Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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SILICON BOTTOM GRID ARRAY COLUMN, 0.035 MM X 0.055 MM PITCH RECTANGULAR PACKAGE |
MO-362A | Nov 2024 |
Designator: SBGA-M16148[49588]_D0p068... Item #: 4-1056
Committee(s): JC-11 Free download. Registration or login required. |
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Compression Attached Memory Module (CAMM2) Common Standard |
JESD318A Ver. 1.10 | Nov 2024 |
This standard defines the electrical and mechanical requirements for Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (DDR5 SDRAM CAMM2s) and Low Power Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (LP5 SDRAM CAMM2s). Committee(s): JC-45 Free download. Registration or login required. |
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LPDDR5/5X Compression Attached Memory Module (CAMM2) Raw Card E AnnexRelease Number: Version 1.00 |
JESD318-F0-RCE | Nov 2024 |
This standard, JESD318-F0-RCE, “LPDDR5/5X Compression Attached Memory Module (CAMM2) Raw Card E Annex”, defines the design detail of eight x16 subchannels from four 315-ball dual channel LPDDR5/5x devices. Committee(s): JC-45 Free download. Registration or login required. |
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DDR5 Clocked Small Outline Dual Inline Memory Module (CSODIMM) Raw Card A AnnexRelease Number: Version 1.00 |
JESD324-V0-RCA | Nov 2024 |
This standard, JESD324-V0-RCA, “DDR5 Clocked Small Outline Dual Inline Memory Module (CSODIMM) Raw Card A Annex” defines the design detail of x8, 1 Package Ranks DDR5 CSODIMM with Clock Driver. Free download. Registration or login required. |
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DDR5 Clocked Unbuffered Dual Inline Memory Module with 4-bit ECCRelease Number: Version 1.00 |
JESD323-B4-RCD | Nov 2024 |
This standard, JESD323-B4-RCD, “DDR5 Clocked Unbuffered Dual Inline Memory Module with 4-bit ECC (EC4 CUDIMM) Raw Card D Annex” defines the design detail of x8, 1 Package Rank DDR5 ECC CUDIMM with Clock Driver. Free download. Registration or login required. |