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Title	Document #	Date
Standard Practices and Procedures - Thermal Pad Requirements. Item 11.2-748(S)	SPP-022B	Mar 2006
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Standard Overall Profile Height Codes for Packages. RESCINDED, March 2009 Status: RescindedMarch 2009	SPP-017-C	Nov 2004
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Requirements for Applying Material and Finish Specifications to Selected Mechanical Outlines.	SPP-015
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Registered and Standard Outlines	SPP-013A	Oct 2014
Item 11.2-886(E). This document has been editorially updated to provide template examples. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Reflow Flatness Requirements for Ball Grid Array Packages. Item 11.2-783	SPP-024A	Mar 2009
This document states the procedures for using component land side flatness during simulated reflow as an alternative to coplanarity in certain limited cases for BGA components. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Procedure for Making Editorial Corrections to Published Documents.	SPP-018
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Pin #1 orientation for TAB Packages.	SPP-005
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Pin #1 Mark Function and Location.	SPP-002
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Pin #1 Mark and Lead-Numbering Convention for Dual-In-Line Packages with Standard and Reverse-Bend Lead Form.	SPP-012
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Package Variation Designators	SPP-025C	Aug 2018
Item No. 11.2-951(S) A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Mold Flash, Interlead Flash, Gate Burrs and Protrusion for Plastic Packages. Item 11.2-379.	SPP-014	Jul 1994
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Module Insertion Procedure for DIMM and miniDIMM Connectors	SPP-023B	Feb 2013
Item 11.11-781(S) A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Metrication.	SPP-003C	Mar 2006
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Measuring Stand-off Heights of Packages	SPP-019-A	Jul 2001
Clarification on how to measure A1. Item 11.2-595S A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Lead Finish and base Metal Specification.	SPP-004
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - J Lead; Dimensioning of Lead Contact Points.	SPP-011
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Inclusion of Nominal Dimensions.	SPP-009	Sep 1991
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Inactivation and Rescission.	SPP-016
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Gullwing Lead Dimensioning.	SPP-008	Sep 1991
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Grid Array Terminal Position Numbering	SPP-010B	May 2014
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Document Procedure.	SPP-001
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Definition of DAMBAR Protrusion and Intrusion.	SPP-006
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Change Record Methodology	SPP-021A	Jan 2006
Item 11.2-710S A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
STANDARD METHOD FOR MEASURING AND USING THE TEMPERATURE COEFFICIENT OF RESISTANCE TO DETERMINE THE TEMPERATURE OF A METALLIZATION LINE: Status: Reaffirmed October 2012, September 2018	JESD33B	Feb 2004
This newly revised test method provides a procedure for measuring the temperature coefficient of resistance, TCR(T), of thin-film metallizations used in microelectronic circuits and devices. Procedures are also provided to use the TCR(T) to determine the temperature of a metallization line under Joule-heating conditions and to determine the ambient temperature where the metallization line is used as a temperature sensor. Originally, the method was intended only for aluminum-based metallizations and for other metallizations that satisfy the linear dependence and stability stipulations of the method. The method has been revised to make it explicitly applicable to copper-based metallizations, as well, and at temperatures beyond where the resistivity of copper is no longer linearly dependent on temperature (beyond approximately 200 °C). Using the TCR(T) measured for copper in the linear-dependent region, a factor is used to correct the calculated temperature at these higher temperatures. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14.2 Free download. Registration or login required.
STANDARD METHOD FOR CALCULATING THE ELECTROMIGRATION MODEL PARAMETERS FOR CURRENT DENSITY AND TEMPERATURE: Status: Reaffirmed 4/17/23	JESD63	Apr 2023
This method provides procedures to calculate sample estimates and their confidence intervals for the electromigration model parameters of current density and temperature. The model parameter for current density is the exponent (n) to which the current density is raised in Black's equation. The parameter for temperature is the activation energy for the electromigration failure process. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14.2 Free download. Registration or login required.
STANDARD MEASURMENTS OF THE ELECTRICAL CHARACTERISTICS OF SEMICONDUCTOR INTEGRATED CIRCUITS Status: RescindedOct-84	JEB6	Jan 1966
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JCJEDC
STANDARD MANUFACTURER'S IDENTIFICATION CODE	JEP106BL	Feb 2025
The manufacturers identification code is defined by one or more 8 bit fields, each consisting of 7 data bits plus 1 odd parity bit. The manufacturers identification code is assigned, maintained and updated by the JEDEC Office. The intent of this identification code is that it may be used whenever a digital field is required, e.g., hardware, software, documentation, etc. To make a request for an ID Code please go to https://www.jedec.org/standards-documents/id-codes-order-form A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 Free download. Registration or login required.
STANDARD LOGNORMAL ANALYSIS OF UNCENSORED DATA, AND OF SINGLY RIGHT -CENSORED DATA UTILIZING THE PERSSON AND ROOTZEN METHOD:	JESD37A	Aug 2017
This standard details techniques for estimating the values of a two parameter lognormal distribution from complete lifetime data (all samples in an experiment have failed) or singly right-censored lifetime data (the experiment have failed) or singly right-censored lifetime data gathered from rapid stress test; however, not all types of failure data can be analyzed with these techniques. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14.2 Free download. Registration or login required.
STANDARD LIST OF VALUES TO BE USED IN SEMICONDUCTOR DEVICE SPECIFICATIONS AND REGISTRATION FORMAT: Status: ReaffirmedMarch 2001	JESD419-A	Oct 1980
This document contains standard lists of values which are recommended for use in semiconductor device specification and JEDEC Registration Formats. Good reasons should exist in those cases where values are used that are not included in these lists. Formerly known as EIA-419-A, that superseded JEP74 (February 1996). A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-25 Free download. Registration or login required.
STANDARD LIST OF VALUES TO BE USED IN POWER TRANSISTOR DEVICE REGISTRATION AND MINIMUM DIFFERENCES FOR DISCRETENESS OF REGISTRATIONS - SUPERSEDED BY EIA-419-A, February 1996. Status: Rescinded	JEP74	Jan 1969
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-25
STANDARD FOR THE MEASUREMENT OF SMALL-SIGNAL TRANSISTOR SCATTERING PARAMETERS: Status: ReaffirmedApril 1999, March 2009	JESD435	Apr 1976
This standard specifies the standard for the measurement of small-signal transistor scattering parameters. Formerly known as RS-435 and/or EIA-435 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-25 Free download. Registration or login required.
STANDARD FOR THE MEASUREMENT OF CRE Status: Reaffirmed April 1981, April 1999, March 2009	JESD340	Nov 1967
This standard offers an easily measured parameter which is one of the significant characteristics in determining the stability of a transistor intended for small-signal operation. The measurement technique allows rapid testing. Its correlation to AC stability will help to establish the interchangeability of a device. Formerly known as RS-340 and/or EIA-340. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-25 Free download. Registration or login required.
STANDARD FOR SELENIUM SURGE SUPPRESSORS:	TENTSTD12	Nov 1973
The suppresser furnished under this standard shall be a product that has been tested and meets the definitions and minimum requirements specified herein. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-22.5
STANDARD FOR MEASURING FORWARD SWITCHING CHARACTERISTICS OF SEMICONDUCTOR DIODES: Status: ReaffirmedApril 2005	JESD286-B	Feb 2000
This method updates the standard procedure for characterizing the switching of signal or switching diodes when a step function of forward current is applied. The objective is to provide a standard so that accurate comparisons can be made. Formerly known as EIA-286-A (February 1991), ANSI/EIA-286-A-1991. Became JESD286-B after revision, February 2000. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-22.4 Free download. Registration or login required.
STANDARD FOR FAILURE ANALYSIS REPORT FORMAT: Status: Rescinded January 2025	JESD38	Dec 1995
This standard is to promote unification of content and format of semiconductor device failure-analysis reports so that reports from diverse laboratories may be easily read, compared, and understood by customers. Additional objectives are to ensure that reports can be easily ready by users, satisfactorily reproduced on copying machines, adequately transmitted by telefax, and conveniently stored in standard filing cabinets. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14.4 Free download. Registration or login required.
STANDARD FOR DESCRIPTION OF LOW-VOLTAGE TTL-COMPATIBLE BiCMOS LOGIC DEVICES:	JESD55	May 1996
The purpose is to provide a standard of BiCMOS Logic series specifications for uniformity, multiplicity of sources, elimination of confusion, and ease of device specification and design by users. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-40 Free download. Registration or login required.
STANDARD FOR DESCRIPTION OF LOW VOLTAGE TTL-COMPATIBLE CMOS LOGIC DEVICES:	JESD52	Nov 1995
This standard describes dc interface specifications and test environment for these devices that operate with 2.7 V to 3.6 V power supplies. The goal is to provide a consistent set of dc specifications for reference by logic suppliers and users alike. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-40 Free download. Registration or login required.
STANDARD FOR DESCRIPTION OF FAST CMOS TTL COMPATIBLE LOGIC:	JESD18-A	Jan 1993
The purpose of this standard is to provide for uniformity, multiplicity of sources, elimination of confusion, and ease of device specification and design by users. The standard covers specifications for description of '54/74FCTXXXX' series fast CMOS TTL compatible devices. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-40.2 Free download. Registration or login required.
STANDARD FOR DESCRIPTION OF A 3.3 V, ZERO DELAY CLOCK DISTRIBUTION DEVICE COMPLIANT WITH THE JESD21-C PC133 REGISTERED DIMM SPECIFICATION	JESD82-5	Jul 2002
This standard defines the PLL support devices required for standard height and low profile registered PC133 SDRAM DIMM modules. The objective of the standard is to clearly define the functionality, pinout and electrical characteristics of the PLL used on JEDEC standard modules.JESD82-5 is the latest specification to be added to the JESD82 family of specifications for memory module support devices. Additional specifications are currently under development for DDR2 support devices. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-40 Free download. Registration or login required.
STANDARD FOR DESCRIPTION OF A 3.3 V, 18-BIT, LVTTL I/O REGISTER FOR PC133 REGISTERED DIMM APPLICATIONS:	JESD82-2	Jul 2001
This standard defines the register support devices needed for standard height and low profile registered PC133 SDRAM DIMM modules. The objective of the standard is to clearly define the functionality, pinout and electrical characteristics required for this type of SDRAM module. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-40 Free download. Registration or login required.

Standards & Documents Search

Standard Practices and Procedures - Thermal Pad Requirements. Item 11.2-748(S)

Standard Practices and Procedures - Standard Overall Profile Height Codes for Packages. RESCINDED, March 2009

Standard Practices and Procedures - Requirements for Applying Material and Finish Specifications to Selected Mechanical Outlines.

Standard Practices and Procedures - Registered and Standard Outlines

Standard Practices and Procedures - Reflow Flatness Requirements for Ball Grid Array Packages. Item 11.2-783

Standard Practices and Procedures - Procedure for Making Editorial Corrections to Published Documents.

Standard Practices and Procedures - Pin #1 orientation for TAB Packages.

Standard Practices and Procedures - Pin #1 Mark Function and Location.

Standard Practices and Procedures - Pin #1 Mark and Lead-Numbering Convention for Dual-In-Line Packages with Standard and Reverse-Bend Lead Form.

Standard Practices and Procedures - Package Variation Designators

Standard Practices and Procedures - Mold Flash, Interlead Flash, Gate Burrs and Protrusion for Plastic Packages. Item 11.2-379.

Standard Practices and Procedures - Module Insertion Procedure for DIMM and miniDIMM Connectors

Standard Practices and Procedures - Metrication.

Standard Practices and Procedures - Measuring Stand-off Heights of Packages

Standard Practices and Procedures - Lead Finish and base Metal Specification.

Standard Practices and Procedures - J Lead; Dimensioning of Lead Contact Points.

Standard Practices and Procedures - Inclusion of Nominal Dimensions.

Standard Practices and Procedures - Inactivation and Rescission.

Standard Practices and Procedures - Gullwing Lead Dimensioning.

Standard Practices and Procedures - Grid Array Terminal Position Numbering

Standard Practices and Procedures - Document Procedure.

Standard Practices and Procedures - Definition of DAMBAR Protrusion and Intrusion.

Standard Practices and Procedures - Change Record Methodology

STANDARD METHOD FOR MEASURING AND USING THE TEMPERATURE COEFFICIENT OF RESISTANCE TO DETERMINE THE TEMPERATURE OF A METALLIZATION LINE:

STANDARD METHOD FOR CALCULATING THE ELECTROMIGRATION MODEL PARAMETERS FOR CURRENT DENSITY AND TEMPERATURE:

STANDARD MEASURMENTS OF THE ELECTRICAL CHARACTERISTICS OF SEMICONDUCTOR INTEGRATED CIRCUITS

STANDARD MANUFACTURER'S IDENTIFICATION CODE

STANDARD LOGNORMAL ANALYSIS OF UNCENSORED DATA, AND OF SINGLY RIGHT -CENSORED DATA UTILIZING THE PERSSON AND ROOTZEN METHOD:

STANDARD LIST OF VALUES TO BE USED IN SEMICONDUCTOR DEVICE SPECIFICATIONS AND REGISTRATION FORMAT:

STANDARD LIST OF VALUES TO BE USED IN POWER TRANSISTOR DEVICE REGISTRATION AND MINIMUM DIFFERENCES FOR DISCRETENESS OF REGISTRATIONS - SUPERSEDED BY EIA-419-A, February 1996.

STANDARD FOR THE MEASUREMENT OF SMALL-SIGNAL TRANSISTOR SCATTERING PARAMETERS:

STANDARD FOR THE MEASUREMENT OF CRE

STANDARD FOR SELENIUM SURGE SUPPRESSORS:

STANDARD FOR MEASURING FORWARD SWITCHING CHARACTERISTICS OF SEMICONDUCTOR DIODES:

STANDARD FOR FAILURE ANALYSIS REPORT FORMAT:

STANDARD FOR DESCRIPTION OF LOW-VOLTAGE TTL-COMPATIBLE BiCMOS LOGIC DEVICES:

STANDARD FOR DESCRIPTION OF LOW VOLTAGE TTL-COMPATIBLE CMOS LOGIC DEVICES:

STANDARD FOR DESCRIPTION OF FAST CMOS TTL COMPATIBLE LOGIC:

STANDARD FOR DESCRIPTION OF A 3.3 V, ZERO DELAY CLOCK DISTRIBUTION DEVICE COMPLIANT WITH THE JESD21-C PC133 REGISTERED DIMM SPECIFICATION

STANDARD FOR DESCRIPTION OF A 3.3 V, 18-BIT, LVTTL I/O REGISTER FOR PC133 REGISTERED DIMM APPLICATIONS:

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