GRAPHICS DOUBLE DATA RATE (GDDR5X) SGRAM STANDARD	JESD232A.01	Mar 2023
Terminology update. This standard defines the Graphics Double Data This standard defines the GDDR5X SGRAM memory standard, including features, device operation, electrical characteristics, timings, signal pin assignments, and package Committee(s): JC-42.3, JC-42.3C Free download. Registration or login required.
SILICON RECTIFIER DIODES:	JESD282B.02	Mar 2023
Terminology update. This legacy document is a comprehensive users’ guide for silicon rectifier diode applications. Committee(s): JC-22.2 Free download. Registration or login required.
DEFINITION OF THE SSTVN16859 2.5-2.6 V 13-BIT TO 26-BIT SSTL_2 REGISTERED BUFFER FOR PC1600, PC2100, PC2700 AND PC3200 DDR DIMM APPLICATIONS	JESD82-13A.01	Mar 2023
Terminology update. Definition of the SSTVN16859 2.5-2.6 V 13-Bit to 26-Bit SSTL_2 Registered Buffer for PC1600, PC2100, PC2700, and PC3200 DDR DIMM Applications Committee(s): JC-40 Free download. Registration or login required.
JEDEC Legal Guidelines	JM5.01	Mar 2023
Terminology update. This document sets forth the best judgment of the standards of conduct and legal restraints that must be observed to protect against violations of the law. Free download. Registration or login required.
COMPACT THERMAL MODEL OVERVIEW	JESD15-1.01	Mar 2023
Terminology update.This document should be used in conjunction with the parent document, and is intended to function as an overview to support the effective use of Compact Thermal Model (CTM) methodologies as specified in the companion methods documents. Committee(s): JC-15, JC-15.1 Free download. Registration or login required.
RADIO FRONT END - BASEBAND (RF-BB) INTERFACE	JESD96A.01	Mar 2023
Terminology update. This standard establishes the requirements for an interface between Radio Front End (RF) and Baseband (BB) integrated circuits (IC). Committee(s): JC-61 Free download. Registration or login required.
Compute Express Link (CXL™) Memory Module Base Standard	JESD317	Mar 2023
This standard defines the specifications of interface parameters, signaling protocols, environmental requirements, packaging, and other features as reference for specific target implementations of CXL™-attached memory modules.The purpose is to provide certain reference base targets for CXL™-attached memory modules to enable system design simplification, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Committee(s): JC-45 Free download. Registration or login required.
Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package	MO-210R	Mar 2023
Designator: PBGA-B#[#]_I0p... Item: 11.11-988, Access STP Files for MO-210R Cross Reference: DG4.5 https://www.jedec.org/filebrowser/download/1625 Patents(): May apply: Micron: 6,048,753. Tessera: 5,950,304; and 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
DDR5 DIMM Labels	JESD401-5A	Mar 2023
This standard for labels applies to all DDR5 memory modules to fully describe the key attributes of the module. The label can be in the form of a stick-on label, silk screened onto the assembly, or marked using an alternate customer-readable format, Item 2268.02C Committee(s): JC-45 Free download. Registration or login required.
PART MODEL SCHEMAS	JEP30-10v2-0-0	Mar 2023
This download includes all files under the parent schema JEP30-10v2-0-0 (Committees: JC-11, JC-11.2) including: JEP30-A101v2-0-0 (Assembly Process), Committees: JC-11, JC-11.2, JC-14 JEP30-E101v2-0-0 (Electrical), Committees: JC-11, JC-11.2, JC-16 JEP30-P101v2-0-0 (Package), Committees: JC-11, JC-11.2 JEP30-S101v1-0-0 (Supply Chain), Committees: JC-11, JC-11.2, JC-14 JEP30-T101v2-0-0 (Thermal) Committees: JC-11, JC-11.2, JC-15 JEP30-D10v2-0-0 (Types Dictionary) Committees: JC-11, JC-11.2 This will enable the user to validate the schemas. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16 Free download. Registration or login required.
Part Model SupplyChain Guidelines for Electronic-Device Packages – XML Requirements	JEP30-S100	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required.
Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements	JEP30-T100A	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. Committee(s): JC-11, JC-11.2, JC-15 Free download. Registration or login required.
Part Model Package Guidelines for Electronic-Device Packages – XML Requirements	JEP30-P100A	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements	JEP30-E100A	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. Committee(s): JC-11, JC-11.2, JC-16 Free download. Registration or login required.
Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements	JEP30-A100A	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required.
Part Model Guidelines for Electronic-Device Packages – XML Requirements	JEP30A	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
DDR5 Registering Clock Driver Definition (DDR5RCD03) Release Number: 1.00	JESD82-513	Feb 2023
This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the DDR5 Registering Clock Driver (RCD) with parity for driving address and control nets on DDR5 RDIMM and LRDIMM applications. The DDR5RCD03 Device ID is DID = 0x0053. Committee(s): JC-40, JC-40.5 Free download. Registration or login required.
Compute Express Link (CXL) Memory Module Label Release Number: 1.0	JESD405-1	Feb 2023
The following labels shall be applied to all CXL memory modules to fully describe the key attributes of the module. The label can be in the form of a stick-on label, silk screened onto the assembly, or marked using an alternate customer-readable format. Committee(s): JC-45 Free download. Registration or login required.
Annex F, R/C F, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Unbuffered DIMM Design Specification Release Number: 33	MODULE4.20.26.F	Feb 2023
This specification defines the electrical and mechanical requirements for Raw Card F, 288-pin, 1.2 Volt (VDD), Unbuffered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM UDIMMs). These DDR4 Unbuffered DIMMs (UDIMMs) are intended for use as main memory when installed in PCs. Item 2231.43. Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing (Tubes, Trays, and Tape and Reel)	JEP130C	Feb 2023
This document establishes guidelines for integrated circuit unit container and the next level (intermediate) container packing and labeling. The guidelines include tube/rail standardization, intermediate packing, date codes, tube labeling, intermediate container and shipping labels, and standardize tube quantities. Future revisions of this document will also include tray and reel guidelines. The objective of this publication is to promote the standardization of practices between manufacturers and distributors resulting in improved efficiency, profitability, and product quality. Committee(s): JC-14, JC-14.4 Free download. Registration or login required.
DDR5 Registering Clock Driver Definition (DDR5RCD02) Release Number: Rev. 1.00	JESD82-512	Feb 2023
This standard defines specifications of DC interface parameters, switching parameters, and test loading for definition of the DDR5 Registering Clock Driver (RCD) with parity for driving address and control nets on DDR5 RDIMM and LRDIMM applications. The DDR5RCD02 Device ID is DID = 0x0052. Committee(s): JC-40, JC-40.4 Free download. Registration or login required.
Guideline for Evaluating Gate Switching Instability of Silicon Carbide Metal-Oxide-Semiconductor Devices for Power Electronic Conversion	JEP195	Feb 2023
This document elaborates on the information given in JEP184 regarding the long-time stability of device parameters under static conditions and under application near switching conditions. Committee(s): JC-70, JC-70.2 Free download. Registration or login required.
Guideline for Gate Oxide Reliability and Robustness Evaluation Procedures for Silicon Carbide Power MOSFETs	JEP194	Feb 2023
This document provides guidelines for evaluating gate reliability and lifetime testing for silicon carbide (SiC) based power devices with a gate oxide or gate dielectric. Committee(s): JC-70, JC-70.2 Free download. Registration or login required.
DEFINITION OF THE SSTU32S869 AND SSTU32D869 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS	JESD82-12A.01	Feb 2023
Terminology update.This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTU32S869 and SSTU32D869 registered buffer with parity for driving heavy load on high-density DDR2 RDIMM applications. A typical application would be a 36 SDRAM planar DIMM. Committee(s): JC-40 Free download. Registration or login required.
DEFINITION OF THE SSTUA32S868 AND SSTUA32D868 REGISTERED BUFFER WITH PARITY FOR 2R X 4 DDR2 RDIMM APPLICATIONS	JESD82-17.01	Feb 2023
(Terminology update.) This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTUA32S868 and SSTUA32D868 registered buffer with parity test for DDR2 RDIMM applications. Committee(s): JC-40, JC-40.3 Free download. Registration or login required.
FBDIMM: ARCHITECTURE AND PROTOCOL	JESD206.01	Feb 2023
Terminology update. This standard includes four chapters of the FBD Channel Specification (cover) Channel Overview (Chapter 2), Initialization (Chapter 3), Channel Protocol (Chapter 4), and Reliability, Availability, and Serviceability (RAS) (Chapter 5). Patents(): There are known patent issues that are common to all FBDIMM related specifications. See document for link to FBDIMM Patents. Committee(s): JC-40 Free download. Registration or login required.
INSTRUMENTATION CHIP DATA SHEET FOR FBDIMM DIAGNOSTIC SENSELINES	JESD82-22.01	Feb 2023
Terminology update.This device is a one-chip spectrum analyzer that operates in the frequency range from 1 to 2 GHz.It requires no external components except some filtering of the voltage supply (one inductor, one bypass capacitor).The frequency of the VCO is adjusted by an internal DAC. No PLL loop is used to lock the VCO to a reference frequency. A counter is used to determine the VCO frequency. Committee(s): JC-40, JC-40.4 Free download. Registration or login required.
DEFINITION OF THE SSTU32864 1.8 V CONFIGURABLE REGISTERED BUFFER FOR DDR2 RDIMM APPLICATIONS:	JESD82-7A.01	Feb 2023
Terminology update.This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTU32864 configurable registered buffer for DDR2 RDIMM applications. Committee(s): JC-40, JC-40.4 Free download. Registration or login required.
Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch Rectangular Family	MO-276T	Jan 2023
Designator: PBGA-B#[#]I0p5...Item 11-1027Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
DEFINITION OF THE SSTE32882 REGISTERING CLOCK DRIVER WITH PARITY AND QUAD CHIP SELECTS FOR DDR3/DDR3L/DDR3U RDIMM 1.5 V/1.35 V/1.25 V APPLICATIONS	JESD82-29A.01	Jan 2023
Terminology update.This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTE32882 registered buffer with parity for driving address and control nets on DDR3/DDR3L/DDR3U RDIMM applications.The purpose is to provide a standard for the SSTE32882 (see Note) logic device, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Committee(s): JC-40, JC-40.3, JC-40.4 Free download. Registration or login required.
DEFINITION OF the SSTUB32865 28-bit 1:2 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS	JESD82-24.01	Jan 2023
Terminology update.This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTUB32865 registered buffer with parity for 2 rank by 4 or similar high density DDR2 RDIMM applications. The SSTUB32865 is identical in functionality to the SSTU32865 but specifies tighter timing characteristics and a higher application frequency of up to 410 MHz. Committee(s): JC-40 Free download. Registration or login required.
DEFINITION OF THE SSTV16857 2.5 V, 14-BIT SSTL_2 REGISTERED BUFFER FOR DDR DIMM APPLICATIONS:	JESD82-3B.01	Jan 2023
Terminology update.This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTVN16857 14-bit SSTL_2 registered buffer for PC1600, PC2100, PC2700, and PC3200 DDR DIMM applications. Committee(s): JC-40, JC-40.3 Free download. Registration or login required.
DEFINITION OF THE SSTV32852 2.5 V 24-BIT TO 48-BIT SSTL_2 REGISTERED BUFFER FOR 1U STACKED DDR DIMM APPLICATIONS:	JESD82-6A.01	Jan 2023
Terminology update.This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the 32852 24-bit to 48-bit SSTL_2 registered buffer for stacked DDR DIMM applications. Committee(s): JC-40 Free download. Registration or login required.
DDR4 REGISTERING CLOCK DRIVER (DDR4RCD02)	JESD82-31A.01	Jan 2023
Terminology update. This document defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the DDR4 Registering Clock Driver (RCD) with parity for driving address and control nets on DDR4 RDIMM and LRDIMM applications. Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-40.4 Free download. Registration or login required.
LRDIMM DDR3 MEMORY BUFFER (MB)	JESD82-30.01	Jan 2023
Terminology update. The Load Reduced DIMM (LRDIMM) Memory Buffer (MB) supports DDR3 SDRAM main memory. The Memory Buffer allows buffering of memory traffic to support large memory capacities. Unlike DDR3 Register Buffer (SSTE32882), which only buffers Command, Address, Control and Clock, the LRDIMM Memory Buffer also buffers the Data (DQ) interface between the Memory Controller and the DRAM components. Committee(s): JC-40, JC-40.4 Free download. Registration or login required.
DEFINITION OF the SSTUB32866 1.8 V CONFIGURABLE REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS	JESD82-25.01	Jan 2023
Terminology update.This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of the SSTUB32866 registered buffer with parity test for DDR2 RDIMM applications. Committee(s): JC-40 Free download. Registration or login required.
DEFINITION OF THE SSTUB32868 REGISTERED BUFFER WITH PARITY FOR 2R x 4 DDR2 RDIMM APPLICATIONS	JESD82-26.01	Jan 2023
Terminology update. This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTUB32868 registered buffer with parity test for DDR2 RDIMM applications. The purpose is to provide a standard for the SSTUB32868 (see Note) logic device, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Committee(s): JC-40 Free download. Registration or login required.
GRAPHICS DOUBLE DATA RATE (GDDR5) SGRAM STANDARD Release Number: C.01 - Terminology update	JESD212C.01	Jan 2023
Terminology update. This document defines the Graphics Double Data Rate 5 (GDDR5) Synchronous Graphics Random Access Memory (SGRAM), including features, functionality, package, and pin assignments. The purpose of this Standard is to define the minimum set of requirements for JEDEC standard compatible 512 Mb through 8 Gb x32 GDDR5 SGRAM devices. System designs based on the required aspects of this standard will be supported by all GDDR5 SGRAM vendors providing JEDEC standard compatible devices. Some aspects of the GDDR5 standard such as AC timings and capacitance values were not standardized. Some features are optional and therefore may vary among vendors. In all cases, vendor data sheets should be consulted for specifics. Item 1733.70B Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-42.3C Free download. Registration or login required.
DEFINITION OF the SSTUA32S869 AND SSTUA32D869 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS	JESD82-23.01	Jan 2023
Terminology update. This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTUA32S869 and SSTUA32D869 registered buffer with parity for driving heavy load on high-density DDR2 RDIMM applications. A typical application would be a 36 SDRAM planar DIMM. The SSTUA32S869 and SSTUA32D869 are identical in functionality to the SSTU32S869 and SSTU32D869 devices respectively but specify tighter timing characteristics and a higher application frequency of up to 410MHz. Committee(s): JC-40 Free download. Registration or login required.
Joint ESDA/JEDEC - CDM Technical User Guide	JTR002-01-22	Jan 2023
This report only covers the procedures and requirements specified in ANSI/ESDA/JEDEC JS-002. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
DDR5 Serial Presence Detect (SPD) Contents Terminology update Release Number: Version 1.1	JESD400-5A.01	Jan 2023
This standard describes the serial presence detect (SPD) values for all DDR5 memory modules. In this context, “modules” applies to memory modules like traditional Dual In-line Memory Modules (DIMMs) or solder-down motherboard applications. The SPD data provides critical information about all modules on the memory channel and is intended to be used by the system's BIOS in order to properly initialize and optimize the system memory channels. Committee(s): JC-45 Free download. Registration or login required.
FBDIMM: ADVANCED MEMORY BUFFER (AMB)	JESDJESD82-20A.01	Jan 2023
This document is a core specification for a Fully Buffered DIMM (FBD) memory system. This document, along with the other core specifications, must be treated as a whole. Information critical to a Advanced Memory Buffer design appears in the other specifications, with specific cross-references provided. Patents(): There are known patent issues that are common to all FBDIMM related specifications. See document for link to FBDIMM Patents. Committee(s): JC-40 Free download. Registration or login required.
HIGH BANDWIDTH MEMORY (HBM3) DRAM	JESD238A	Jan 2023
The HBM3 DRAM is tightly coupled to the host compute die with a distributed interface. The interface is divided into independent channels. Each channel is completely independent of one another. Channels are not necessarily synchronous to each other. The HBM3 DRAM uses a wide-interface architecture to achieve high-speed, low power operation. Each channel interface maintains a 64 bit data bus operating at double data rate (DDR). Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-42, JC-42.2 Free download. Registration or login required.
Guidelines for Measuring the Threshold Voltage (VT) of SiC MOSFETs	JEP183A	Jan 2023
This publication describes the guidelines for VT measurement methods and conditioning prior to VT testing in SiC power MOSFETs to reduce or eliminate the effect of the aforementioned hysteresis. Committee(s): JC-70.1 Free download. Registration or login required.
Guidelines for Gate Charge (QG) Test Method for SiC MOSFET	JEP192	Jan 2023
This publication defines a QGS, TOT, QGD and QGS, TH which can be extracted from a measured QG waveform for SiC MOSFETs. Committee(s): JC-70, JC-70.2 Free download. Registration or login required.
SELECTION OF BURN-IN / LIFE TEST CONDITIONS AND CRITICAL PARAMETERS FOR QML MICROCIRCUITS	JEP163A	Jan 2023
This publication is a guideline to assist manufacturers of integrated circuits in defining conditions for burn-in and life test of their products to meet quality and reliability performance requirements of MIL-PRF-38535. Committee(s): JC-13, JC-13.2 Free download. Registration or login required.
Survey On Latch-Up Testing Practices and Recommendations for Improvements	JEP193	Jan 2023
This is a re-publication of a white paper which reports on a survey that has been conducted to better understand how the latch-up standard JESD78 revision E (JESD78E) is interpreted and has been used in the industry. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
ESDA/JEDEC JOINT STANDARD FOR ELECTROSTATIC DISCHARGE SENSITIVITY TESTING – CHARGED DEVICE MODEL (CDM) – DEVICE LEVEL	JS-002-2022	Jan 2023
This standard establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this standard. This test method combines the main features of JEDEC JESD22-C101 and ANSI/ESD S5.3.1. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
THERMAL SHOCK	JESD22-A106B.02	Jan 2023
This test is conducted to determine the robustness of a device to sudden exposure to extreme changes in temperature and to the effect of alternate exposures to these extremes. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
IC LATCH-UP TEST	JESD78F.01	Dec 2022
This standard covers the I-test and Vsupply overvoltage latch-up testing of integrated circuits. The purpose of this standard is to establish a method for determining IC latch-up characteristics and to define latch-up detection criteria. Latch-up characteristics are extremely important in determining product reliability and minimizing No Trouble Found (NTF) and Electrical Overstress (EOS) failures due to latch-up. This test method is applicable to NMOS, CMOS, bipolar, and all variations and combinations of these technologies. This standard has been adopted by the Defense Logistics Agency (DLA) as project 5962-1880. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
JEDEC Manual of Organization and Procedure	JM21U	Dec 2022
The mission of JEDEC is to serve the solid state industry by creating, publishing, and promoting global acceptance of standards, and by providing a forum for technical exchange on leading industry topics. This manual provides guidance for JEDEC members and staff to perform their functions correctly in the standardization process. NOTE The .pdf file has been updated as of 1/12/2023, there was an side comment in 7.2 that was included at time of conversion and has been removed. Committee(s): JC-BOD Free download. Registration or login required.
JOINT IPC/JEDEC Standard Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)	J-STD-020F	Dec 2022
The purpose of this standard is to identify the classification level of non-hermetic SMDs that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
JOINT IPC/JEDEC Standard for Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Devices	J-STD-035A	Dec 2022
This method provides users with an acoustic microscopy process flow for detecting anomalies (delaminations, cracks, mold compound voids, etc.) nondestructively in encapsulated electronic devices while achieving reproducibility. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
PROCESS CHARACTERIZATION GUIDELINE	JEP132A.01	Dec 2022
This guideline provides a methodology to characterize a new or existing process and is applicable to any manufacturing or service process. It describes when to use specific tools such as failure mode effects analysis (FEMA), design or experiments (DOE), measurement system evaluation (MSE), capability analysis (CpK), statistical process control (SPC), and problem solving tools. It also provides a brief description of each tool. Committee(s): JC-13 Free download. Registration or login required.
STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS	JESD47L	Dec 2022
This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. Committee(s): JC-14, JC-14.3 Available for purchase: $87.38 Add to Cart To help cover the costs of producing standards, JEDEC is now charging for non-member access to selected standards and design files. Most of the content on this site remains free to download with registration. Paying JEDEC member companies enjoy free access to all content. Learn more and apply today. Paying JEDEC Members may login for free access.
Secure Serial Flash Bus Transactions Release Number: Version 1.0	JESD254	Dec 2022
This standard describes SPI bus transactions intended to support Secure Flash operation on a serial memory device. The on-chip SFDP database described in JESD216 has been revised to include details about the secure transactions. This ballot does not describe the SFDP revisions or the secure packet structure. Patents(): Infineon- US 10868679B1 and Micron- US 9009394B2 Committee(s): JC-42, JC-42.4 Free download. Registration or login required.
GUIDELINES FOR COMBINING CIE 127-2007 TOTAL FLUX MEASUREMENTS WITH THERMAL MEASUREMENTS OF LEDS WITH EXPOSED COOLING SURFACE	JESD51-52A	Nov 2022
This document is intended to be used in conjunction with the JESD51-50 series of standards, especially with JESD51-51 (Implementation of the Electrical Test Method for the Measurement of Real Thermal Resistance and Impedance of Light-emitting Diodes with Exposed Cooling Surface) document. This present document focuses on the measurement of the total radiant flux of LEDs in combination with the measurement of LEDs's thermal characteristics: guidelines on the implementation of the recommendations of the CIE 127-2007 document are provided. Committee(s): JC-15 Free download. Registration or login required.

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