Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
|---|---|---|
ADDENDUM No. 8 to JESD24 - METHOD FOR REPETITIVE INDUCTIVE LOAD AVALANCHE SWITCHING:Status: ReaffirmedOctober 2002 |
JESD24- 8 | Aug 1992 |
Determines the repetitive inductive avalanche switching capability of power switching transistors. Committee(s): JC-25 Free download. Registration or login required. |
||
ADDENDUM No. 8 to JESD8 - STUB SERIES TERMINATED LOGIC FOR 3.3 VOLTS (SSTL_3) A 3.3 V VOLTAGE BASED INTERFACE STANDARD FOR DIGITAL INTEGRATED CIRCUITS |
JESD8-8 | Aug 1996 |
This standard is a result of a major effort by the JC-16 Committee to develop a high performance CMOS-based interface suitable for high speed main memory applications in excess of 125 MHz. Committee(s): JC-16 Free download. Registration or login required. |
||
ADDENDUM No. 9 to JESD24 - SHORT CIRCUIT WITHSTAND TIME TEST METHOD:Status: ReaffirmedOctober 2002 |
JESD24- 9 | Aug 1992 |
Test method to determine how long a device can survive a short circuit condition with a given drive level. Committee(s): JC-25 Free download. Registration or login required. |
||
ADDENDUM No. 9B to JESD8 - STUB SERIES TERMINATED LOGIC FOR 2.5 VOLTS (SSTL_2): Includes Errata and Corrected Page 7 as of October 18, 2002. |
JESD8-9B | May 2002 |
This standard defines the input, output specifications and ac test conditions for devices that are designed to operate in the SSTL_2 logic switching range, nominally 0 V to 2.5 V. The standard may be applied to ICs operating with separate VDD and VDDQ supply voltages. This standard has been developed particularly with the objective of providing a relatively simple upgrade path from MOS push-pull interface designs. The standard is particularly intended to improve operation in situations where busses must be isolated from relatively large stubs. Committee(s): JC-16 Free download. Registration or login required. |
||
AIR-CONVECTION-COOLED, LIFE TEST ENVIRONMENT FOR LEAD-MOUNTED SEMICONDUCTOR DEVICES:Status: ReaffirmedFebruary 1972, November 2002 |
EIA323 | Mar 1966 |
This standard is applicable to life testing of lead-mounted semiconductor devices intended for applications in a natural air-cooled environment where most of the power dissipation is obtained by convection and radiation losses from the body to the device. Committee(s): JC-22.1 Free download. Registration or login required. |
||
