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Title	Document #	Date
ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING – REPORTING ESD WITHSTAND LEVELS ON DATASHEETS	JEP178	Apr 2021
This document is intended to guide device manufacturers in developing datasheets and to device customers in understanding datasheet entries. Committee(s): JC-14.3 Free download. Registration or login required.
FLIP CHIP TENSILE PULL	JESD22-B109C	Mar 2021
The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode and strength of the solder bump interconnection between the flip chip die and the substrate. It should be used to assess the consistency of the chip join process. This test method is a destructive test. Committee(s): JC-14.1 Free download. Registration or login required.
Registration - Shipping and Handling Tray for DDR5 DIMM, 50 pcs	CO-036A	Mar 2021
Designator: N/A Item: 11.2-991, Access STP Files for CO-036A Cross Reference: N/A Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 39 Pin Removable Memory, 1.00 mm Pitch Microelectronic Assembly	MO-347A	Mar 2021
Designator: PBMA-N32[39]_Ip0-R14p1x18p1Z1p65-R0p71x1p1 Item: 11.11-987, Access STP Files for MO-347A Cross Reference: N/A Patents(): Kioxia: 1705380 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Multichip Packages (MCP) and Discrete e•MMC, e•2MMC, and UFS Release Number: 31	MCP3.12.1	Mar 2021
Item 142.01, 142.02.This section provides electrical interface items related to Multi-Chip Packages (MCP) and Stacked-Chip Scale Packages (SCSP) of mixed memory technologies including Flash (NOR and NAND), SRAM, PSRAM, LPDRAM, USF, etc. These items include die-on-die stacking within a single encapsulated package, package-on-package or module-in-package technologies, etc. The Section also contains Silicon Pad Sequence information for the various memory technologies to aid in the design and electrical optimization of the memory sub-system or complete memory stacked solution. Committee(s): JC-64.2 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.

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