Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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Registration - 16 Lead Flange-Mounted Ceramic Power Package. (Type 2), R-CDFM-T16. Item 11.10-311. |
MO-139-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 160 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-027. |
MO-191-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 168 pin DIMM. Multiple Keyway Dual-In-Line Memory Module (DIMM), 1.27 mm contact centers. Addition of the 100 pin variation GA-XX and the INACTIVATION of the 168 pin right polarized configuration to DIMM registration. Item 11.14-055/056. |
MO-161-F | Dec 2002 |
Free download. Registration or login required. |
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Registration - 18 Lead Flange-Mounted Ceramic Power Package. R-CDFM-T18. Item 11.10-312. |
MO-140-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 2 and 4 Lead Surface Mount Power Package. (H,HB1)-PDSO, (H,HB1)-PSOF. Item 11.10-446. |
TO-270C | Jul 2008 |
Free download. Registration or login required. |