Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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PLASTIC DUAL FLATPACK, FLAT TERMINAL, RECTANGULAR FAMILY PACKAGE |
MO-293C | Jan 2025 |
Item 11-1071 PDFP-_... Free download. Registration or login required. |
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Automotive Solid State Drive (SSD) Device StandardRelease Number: 1.1 |
JESD312 | Jan 2025 |
This standard defines the specifications of interface parameters, signaling protocols, environmental requirements, packaging, and other features for a solid state drive (SSD) targeted primarily at automotive applications. Free download. Registration or login required. |
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Guidelines for Representing Threshold Voltage of SiC MOSFETs in Datasheets, Version 1.0Release Number: Version 1.0 |
JEP202 | Jan 2025 |
This publication provides guidelines for representation of threshold voltage and transfer characteristic of SiC MOS device in datasheets. Free download. Registration or login required. |
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PLASTIC BOTTOM GRID ARRAY, BALL, 0.35 MM PITCH, RECTANGULAR FAMILY PACKAGE |
MO-365A | Jan 2025 |
Designator: PBGA-B#[#]_i0P35... Item: 11-1076
Committee(s): JC-11 Free download. Registration or login required. |
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Universal Flash Storage (UFS)Release Number: Version 4.1 |
JESD220G | Dec 2024 |
This document replaces all prior versions; however, JESD220F August 2022 (version 4.0) remains available for reference purposes. This standard defines a UFS Universal Flash Storage electrical interface and a UFS memory device. Available for purchase: $423.00 Add to Cart Paying JEDEC Members may login for free access. |