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Title	Document #	Date
Standard - Ceramic Dual-In-Line (CDIP) Family, .400 inch Row Spacing. Item 11.10-375S.	MS-031-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ceramic Dual-In-Line (CDIP) Family, .300 inch Row Spacing. Item 11.10-374S.	MS-030-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ceramic Dual Flatpack (CerPak) Package Family, .050 inch Pitch. Item 11.10-382S.	MS-033-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ceramic Dual-In-Line (CDIP) Family, .600 inch Row Spacing. Item 11.10-376S.	MS-032-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Thin Small Outline Package. TSOPII Package. This revision modifies leadframe thickness for 10.16 mm body SOIC family. Item 11.11-753(S)	MS-024H	Jun 2006
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

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