Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING – REPORTING ESD WITHSTAND LEVELS ON DATASHEETS |
JEP178 | Apr 2021 |
This document is intended to guide device manufacturers in developing datasheets and to device customers in understanding datasheet entries. Committee(s): JC-14.3 Free download. Registration or login required. |
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FLIP CHIP TENSILE PULL |
JESD22-B109C | Mar 2021 |
The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode and strength of the solder bump interconnection between the flip chip die and the substrate. It should be used to assess the consistency of the chip join process. This test method is a destructive test. Committee(s): JC-14.1 Free download. Registration or login required. |
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Registration - Shipping and Handling Tray for DDR5 DIMM, 50 pcs |
CO-036A | Mar 2021 |
Designator: N/A Committee(s): JC-11.2 Free download. Registration or login required. |
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Registration - 39 Pin Removable Memory, 1.00 mm Pitch Microelectronic Assembly |
MO-347A | Mar 2021 |
Designator: PBMA-N32[39]_Ip0-R14p1x18p1Z1p65-R0p71x1p1 Patents(): Kioxia: 1705380 Committee(s): JC-11.11 Free download. Registration or login required. |
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Multichip Packages (MCP) and Discrete e•MMC, e•2MMC, and UFSRelease Number: 31 |
MCP3.12.1 | Mar 2021 |
Item 142.01, 142.02.This section provides electrical interface items related to Multi-Chip Packages (MCP) and Stacked-Chip Scale Packages (SCSP) of mixed memory technologies including Flash (NOR and NAND), SRAM, PSRAM, LPDRAM, USF, etc. These items include die-on-die stacking within a single encapsulated package, package-on-package or module-in-package technologies, etc. The Section also contains Silicon Pad Sequence information for the various memory technologies to aid in the design and electrical optimization of the memory sub-system or complete memory stacked solution. Committee(s): JC-64.2 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |