Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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Registration - Dual-In-Line Cerdip Family .600 inch Row Spacing. Item 11.10-383 |
MO-103-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Flatpack Family for High Speed ECL Memory Devices, .535 inch Length, .030 inch Pitch (22, 24 and 28 Pins). Item 11.10-281. |
MO-106-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Thin Small Outline J-Lead (TSOJ) .300 inch Body, 0.050 inch Lead Pitch. Item 11.11-272. |
MO-105-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Metric Plastic Quad Flatpack, 1.0, 0.8, 0.65 mm. Item 11.11-449. |
MO-108-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Multilayer Leaded Chip Carrier ,.050 inch Pitch, J-Bend Leadform, 20 mil min. Item 11.10-284. |
MO-107-A | |
Committee(s): JC-11 Free download. Registration or login required. |