Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
Gate Dielectric Breakdown |
JESD263 | Mar 2024 |
This document describes procedures developed for estimating the overall integrity of gate dielectrics. JESD263 supersedes these other 4 standards: JESD35A, JESD35-1 ADDENDUM, JESD35-2 and JESD92. Free download. Registration or login required. |
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JEDEC® Memory Module Reference Base Standard – for Compute Express Link® (CXL®) |
JESD317A | Mar 2024 |
This standard defines the specifications of interface parameters, signaling protocols, environmental requirements, packaging, and other features as reference for specific target implementations of CXL-attached memory modules. Committee(s): JC-45 Free download. Registration or login required. |
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SPI Safety Extensions (CRC) for Non Volatile SPI Flash Memories (QPI and xSPI) |
JESD255 | Mar 2024 |
The JESD255 document defines CRC modes supported with 8-bit aligned and 16-bit aligned data transactions. It is limited to logical bus transactions and does not cover the electrical properties of the IO bus. Free download. Registration or login required. |
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Guideline for Characterizing Solder Bump Electromigration Under Constant Current and Temperature Stress |
JEP154A | Mar 2024 |
This publication describes a method to test the electromigration susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. Free download. Registration or login required. |
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Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices |
JESD625C.01 | Mar 2024 |
This standard applies to devices susceptible to damage by electrostatic discharge greater than 100 volts human body model (HBM) and 200 volts charged device model (CDM). Free download. Registration or login required. |
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