Global Standards for the Microelectronics Industry
Standards & Documents Search
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STANDARD MANUFACTURERS IDENTIFICATION CODENOTE: JEP106U was in error starting with bank two an additional continuation code was added, JEP106U should be discarded. |
JEP106BC | Feb 2021 |
The manufacturers identification code is defined by one or more 8 bit fields, each consisting of 7 data bits plus 1 odd parity bit. The manufacturers identification code is assigned, maintained and updated by the JEDEC Office. The intent of this identification code is that it may be used whenever a digital field is required, e.g., hardware, software, documentation, etc. To make a request for an ID Code please go to http://www.jedec.org/Home/MIDCODE_request.cfm Free download. Registration or login required. |
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ENCLOSURE FORM FACTOR FOR SSD DEVICES, VERSION 1.0 |
JESD253 | Feb 2021 |
This document specifies the enclosure form factor which can be used with various type of SSD devices: outline of the top and bottom enclosure, three screw holes to mount the enclosure on the system, and two clamping holes in the top enclosure to lock to the connector. Item 318.06. Committee(s): JC-64.8 Free download. Registration or login required. |
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Guidelines for measuring the threshold voltage (VT) of SiC MOSFETs |
JEP183 | Jan 2021 |
This publication describes the guidelines for VT measurement methods and conditioning prior to VT testing in SiC power MOSFETs to reduce or eliminate the effect of the aforementioned hysteresis. Committee(s): JC-70.1 Free download. Registration or login required. |
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DDR5 288 Pin U/R/LR DIMM Connector Performance Standard, DDR5 |
PS-005A | Jan 2021 |
Committee(s): JC-11.14 Free download. Registration or login required. |
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DDR4 NVDIMM-P BUS PROTOCOL |
JESD304-4.01 | Jan 2021 |
This version is a minor editorial adding Annex B that was left out of the original publication October 2020.An NVDIMM-P device is defined as a LRDIMM memory module which provides host controller access to DRAM and/or other memory devices such as persistent memory. A transactional protocol is described for NVDIMM-P, which may be used on a DDR interface allowing operation of both standard DRAM modules and NVDIMM-P modules on the same channel. Item 2233.98K. Committee(s): JC-45.6 Free download. Registration or login required. |
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GUIDELINE FOR SWITCHING RELIABILITY EVALUATION PROCEDURES FOR GALLIUM NITRIDE POWER CONVERSION DEVICES |
JEP180.01 | Jan 2021 |
This document is intended for use by GaN product suppliers and related power electronic industries. It provides guidelines for evaluating the switching reliability of GaN power switches and assuring their reliable use in power conversion applications. It is applicable to planar enhancement-mode, depletion-mode, GaN integrated power solutions and cascode GaN power switches. Committee(s): JC-70.1 Free download. Registration or login required. |
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COUNTERFEIT ELECTRONIC PARTS: NON-PROLIFERATION FOR MANUFACTURERS |
JESD243A | Jan 2021 |
This standard identifies the best commercial practices for mitigating and/or avoiding counterfeit products by all manufacturers of electronic parts including, but not limited to original component manufacturers (OCMs), authorized aftermarket manufacturers, and other companies that manufacture electronic parts under their own logo, name, or trademark. The types of product this standard applies to is limited to monolithic microcircuits, hybrid microcircuits and discrete semiconductor products. Committee(s): JC-13 Free download. Registration or login required. |
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APPLICATION THERMAL DERATING METHODOLOGIES: |
JEP149.01 | Jan 2021 |
This publication applies to the application of integrated circuits and their associated packages in end use designs. It summarizes the methodology of thermal derating and the suitability of such methodologies. Free download. Registration or login required. |
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TEST METHOD FOR CONTINUOUS-SWITCHING EVALUATION OF GALLIUM NITRIDE POWER CONVERSION DEVICES |
JEP182 | Jan 2021 |
This document is intended for use in the GaN power semiconductor and related power electronic industries and provides guidelines for test methods and circuits to be used for continuous-switching tests of GaN power conversion devices. Committee(s): JC-70.1 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package |
MO-210Q | Jan 2021 |
Designator: PBGA-B#[#]_I0p... Patents(): May apply: Micron: 6,048,753. Tessera: 5,950,304; and 6,133,627 Committee(s): JC-11.11 Free download. Registration or login required. |
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SYSTEM LEVEL ESD: PART II: IMPLEMENTATION OF EFFECTIVE ESD ROBUST DESIGNSThis is an editorial revision, details can be found in Annex F. |
JEP162A.01 | Jan 2021 |
This document, while establishing the complex nature of System Level ESD, proposes that an efficient ESD design can only be achieved when the interaction of the various components under ESD conditions are analyzed at the system level. This objective requires an appropriate characterization of the components and a methodology to assess the entire system using simulation data. This is applicable to system failures of different categories (such as hard, soft, and electromagnetic interference (EMI)). This type of systematic approach is long overdue and represents an advanced design approach which replaces the misconception, as discussed in detail in JEP161, that a system will be sufficiently robust if all components exceed a certain ESD level. Free download. Registration or login required. |
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STEADY-STATE TEMPERATURE-HUMIDITY BIAS LIFE TEST |
JESD22-A101D.01 | Jan 2021 |
This standard establishes a defined method and conditions for performing a temperature-humidity life test with bias applied. The test is used to evaluate the reliability of nonhermetic packaged solid state devices in humid environments. It employs high temperature and humidity conditions to accelerate the penetration of moisture through external protective material or along interfaces between the external protective coating and conductors or other features that pass through it. This revision enhances the ability to perform this test on a device which cannot be biased to achieve very low power dissipation. Free download. Registration or login required. |
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Registration - Plastic Bottom Grid Array Ball, 0.80 mm Pitch Square Family Package |
MO-216G | Jan 2021 |
Designator: PBGA-B#[#]_I80... Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch, Rectangular Family Package |
MO-276P | Jan 2021 |
Designator: PBGA-B#[#]_I0p5... Cross Reference: DR4.5 Committee(s): JC-11.11 Free download. Registration or login required. |
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REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION: |
JEP121B | Dec 2020 |
The purpose of this document provides the basis for the optimization of 100% screening/stress operations and sample inspection test activities. This document is designed to assist the manufacturer in optimizing the test flow while maintaining and/or improving assurance of providing high quality and reliable product in an efficient manner. This will allow for optimization of testing that is not adding value, hence, reducing cycle time and costs. Free download. Registration or login required. |
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Annex D, R/C D, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Load Reduced DIMM Design SpecificationRelease Number: 30 |
MODULE4.20.27.D | Dec 2020 |
This specification defines the electrical and mechanical requirements for Raw Card D, 288-pin, 1.2 Volt (VDD), Load Reduced, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM LRDIMMs). These DDR4 Load Reduced DIMMs (LRDIMMs) are intended for use as main memory when installed in PCs. Item 2204.23 Committee(s): JC-45.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Annex A, Raw Card A, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Load Reduced DIMM Design SpecificationRelease Number: 30 |
MODULE4.20.27.A | Dec 2020 |
Item No. 2204.22 Committee(s): JC-45.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Annex B, R/C B, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Unbuffered DIMM Design SpecificationRelease Number: 30A |
MODULE4.20.26.B | Dec 2020 |
This document defines the electrical and mechanical requirements for Raw Card B, 288-pin, 1.2 Volt (VDD), Unbuffered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM UDIMMs). These DDR4 Unbuffered DIMMs (UDIMMs) are intended for use as main memory when installed in PCs. Item 2231.26. Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Annex D, R/C D, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Unbuffered DIMM Design SpecificationRelease Number: 30 |
MODULE4.20.26.D | Dec 2020 |
This document defines the electrical and mechanical requirements for Raw Card D, 288-pin, 1.2 Volt (VDD), Unbuffered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM UDIMMs). These DDR4 Unbuffered DIMMs (UDIMMs) are intended for use as main memory when installed in PCs. Item 2231.21A. Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Annex E, R/C E, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Load Reduced DIMM Design SpecificationRelease Number: 30 |
MODULE4.20.27.E | Dec 2020 |
This specification defines the electrical and mechanical requirements for Raw Card E, 288-pin, 1.2 Volt (VDD), Load Reduced, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM LRDIMMs). These DDR4 Load Reduced DIMMs (LRDIMMs) are intended for use as main memory when installed in PCs. Item 2232.20. Committee(s): JC-45.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Annex B, Raw Card B, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Load Reduced DIMM Design SpecificationRelease Number: 30 |
MODULE4.20.27.B | Dec 2020 |
This specification defines the electrical and mechanical requirements for Raw Card B, 288-pin, 1.2 Volt (VDD), Load Reduced, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM LRDIMMs). These DDR4 Load Reduced DIMMs (LRDIMMs) are intended for use as main memory when installed in PCs. Item 2204.24. Committee(s): JC-45.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Annex A, R/C A, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Unbuffered DIMM Design SpecificationRelease Number: 30A |
MODULE4.20.26.A | Nov 2020 |
This document defines the electrical and mechanical requirements for Raw Card A, 288-pin, 1.2 Volt (VDD), Unbuffered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM UDIMMs). These DDR4 Unbuffered DIMMs (UDIMMs) are intended for use as main memory when installed in PCs. Committee Item 2231.38A. Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Registration - Plastic Multi Position Flange Mount Mixed Technology, 0.10 in. Pitch Package |
TO-220L.01 | Nov 2020 |
Item 11.10-456(E) Free download. Registration or login required. |
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SPD Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules, Release 6Release Number: 30 |
SPD4.1.2.L-6 | Nov 2020 |
This annex describes the serial presence detect (SPD) values for all DDR4 modules covered in Document Release 6. Differences between module types are encapsulated in subsections of this annex. These presence detect values are those referenced in the SPD standard document for ‘Specific Features’. Item 2220.01H. Committee(s): JC-45 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Registration - Plastic Quad Flatpack, 0.65 mm Pitch, 3.30 mm Body, Square Family Package |
MO-346A | Nov 2020 |
Designator: PQFP-B#[#]_I0p65... Committee(s): JC-11.11 Free download. Registration or login required. |
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UNIVERSAL FLASH STORAGE (UFS) CARD EXTENSION, Version 3.0 |
JESD220-2B | Nov 2020 |
This standard specifies the characteristics of the UFS card electrical interface and the memory device. This document defines the added/modified features in UFS card compared to embedded UFS device. For other common features JESD220, UFS, will be referenced. Patents(): Samsung: US D727910, US D736212, US D736215, US D736214, US D736213, US 29/546125, US 29/546150 Committee(s): JC-64.1 Available for purchase: $76.00 Add to Cart Paying JEDEC Members may login for free access. |
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TEMPERATURE CYCLING |
JESD22-A104F | Nov 2020 |
This standard provides a method for determining solid state devices capability to withstand extreme temperature cycling. This standard applies to single-, dual- and triple-chamber temperature cycling and covers component and solder interconnection testing. It should be noted that this standard does not cover or apply to thermal shock chambers. This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high- and low-temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Committee(s): JC-14.1 Free download. Registration or login required. |
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CYCLED TEMPERATURE HUMIDITY-BIAS WITH SURFACE CONDENSATION LIFE TEST |
JESD22-A100E | Nov 2020 |
The Cycled Temperature-humidity-bias Life Test is performed for the purpose of evaluating the reliability of nonhermetic packaged solid state devices in humid environments. It employs conditions of temperature cycling, humidity, and bias that accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors that pass through it. The Cycled Temperature-Humidity-Bias Life Test is typically performed on cavity packages (e.g., MQUADs, lidded ceramic pin grid arrays, etc.) as an alternative to JESD22-A101 or JESD22-A110. Free download. Registration or login required. |
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CHARACTERIZATION OF INTERFACIAL ADHESION IN SEMICONDUCTOR PACKAGES |
JEP167A | Nov 2020 |
This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle. Committee(s): JC-14.1 Free download. Registration or login required. |
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DDRx SPREAD SPECTRUM CLOCKING (SSC) STANDARD |
JESD404-1 | Nov 2020 |
Definition for all DDRx component documents to reference. This is generic to any DDRxtechnology. Item 1842.34 Committee(s): JC-42.3C Free download. Registration or login required. |
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Standard - Plastic Dual Small Outline, 1.27 mm pitch, 7.50 mm Body Width Rectangular Package Family |
MS-013G | Oct 2020 |
Designator: PDSO-G#-I1p27... Item 11.11-967(S). Committee(s): JC-11.11 Free download. Registration or login required. |
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JEDEC MODULE SIDEBAND BUS (SidebandBus) |
JESD403-1 | Oct 2020 |
This standard defines the assumptions for the system management bus for next generation memory solutions; covering the interface protocol, use of hub devices, and voltages appropriate to these usages. Item 2260.37C. Committee(s): JC-45 Free download. Registration or login required. |
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Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick |
MO-345A | Oct 2020 |
Designator: PDSO-G#_I0P5-##... Committee(s): JC-11.11 Free download. Registration or login required. |
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JEDEC Manual of Organization and Procedure |
JM21T | Oct 2020 |
The mission of JEDEC is to serve the solid state industry by creating, publishing, and promoting global acceptance of standards, and by providing a forum for technical exchange on leading industry topics. This manual provides guidance for JEDEC members and staff to perform their functions correctly in the standardization process. Committee(s): JC-BOD Free download. Registration or login required. |
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ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements |
JEP181 | Sep 2020 |
This standard establishes the requirements for the exchange of electronic thermal system level simulation models between supplier and end user in a single neutral file format. The data is held in an XML format, conforming to an XML schema that this document describes. Get the XML Schema: JEP181_Schema_R1p0. Committee(s): JC-15 Free download. Registration or login required. |
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Standard - Plastic Dual Small Outline (SO) Gull Wing, 1.27 mm Pitch Package |
MS-012G.02 | Sep 2020 |
Designator: PDSO-G#_I127-##... Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - 12 Pin UFS Card, 0.91 mm Pitch |
MO-320B | Sep 2020 |
Designator: PBMA-N11-I0p91-CturZ1p0 Item 11.11-985 Patents(): Samsung: US D727910, US D736212, US D736215, US D736214, US D736213, US 29/546125, US 29/546150 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick |
MO-193F | Sep 2020 |
Designator: PDSO-G#_I0P##-##... Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Dual Small Outline Gull Wing Package, 1.45 mm Thick |
MO-178D | Sep 2020 |
Item 11.10-458 Committee(s): JC-11.10 Free download. Registration or login required. |
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REGISTRATION - 288 PIN DDR5 DIMM SMT, 0.85 MM PITCH SOCKET OUTLINE |
SO-023C | Sep 2020 |
Designator: PDXC-LO288-I0p85-R162p0x6p5Z21p3-N5p20S3p1Z0p2 Patents(): CN 202759077 U Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - 288 Pin DDR5 DIMM, 0.85 mm Pitch Microelectronic Assembly |
MO-329C | Sep 2020 |
Designator: PDMA-N288-I0p85-R133p8x... Patents(): Micron: 7,547,213. Committee(s): JC-11.14 Free download. Registration or login required. |
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UNIVERSAL FLASH STORAGE, UFS 2.2 |
JESD220C-2.2 | Aug 2020 |
The purpose of this standard is definition of a UFS Universal Flash Storage electrical interface and a UFS memory device. This standard defines a unique UFS feature set and includes the feature set of eMMC standard as a subset. This standard replaces JESD220C, UFS 2.1, and introduces a feature called WriteBooster. Item 138.88. Committee(s): JC-64.1 Free download. Registration or login required. |
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Annex E, R/C E, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Registered DIMM Design SpecificationRelease Number: 30 |
MODULE4.20.28.E | Aug 2020 |
This specification defines the electrical and mechanical requirements for Raw Card E, 288-pin, 1.2 Volt (VDD), Registered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM RDIMMs). These DDR4 Registered DIMMs (RDIMMs) are intended for use as main memory when installed in PCs. Committee Item 2149.34a Committee(s): JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Annex D, Raw Card D, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Registered DIMM Design SpecificationRelease Number: 30 |
MODULE4.20.28.D | Aug 2020 |
This specification defines the electrical and mechanical requirements for Raw Card D, 288-pin, 1.2 Volt (VDD), Registered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM RDIMMs). These DDR4 Registered DIMMs (RDIMMs) are intended for use as main memory when installed in PCs. Item 2149.08c JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Annex B, R/C B, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Registered DIMM Design SpecificationRelease Number: 30 |
MODULE4.20.28.B | Aug 2020 |
This document defines the electrical and mechanical requirements for Raw Card B, 288-pin, 1.2 Volt (VDD), Registered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM RDIMMs). These DDR4 Registered DIMMs (RDIMMs) are intended for use as main memory when installed in PCs. Committee Item 2149.38a. Committee(s): JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Annex A, R/C A, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Registered DIMM Design SpecificationRelease Number: 30 |
MODULE4.20.28.A | Aug 2020 |
This specification defines the electrical and mechanical requirements for Raw Card A, 288-pin, 1.2 Volt (VDD), Registered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM RDIMMs). These DDR4 Registered DIMMs (RDIMMs) are intended for use as main memory when installed in PCs. Item 2149.40a. Committee(s): JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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REGISTRATION - Upper PoP, Plastic Bottom Grid Array Ball, 0.40 mm Pitch Rectangular Family Package |
MO-344A | Aug 2020 |
Designator: PBGA-B#[#]_I0p40... Cross Reference: DR4.18 Committee(s): JC-11 Free download. Registration or login required. |
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UFS Card Socket Performance Standard |
PS-004A | Jul 2020 |
For UFS Card 6 Gb/sItem 11.14-195S Committee(s): JC-11.14 Free download. Registration or login required. |
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BYTE ADDRESSABLE ENERGY BACKED INTERFACE |
JESD245D | Jul 2020 |
The purpose of this standard is definition of an energy backed byte addressable function on a nonvolatile dual in-line memory module (NVDIMM). This standard defines the feature set and commands implemented by the energy backed byte addressable function on the NVDIMM. This standard is used in conjunction with JESD248. Item 2233.54F * A minor editorial change has been made to the table under 8.1.3.2, on page 47 on 9/1/2020, from the original posted version 8/18/2020. If you downloaded prior to 9/1/2020, please discard and use the current version. Committee(s): JC-45.6 Free download. Registration or login required. |
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DDR5 SDRAM |
JESD79-5 | Jul 2020 |
This document defines the DDR5 SDRAM specification, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this Standard is to define the minimum set of requirements for JEDEC compliant 8Gb through 32Gb for x4, x8, and x16 DDR5 SDRAM devices. This standard was created based on the DDR4 standards (JESD79-4) and some aspects of the DDR, DDR2, DDR3 & LPDDR4 standards (JESD79, JESD79-2, JESD79-3 & JESD209-4). Item 1848.99G. Committee(s): JC-42.3B Available for purchase: $369.00 Add to Cart Paying JEDEC Members may login for free access. |
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TEMPERATURE GRADE AND MEASUREMENT SPECIFICATIONS FOR COMPONENTS AND MODULES |
JESD402-1 | Jul 2020 |
This document specifies standard temperature ranges that may be used, by way of referencing JESD402-1, in other standards, specifications, and datasheets when defining temperature related specifications. Item 1855.01A Committee(s): JC-42 Free download. Registration or login required. |
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PMIC50x0 POWER MANAGEMENT IC SPECIFICATION, Rev. 1 |
JESD301-1 | Jun 2020 |
Definition of PMIC5000, PMIC5010 Voltage Regulator Device for Memory Module Applications Committee(s): JC-40.1 Free download. Registration or login required. |
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Annex E, R/C E, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Unbuffered DIMM Design SpecificationRelease Number: 30 |
MODULE4.20.26.E | Jun 2020 |
This specification defines the electrical and mechanical requirements for Raw Card E, 288-pin, 1.2 Volt (VDD), Unbuffered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM UDIMMs). These DDR4 Unbuffered DIMMs (UDIMMs) are intended for use as main memory when installed in PCs. Item 2231.17B. Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Annex G, Raw Card G, in 260-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM SODIMM Design SpecificationRelease Number: 30 |
MODULE4.20.25.G | May 2020 |
This annex defines the electrical and mechanical requirements for Raw Card G, 260-pin, 1.2 Volt (VDD), Small Outline, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM SODIMMs). These DDR4 SODIMMs are intended for use as main memory when installed in PCs, laptops, and other systems. Item No. 2228.34C Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Annex E, R/C E, in 260-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM SODIMM Design SpecificationRelease Number: 30 |
MODULE4.20.25.E | May 2020 |
This specification defines the electrical and mechanical requirements for Raw Card E, 260-pin, 1.2 Volt (VDD), Small Outline, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM SODIMMs). These DDR4 SODIMMs are intended for use as main memory when installed in PCs, laptops, and other systems. Item 2228.33C. Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Annex C, R/C C, in 260-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM SODIMM Design SpecificationRelease Number: 30 |
MODULE4.20.25.C | May 2020 |
This annex defines the electrical and mechanical requirements for Raw Card C, 260-pin, 1.2 Volt (VDD), Small Outline, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM SODIMMs). These DDR4 SODIMMs are intended for use as main memory when installed in PCs, laptops, and other systems. Item 2228.31B Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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1.05 V CMOS |
JESD8-34 | Apr 2020 |
This standard defines the input, output specifications and ac test conditions for devices that are designed to operate narrow range 1.05 V CMOS level. Item 159.01 Committee(s): JC-16 Free download. Registration or login required. |
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PRECONDITIONING OF NONHERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
JESD22-A113I | Apr 2020 |
This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence of this document by the semiconductor manufacturer prior to being submitted to specific in-house reliability testing (qualification and reliability monitoring) to evaluate long term reliability (which might be impacted by solder reflow). Committee(s): JC-14.1 Free download. Registration or login required. |
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Registration - Plastic Dual Small Outline Surface, 2 Terminal, Wettable Flank Package |
MO-343A | Mar 2020 |
Designator: PDSO-N2-I#-R#x#Z#-CturET0p04 Patents(): Nexperia BV: US8809121 B2 Committee(s): JC-11.11 Free download. Registration or login required. |
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Addendum No. 1 to JESD79-4, 3D STACKED DRAM |
JESD79-4-1A | Mar 2020 |
This document defines the 3DS DDR4 SDRAM specification, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this specification is to define the minimum set of requirements for a compliant 8 Gbit through 128 Gbit for x4, x8 3DS DDR4 SDRAM devices. This addendum was created based on the JESD79-4 DDR4 SDRAM specification. Each aspect of the changes for 3DS DDR4 SDRAM operation was considered. Item 1727.58F Committee(s): JC-42.3C Free download. Registration or login required. |