Standards & Documents Search

Displaying 1 - 5 of 1305 documents. Show 5 | 10 | 20 | 40 | 60 results per page.

Title	Document #	Date
Registration - Plastic Dual Small Outline Surface Terminal, Wettable Flank Package	MO-340A	Oct 2019
Designator: PDSO_N#[#]_I#-R#x#Z#-CturET0p04 Item: 11.11-974, Access STP Files for MO-340A Cross Reference: DR4.8, DR4.16, DR4.20 Patents(): Nexperia BV: 8809121B2 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flatpack, 8 Terminal, 1.27 mm Pitch Package	MO-341A	Oct 2019
Designator: PQFP-F8[10]_I127-R5p51x6.54Z1P1 Item: 11.11-959 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
STANDARD MANUFACTURERS IDENTIFICATION CODE NOTE: JEP106U was in error starting with bank two an additional continuation code was added, JEP106U should be discarded.	JEP106BA	Oct 2019
The manufacturers identification code is defined by one or more 8 bit fields, each consisting of 7 data bits plus 1 odd parity bit. The manufacturers identification code is assigned, maintained and updated by the JEDEC Office. The intent of this identification code is that it may be used whenever a digital field is required, e.g., hardware, software, documentation, etc. To make a request for an ID Code please go to http://www.jedec.org/Home/MIDCODE_request.cfm Committee(s): JC-42, JC-42.3 Free download. Registration or login required.
SYSTEM LEVEL ESD: PART II: IMPLEMENTATION OF EFFECTIVE ESD ROBUST DESIGNS	JEP162A	Sep 2019
JEP162A, while establishing the complex nature of System Level ESD, proposes that an efficient ESD design can only be achieved when the interaction of the various components under ESD conditions are analyzed at the system level. This objective requires an appropriate characterization of the components and a methodology to assess the entire system using simulation data. This is applicable to system failures of different categories (such as hard, soft, and electromagnetic interference (EMI)). This type of systematic approach is long overdue and represents an advanced design approach which replaces the misconception, as discussed in detail in JEP161, that a system will be sufficiently robust if all components exceed a certain ESD level. Committee(s): JC-14, JC-14.3 Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.80 MM x 0.70 MM Pitch Rectangular Family Package	MO-338A	Sep 2019
Item 11.11-973, Access STP Files for MO-338A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Pages