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Title	Document #	Date
DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Raw Card A Annex Release Number: Version 1.00	JESD323-A0-RCA	Nov 2024
This standard, JESD323-A0-RCA, “DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Raw Card A Annex” defines the design detail of x8, 1 Package Rank DDR5 NECC CUDIMM with Clock Driver. Committee(s): JC-45, JC-45.3 Free download. Registration or login required.
DDR5 Clocked Small Outline Dual Inline Memory Module with 4-bit ECC (EC4 CSODIMM) Raw Card D Annex Release Number: Version 1.00	JESD324-W4-RCD	Nov 2024
This standard, JESD324-W4-RCD, “DDR5 Clocked Small Outline Dual Inline Memory Module with 4-bit ECC (EC4 CSODIMM) Raw Card D Annex” defines the design detail of x8, 1 Package Ranks DDR5 CSODIMM with Clock Driver. Committee(s): JC-45.3 Free download. Registration or login required.
PART MODEL SCHEMAS	JEP30-10v7-0-0	Nov 2024
This download includes all files under the parent schema JEP30-10v7-0-0 (Committees: JC-11, JC-11.2) including: JEP30-A101v2-0-3 (Assembly Process), Committees: JC-11, JC-11.2, JC-14 JEP30-E101v4-1-0 (Electrical), Committees: JC-11, JC-11.2, JC-16 JEP30-P101v7-0-0 (Package), Committees: JC-11, JC-11.2 JEP30-S101v1-1-0 (Supply Chain), Committees: JC-11, JC-11.2, JC-14 JEP30-T101v2-0-3 (Thermal) Committees: JC-11, JC-11.2, JC-15 JEP30-D10v4-0-0 (Types Dictionary) Committees: JC-11, JC-11.2 This will enable the user to validate the schemas. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16 Free download. Registration or login required.
Part Model Supply Chain Guidelines for Electronic-Device Packages – XML Requirements	JEP30-S100A.01	Nov 2024
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required.
Part Model Package Guidelines for Electronic-Device Packages – XML Requirements	JEP30-P100F	Nov 2024
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.

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