Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
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METHOD FOR CHARACTERIZING THE ELECTROMIGRATION FAILURE TIME DISTRIBUTION OF INTERCONNECTS UNDER CONSTANT-CURRENT AND TEMPERATURE STRESSStatus: Reaffirmed September 2018 |
JESD202 | Mar 2006 |
This is an accelerated stress test method for determining sample estimates and their confidence limits of the median-time-to-failure, sigma, and early percentile of a log-Normal distribution, which are used to characterize the electromigration failure-time distribution of equivalent metal lines subjected to a constant current-density and temperature stress. Failure is defined as some pre-selected fractional increase in the resistance of the line under test. Analysis procedures are provided to analyze complete and singly, right-censored failure-time data. Sample calculations for complete and right-censored data are provided in Annex A. The analyses are not intended for the case when the failure distribution cannot be characterized by a single log-Normal distribution. Free download. Registration or login required. |
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Standard Practices and Procedures - Thermal Pad Requirements. Item 11.2-748(S) |
SPP-022B | Mar 2006 |
Free download. Registration or login required. |
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PSO-N/PQFN PINOUTS STANDARDIZED FOR 14-, 16-, 20-, AND 24-LEAD LOGIC FUNCTIONS: |
JESD75-6 | Mar 2006 |
This standard defines device pinouts for 14-, 16-, 20-, and 24-lead logic functions. This pinout standard specifically applies to the conversion of DIP-packaged logic devices to PSO-N/PQFN packages logic devices The purpose of this standard is to provide a pinout standard for 14-, 16-, 20-, and 24-lead logic devices offered in 14-, 16-, 20-, and 24-lead PSO-N/PQFN packages for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use Free download. Registration or login required. |
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Registration - Thin Matrix Tray for Advanced Memory Buffer. Item 11.5-736. |
CO-035A | Mar 2006 |
Free download. Registration or login required. |
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Registration - Very Thin, Small Outline Plastic Surface Mount Package. V-PSOF. Item 11.10-439. |
DO-222A | May 2006 |
Free download. Registration or login required. |