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Title	Document #	Date
GUIDELINES FOR REPORTING AND USING ELECTRONIC PACKAGE THERMAL INFORMATION	JESD51-12.01	Nov 2012
This document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards. By addressing these two areas, this document can be used as the common basis for discussion between electronic package thermal information suppliers and users. Committee(s): JC-15, JC-15.1 Free download. Registration or login required.
IMPLEMENTATION OF THE ELECTRICAL TEST METHOD FOR THE MEASUREMENT OF REAL THERMAL RESISTANCE AND IMPEDANCE OF LIGHT-EMITTING DIODES WITH EXPOSED COOLING SURFACE	JESD51-51A	Nov 2022
The purpose of this document is to specify, how LEDs thermal metrics and other thermally-related data are best identified by physical measurements using well established testing procedures defined for thermal testing of packaged semiconductor devices (published and maintained by JEDEC) and defined for characterization of light sources (published and maintained by CIE – the International Commission on Illumination). Committee(s): JC-15 Free download. Registration or login required.
THERMAL TEST ENVIRONMENT MODIFICATIONS FOR MULTICHIP PACKAGES	JESD51-31	Jul 2008
This document specifies the appropriate modifications needed for Multi-Chip Packages to the thermal test environmental conditions specified in the JESD51 series of specifications. The data obtained from methods of this document are the raw data used to document the thermal performance of the package. The use of this data will be documented in JESD51-XX, Guideline to Support Effective Use of MCP Thermal Measurements which is being prepared. Committee(s): JC-15 Free download. Registration or login required.
INTEGRATED CIRCUITS THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS - NATURAL CONVECTION (STILL AIR)	JESD51-2A	Jan 2007
This document outlines the environmental conditions necessary to ensure accuracy and repeatability for a standard junction-to-ambient thermal resistance measurement in natural convection. Committee(s): JC-15.1 Free download. Registration or login required.
TERMS, DEFINITIONS AND UNITS GLOSSARY FOR LED THERMAL TESTING	JESD51-53A	Oct 2022
This document provides a unified collection of the commonly used terms and definitions in the area of LED thermal measurements. The terms and definitions provided herein extend beyond those used in the JESD51 family of documents, especially in JESD51-13, in order to include other often used terms and definitions in the area of light output measurements of LEDs. Definitions, symbols and notations regarding light output measurements used here are consistent with those defined in JESD77C.01 and with those defined by CIE (International Commission on Illumination), especially in the International Lighting Vocabulary, CIE S 017/E:2011 ILV and in the CIE 127-2007 document as well as in some other relevant standards of other standardization bodies from the solid-state lighting industry, e.g., ANSI/IESNA RP 16-05. Committee(s): JC-15 Free download. Registration or login required.

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