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Title	Document #	Date
PartModel Generated ECAD - Models Guidelines for Electronic-Device Packages – XML Requirements	JEP30-M100	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “generated ECAD model” subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
JOINT IPC/JEDEC Standard for Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Devices	J-STD-035A	Dec 2022
This method provides users with an acoustic microscopy process flow for detecting anomalies (delaminations, cracks, mold compound voids, etc.) nondestructively in encapsulated electronic devices while achieving reproducibility. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES	J-STD-033D	Apr 2018
The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
CLASSIFICATION OF PASSIVE AND SOLID STATE DEVICES FOR ASSEMBLY PROCESSES	J-STD-075A	May 2018
This is a Joint Standard between ECIA, IPC, and JEDEC. The purpose of this specification is to establish an agreed to set of worst case solder assembly process conditions to which devices are evaluated. The generated PSL rating will convey the conditions to which a device can be safely attached to FR4 type or ceramic laminates using SMT reflow and solder wave/fountain soldering processes. It is important for device manufacturers (hereafter referred to as “suppliers”), users, and (PWB) assemblers to be highly familiar with this standard’s information and processes to insure optimal device quality and reliability. THIS DOCUMENT IS NOT AVAILABLE FOR FREE DOWNLOAD. However, this document is available to the JEDEC formulating Committee members on the JC-14 Resources tab on the Members' website. The lead organization is ECIA. Committee(s): JC-14
JOINT IPC/JEDEC Standard Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)	J-STD-020F	Dec 2022
The purpose of this standard is to identify the classification level of non-hermetic SMDs that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.

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