Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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Registration - TapePak´ Molded Carrier Ring Family, Zero Degree Minimum Lead Bend. Item 11.11-329. |
MO-109-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Round Lead, inchJ inch Form Square Body, .050 inch Pitch Center Ceramic Chip Carrier. Item 11.10-292. |
MO-110-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Family of Round Leads, .050 inch Pitch, Gullwing Leadform, Center Ceramic Chip Carrier. Item 11.10-293. |
MO-111-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Quadpack Family 0.025 inch Lead Spacing With Ceramic Nonconductive Tie Bar. Item 11.10-369. |
MO-113-D | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Metric Quad Flatpack Family (Plastic) 3.9 mm Footprint. Item 11.11-422. |
MO-112-B | |
Committee(s): JC-11 Free download. Registration or login required. |