Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
---|---|---|
Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097. |
SO-009A | Feb 2007 |
Committee(s): JC-11 Free download. Registration or login required. |
||
EARLY LIFE FAILURE RATE CALCULATION PROCEDURE FOR SEMICONDUCTOR COMPONENTS:Status: Reaffirmed January 2014, September 2019 |
JESD74A | Feb 2007 |
This standard defines methods for calculating the early life failure rate of a product, using accelerated testing, whose failure rate is constant or decreasing over time. For technologies where there is adequate field failure data, alternative methods may be used to establish the early life failure rate. The purpose of this standard is to define a procedure for performing measurement and calculation of early life failure rates. Projections can be used to compare reliability performance with objectives, provide line feedback, support service cost estimates, and set product test and screen strategies to ensure that the ELFR meets customers' requirements. Free download. Registration or login required. |
||
INTEGRATED CIRCUITS THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS - NATURAL CONVECTION (STILL AIR) |
JESD51-2A | Jan 2007 |
This document outlines the environmental conditions necessary to ensure accuracy and repeatability for a standard junction-to-ambient thermal resistance measurement in natural convection. Committee(s): JC-15.1 Free download. Registration or login required. |
||
SPD Annex J: Serial Presence Detect for DDR2 SDRAM |
SPD4.1.2.10 | Jan 2007 |
Release No. 17 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
||
Registration - FBDIMM (Dual In-Line Memory Module) Family, Flex-Based, 1.00 mm Contact Centers. |
MO-282-A | Jan 2007 |
Item 11.14-099 Patents(): STAKTEK: See Outline Committee(s): JC-11 Free download. Registration or login required. |