Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
|---|---|---|
Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402. |
MO-223-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 44 and 48 Pin Plastic SOP, 12.6 mm Body, 1.27 mm Pitch. Item 11.11-412. |
MO-175-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 40 Lead Zig-Zag In-Line Package Family (ZIP) 0.500 inch Max Seated Height. Addition of Variation AE. Item 11.11-284. |
MO-072-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 4 Lead Small Outline Package (SOP). Item 11.10-358 |
TO-269-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 4 Lead Quad Flat Pack (QFP). |
TO-271-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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