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Title	Document #	Date
SPD Annex H, ESDRAM Superset	SPD4.1.2.8	Jun 1999
Release No.9 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Byte Wide DRAM	DRAM3.9.3	Jun 1999
Release No. 9 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Nibble Wide DRAM	DRAM3.9.2	Jun 1999
Release No. 9 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Bit Wide DRAM	DRAM3.9.1	Jun 1999
Release No. 9 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Word Wide EPROM	EPROM3.4.2	Jun 1999
Release No.9 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
DESCRIPTION OF 5 V BUS SWITCH WITH TTL-COMPATIBLE CONTROL INPUTS:	JESD73	Jun 1999
This standard covers specifications for a family of 5 V NMOS FET bus switch devices with 5 V TTL compatible control inputs. Not included in this document are device-specific parameters and performance levels that the vendor must also apply for full device description. Committee(s): JC-40 Free download. Registration or login required.
2.5 V BiCMOS LOGIC DEVICE FAMILY SPECIFICATION WITH 5 V TOLERANT INPUTS AND OUTPUTS:	JESD70	Jun 1999
The purpose is to provide a standard for 2.5 V nominal supply voltage logic devices, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use, thus providing compatibility between devices operating between 2.3 V and 2.7 V supply voltages, as well as overvoltage tolerance with devices operating at 3.3 V, or 5 V. Committee(s): JC-40 Free download. Registration or login required.
SYMBOL AND LABELS FOR MOISTURE-SENSITIVE DEVICES - SUPERSEDED BY J-STD-033, April 2018. Status: Rescinded, November 2018	JEP113B	May 1999
Certain PSMC (Plastic Surface-mount Components) are subject to permanent damage due to moisture-induced failures encountered during high-temperature surface-mount processing unless appropriate precautions are observed. The purpose of this publication is to provide a distinctive symbol and labels to be used to identify those devices that require special packing and handling precautions. Committee(s): JC-14.1 Free download. Registration or login required.
SDRAM Parametric Standards	SDRAM3.11.6	Apr 1999
Release No. 9 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
144 Pin DDR SGRAM SO-DIMM	MODULE4.5.9	Mar 1999
Release No. 9 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
144 Pin SDRAM SO-DIMM	MODULE4.5.6	Mar 1999
Release No.9 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
144 Pin DRAM SO-DIMM	MODULE4.5.5	Mar 1999
Release No.9 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
168 Pin DRAM DIMM	MODULE4.5.1	Mar 1999
Release No.9 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
INTEGRATED CIRCUIT THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS - FORCED CONVECTION (MOVING AIR):	JESD51- 6	Mar 1999
This standard specifies the environmental conditions for determining thermal performance of an integrated circuit device in a forced convection environment when mounted on a standard thermal test board. Committee(s): JC-15.1 Free download. Registration or login required.
I/O DRIVERS AND RECEIVERS WITH CONFIGURABLE COMMUNICATION VOLTAGE, IMPEDANCE, AND RECEIVER THRESHOLD:	JESD67	Feb 1999
This standard attempts to aid in the design of electronic systems comprised of components that operate at several different supply voltages. This document covers respectively configurable I/O voltage, receiver type and switchpoint, and driver impedance. Committee(s): JC-16 Free download. Registration or login required.
HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES:	JESD51- 7	Feb 1999
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in electronic components. The objective of the standard is to provide a high effective thermal conductivity mounting surface that can be compared equally against standard tests done in different laboratories with typical variations of less than or equal to 10%. Committee(s): JC-15.1 Free download. Registration or login required.
EXTENSION OF THERMAL TEST BOARD STANDARDS FOR PACKAGES WITH DIRECT THERMAL ATTACHMENT MECHANISMS:	JESD51- 5	Feb 1999
This extension of the thermal standards provides a standard fixture for direct attach type packages such as deep-downset of thermally tabbed packages. This specification provides additional design detail for use in developing thermal test boards with application to these package types. This document is in addition to and not replacement for the design specifications in other standards. Committee(s): JC-15.1 Free download. Registration or login required.
Standard - TSOP II, Thin Matrix Tray for Shipping and Handling of FBGA's. Item 11.5-519.	CS-005-B	Nov 1998
Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
GUIDELINES FOR PREPARING CUSTOMER-SUPPLIED BACKGROUND INFORMATION RELATING TO A SEMICONDUCTOR-DEVICE FAILURE ANALYSIS:	JEP134	Sep 1998
The purpose of this Guideline is to provide a vehicle for acquiring and transmitting the necessary information in a concise, organized, and consistent format. Included in the Guideline is a sample form that facilitates transferring the maximum amount of background data to the failure analyst in a readily interpretable format. Immediate availability of this key information assists that analyst in completing a timely and accurate failure analysis. Committee(s): JC-14.6 Free download. Registration or login required.
Registration - Plastic Chip Carrier (PLCC) Shipping/Handling Tubes. Item 11.5-501.	CO-033-A	Aug 1998
Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
SPD Annex F, Address Multiplexed ROM	SPD4.1.2.6	Jun 1998
Release No.8 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Design Requirements - Plastic Ultra-Thin Small outline No-Lead Package. R-PDSO-N/USON.	DG-4.16A	Feb 1998
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
NATIONAL ELECTRONIC PROCESS CERTIFICATION STANDARD; GOVERNMENT CONTRACTORS: Removed: August 25, 2003	EIA599-A	Jan 1998
Due to notification from the JC-14.4 subcommittee that the material contained in EIA599 has been replaced by the ISO 9000 series, the JEDEC Board of Directors, at its August 2003 meeting, approved to remove this standard from the JEDEC Free Download Area. Committee(s): JC-14.4
SPD Annex C, Fast Page and Extended Data Out RAM	SPD4.1.2.3	Jan 1998
Release No.8 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
100 Pin DRAM, SDRAM, and ROM DIMM	MODULE4.4.8	Dec 1997
Release No. 8 Committee(s): JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
80 Pin EEPROM SIMM	MODULE4.4.7	Dec 1997
Release No.8 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
72 Pin DRAM SIMM	MODULE4.4.2	Dec 1997
Release No.8 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Registration - Stacked TSOPII Package (2 and 4 High). Item 11.11-429. April 2003	MO-201-A	Oct 1997
This outline has been inactivated, please see attachment. The file can be located by going to the JEP95 Main Page, under Microelectronic Outlines, Archives. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Dynamic Random Access Memory (DRAM) Table of Contents	DRAM3.9.TOC	Jul 1997
Release No. 9 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Byte Wide ECL SRAM	SRAM3.7.6	Jul 1997
Release No. 9 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Bit Wide ECL SRAM	SRAM3.7.2	Jul 1997
Release No. 9 Committee(s): JC-42, JC-42.2 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
EEPROM Introduction	EEPROM3.5	Jul 1997
Release No.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Byte Wide	EPROM3.4.1	Jul 1997
Release No.9 Committee(s): JC-42, JC-42.2 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
EPROM Introduction	EPROM3.4	Jul 1997
Release No.9 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
278 Pin Buffered SDRAM DIMM	MODULE4.6.1	Jun 1997
Release No.9 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
4.6 Table of Contents - Sixteen Byte Modules	MODULE4.6	Jun 1997
Release No.9 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
112 Pin MPDRAM DIMM	MODULE4.4.6	Jun 1997
Release No.9 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
88 Pin DRAM SO-DIMM	MODULE4.4.5	Jun 1997
Release No.9 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
72 Pin DRAM SO-DIMM	MODULE4.4.4	Jun 1997
Release No. 9 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
88 Pin DRAM Card Status: Reaffirmed	MODULE4.4.3	Jun 1997
Release No.9 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.

Standards & Documents Search

SPD Annex H, ESDRAM Superset

Byte Wide DRAM

Nibble Wide DRAM

Bit Wide DRAM

Word Wide EPROM

DESCRIPTION OF 5 V BUS SWITCH WITH TTL-COMPATIBLE CONTROL INPUTS:

2.5 V BiCMOS LOGIC DEVICE FAMILY SPECIFICATION WITH 5 V TOLERANT INPUTS AND OUTPUTS:

SYMBOL AND LABELS FOR MOISTURE-SENSITIVE DEVICES - SUPERSEDED BY J-STD-033, April 2018.

SDRAM Parametric Standards

144 Pin DDR SGRAM SO-DIMM

144 Pin SDRAM SO-DIMM

144 Pin DRAM SO-DIMM

168 Pin DRAM DIMM

INTEGRATED CIRCUIT THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS - FORCED CONVECTION (MOVING AIR):

I/O DRIVERS AND RECEIVERS WITH CONFIGURABLE COMMUNICATION VOLTAGE, IMPEDANCE, AND RECEIVER THRESHOLD:

HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES:

EXTENSION OF THERMAL TEST BOARD STANDARDS FOR PACKAGES WITH DIRECT THERMAL ATTACHMENT MECHANISMS:

Standard - TSOP II, Thin Matrix Tray for Shipping and Handling of FBGA's. Item 11.5-519.

GUIDELINES FOR PREPARING CUSTOMER-SUPPLIED BACKGROUND INFORMATION RELATING TO A SEMICONDUCTOR-DEVICE FAILURE ANALYSIS:

Registration - Plastic Chip Carrier (PLCC) Shipping/Handling Tubes. Item 11.5-501.

SPD Annex F, Address Multiplexed ROM

Design Requirements - Plastic Ultra-Thin Small outline No-Lead Package. R-PDSO-N/USON.

NATIONAL ELECTRONIC PROCESS CERTIFICATION STANDARD; GOVERNMENT CONTRACTORS:

SPD Annex C, Fast Page and Extended Data Out RAM

100 Pin DRAM, SDRAM, and ROM DIMM

80 Pin EEPROM SIMM

72 Pin DRAM SIMM

Registration - Stacked TSOPII Package (2 and 4 High). Item 11.11-429.

Dynamic Random Access Memory (DRAM) Table of Contents

Byte Wide ECL SRAM

Bit Wide ECL SRAM

EEPROM Introduction

Byte Wide

EPROM Introduction

278 Pin Buffered SDRAM DIMM

4.6 Table of Contents - Sixteen Byte Modules

112 Pin MPDRAM DIMM

88 Pin DRAM SO-DIMM

72 Pin DRAM SO-DIMM

88 Pin DRAM Card

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