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Title	Document #	Date
GUIDELINES FOR PREPARING CUSTOMER-SUPPLIED BACKGROUND INFORMATION RELATING TO A SEMICONDUCTOR-DEVICE FAILURE ANALYSIS: Status: Reaffirmed January 2025	JEP134	Sep 1998
The purpose of this Guideline is to provide a vehicle for acquiring and transmitting the necessary information in a concise, organized, and consistent format. Included in the Guideline is a sample form that facilitates transferring the maximum amount of background data to the failure analyst in a readily interpretable format. Immediate availability of this key information assists that analyst in completing a timely and accurate failure analysis. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14.4 Free download. Registration or login required.
Registration - Plastic Chip Carrier (PLCC) Shipping/Handling Tubes. Item 11.5-501.	CO-033-A	Aug 1998
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
SPD Annex F, Address Multiplexed ROM	SPD4.1.2.6	Jun 1998
Release No.8 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Design Requirements - Plastic Ultra-Thin Small outline No-Lead Package. R-PDSO-N/USON.	DG-4.16A	Feb 1998
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
NATIONAL ELECTRONIC PROCESS CERTIFICATION STANDARD; GOVERNMENT CONTRACTORS: Removed: August 25, 2003	EIA599-A	Jan 1998
Due to notification from the JC-14.4 subcommittee that the material contained in EIA599 has been replaced by the ISO 9000 series, the JEDEC Board of Directors, at its August 2003 meeting, approved to remove this standard from the JEDEC Free Download Area. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14.4
SPD Annex C, Fast Page and Extended Data Out RAM	SPD4.1.2.3	Jan 1998
Release No.8 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
100 Pin DRAM, SDRAM, and ROM DIMM	MODULE4.4.8	Dec 1997
Release No. 8 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
80 Pin EEPROM SIMM	MODULE4.4.7	Dec 1997
Release No.8 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
72 Pin DRAM SIMM	MODULE4.4.2	Dec 1997
Release No.8 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Registration - Stacked TSOPII Package (2 and 4 High). Item 11.11-429. April 2003	MO-201-A	Oct 1997
This outline has been inactivated, please see attachment. The file can be located by going to the JEP95 Main Page, under Microelectronic Outlines, Archives. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Dynamic Random Access Memory (DRAM) Table of Contents	DRAM3.9.TOC	Jul 1997
Release No. 9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Byte Wide ECL SRAM	SRAM3.7.6	Jul 1997
Release No. 9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Bit Wide ECL SRAM	SRAM3.7.2	Jul 1997
Release No. 9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.2 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
EEPROM Introduction	EEPROM3.5	Jul 1997
Release No.1 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Byte Wide	EPROM3.4.1	Jul 1997
Release No.9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.2 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
EPROM Introduction	EPROM3.4	Jul 1997
Release No.9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
278 Pin Buffered SDRAM DIMM	MODULE4.6.1	Jun 1997
Release No.9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
4.6 Table of Contents - Sixteen Byte Modules	MODULE4.6	Jun 1997
Release No.9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
112 Pin MPDRAM DIMM	MODULE4.4.6	Jun 1997
Release No.9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
88 Pin DRAM SO-DIMM	MODULE4.4.5	Jun 1997
Release No.9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
72 Pin DRAM SO-DIMM	MODULE4.4.4	Jun 1997
Release No. 9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
88 Pin DRAM Card Status: Reaffirmed	MODULE4.4.3	Jun 1997
Release No.9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Four Byte Modules and Cards Table of Contents	MODULE4.4.TOC	Jun 1997
Release No. 9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
64 & 72 Pin ZIP/SIMM SRAM Module	MODULE4.4.1	Jun 1997
Release No.9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Two Byte Modules Cards	MODULE4.3	Jun 1997
Release No.9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
One Byte Modules	MODULE4.2	Jun 1997
Release No. 9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Memory Module Nomenclature	SPD4.1.1	Jun 1997
Release No.9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Bit Wide SDRAM	SDRAM3.11.1	Jun 1997
Release No.9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
MPDRAM Optional Features	MPDRAM3.10.4	Jun 1997
Release No.9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Byte Wide MPDRAM	MPDRAM3.10.2	Jun 1997
Release No.9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Nibble Wide MPDRAM	MPDRAM3.10.1	Jun 1997
Release No.9 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
BOND WIRE MODELING STANDARD:	JESD59	Jun 1997
This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-15.2 Free download. Registration or login required.
QUALITY SYSTEM ASSESSMENT - SUPERSEDED BY ANSI/EIA-670, June 1997. Status: Superseded	JESD39-A	Jun 1997
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14.4 Free download. Registration or login required.
Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA. Status: Elevated to MS-034	MO-151-D	Jun 1997
Item 11.11-555. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page
THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)- SUPERSEDED BY JESD51-4, September 1997. Status: ElevatedSeptember 1997	JEP129	Feb 1997
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-15.1 Free download. Registration or login required.
COMPONENT PROBLEM ANALYSIS AND CORRECTIVE ACTION REQUIREMENTS - SUPERSEDED BY EIA-671, November 1996. Status: Superseded	JESD43	Nov 1996
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14.4 Free download. Registration or login required.
GUIDE FOR STANDARD PROBE PAD SIZES AND LAYOUTS FOR WAFER LEVEL ELECTRICAL TESTING: Status: Rescinded September 2021 (JC-14.2-21-182)	JEP128	Nov 1996
This guide has been replaced by JESD241: September 2021. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14.2
ADDENDUM No. 8 to JESD8 - STUB SERIES TERMINATED LOGIC FOR 3.3 VOLTS (SSTL_3) A 3.3 V VOLTAGE BASED INTERFACE STANDARD FOR DIGITAL INTEGRATED CIRCUITS	JESD8-8	Aug 1996
This standard is a result of a major effort by the JC-16 Committee to develop a high performance CMOS-based interface suitable for high speed main memory applications in excess of 125 MHz. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-16 Free download. Registration or login required.
Design Requirements - Metric Small Outline J-Leaded Package Design Guide	DG-4.13	Aug 1996
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES:	JESD51- 3	Aug 1996
This standard describes design requirements for a single layer, leaded surface mount integrated circuit package thermal test board. The standard describes board material and geometry requirements, minimum trace lenghts, trace thickness, and routing considerations. Application includes still air and moving air thermal tests. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-15.1 Free download. Registration or login required.

Standards & Documents Search

GUIDELINES FOR PREPARING CUSTOMER-SUPPLIED BACKGROUND INFORMATION RELATING TO A SEMICONDUCTOR-DEVICE FAILURE ANALYSIS:

Registration - Plastic Chip Carrier (PLCC) Shipping/Handling Tubes. Item 11.5-501.

SPD Annex F, Address Multiplexed ROM

Design Requirements - Plastic Ultra-Thin Small outline No-Lead Package. R-PDSO-N/USON.

NATIONAL ELECTRONIC PROCESS CERTIFICATION STANDARD; GOVERNMENT CONTRACTORS:

SPD Annex C, Fast Page and Extended Data Out RAM

100 Pin DRAM, SDRAM, and ROM DIMM

80 Pin EEPROM SIMM

72 Pin DRAM SIMM

Registration - Stacked TSOPII Package (2 and 4 High). Item 11.11-429.

Dynamic Random Access Memory (DRAM) Table of Contents

Byte Wide ECL SRAM

Bit Wide ECL SRAM

EEPROM Introduction

Byte Wide

EPROM Introduction

278 Pin Buffered SDRAM DIMM

4.6 Table of Contents - Sixteen Byte Modules

112 Pin MPDRAM DIMM

88 Pin DRAM SO-DIMM

72 Pin DRAM SO-DIMM

88 Pin DRAM Card

Four Byte Modules and Cards Table of Contents

64 & 72 Pin ZIP/SIMM SRAM Module

Two Byte Modules Cards

One Byte Modules

Memory Module Nomenclature

Bit Wide SDRAM

MPDRAM Optional Features

Byte Wide MPDRAM

Nibble Wide MPDRAM

BOND WIRE MODELING STANDARD:

QUALITY SYSTEM ASSESSMENT - SUPERSEDED BY ANSI/EIA-670, June 1997.

Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA.

THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)- SUPERSEDED BY JESD51-4, September 1997.

COMPONENT PROBLEM ANALYSIS AND CORRECTIVE ACTION REQUIREMENTS - SUPERSEDED BY EIA-671, November 1996.

GUIDE FOR STANDARD PROBE PAD SIZES AND LAYOUTS FOR WAFER LEVEL ELECTRICAL TESTING:

ADDENDUM No. 8 to JESD8 - STUB SERIES TERMINATED LOGIC FOR 3.3 VOLTS (SSTL_3) A 3.3 V VOLTAGE BASED INTERFACE STANDARD FOR DIGITAL INTEGRATED CIRCUITS

Design Requirements - Metric Small Outline J-Leaded Package Design Guide

LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES:

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