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Title	Document #	Date
PLASTIC DUAL SMALL OUTLINE, FLAT LEAD, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE)	DO-219D	Apr 2024
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Procedure for Reliability Characterization of Metal-Insulator-Metal Capacitors	JEP199	Apr 2024
This document defines the standards for achieving Reliability certification and qualification of on-chip MIM Capacitors and MIS Trench Capacitors. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14, JC-14.2 Free download. Registration or login required.
PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.0675 MM PITCH RECTANGULAR FAMILY PACKAGE	MO-361A	Apr 2024
Designator: PBGA--B264[294]_I0p60-R8p7X14p4Z1p0-C0p3Z# Item: 11-1050 JEP95 Registrations Main Page A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.11 Free download. Registration or login required.
Gate Dielectric Breakdown	JESD263	Mar 2024
This document describes procedures developed for estimating the overall integrity of gate dielectrics. JESD263 supersedes these other 4 standards: JESD35A, JESD35-1 ADDENDUM, JESD35-2 and JESD92. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14, JC-14.2 Free download. Registration or login required.
JEDEC® Memory Module Reference Base Standard – for Compute Express Link® (CXL®)	JESD317A	Mar 2024
This standard defines the specifications of interface parameters, signaling protocols, environmental requirements, packaging, and other features as reference for specific target implementations of CXL-attached memory modules. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45 Free download. Registration or login required.

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