Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Standard Practices and Procedures - Requirements for Applying Material and Finish Specifications to Selected Mechanical Outlines. |
SPP-015 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Registered and Standard Outlines |
SPP-013A | Oct 2014 |
Item 11.2-886(E). This document has been editorially updated to provide template examples. Committee(s): JC-11.2 Free download. Registration or login required. |
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Standard Practices and Procedures - Reflow Flatness Requirements for Ball Grid Array Packages. Item 11.2-783 |
SPP-024A | Mar 2009 |
This document states the procedures for using component land side flatness during simulated reflow as an alternative to coplanarity in certain limited cases for BGA components. Free download. Registration or login required. |
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Standard Practices and Procedures - Procedure for Making Editorial Corrections to Published Documents. |
SPP-018 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Pin #1 orientation for TAB Packages. |
SPP-005 | |
Committee(s): JC-11 Free download. Registration or login required. |