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Title	Document #	Date
Registration - Fully Molded Flange Header Family, Full-Pak. B2E-PSIP-F	TO-281A	Nov 2011
Item 11.11-854 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Generic Carrier Family. Variations AA-AC. Item 11.5-314.	CO-013-B	Jan 1993
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Grid Array Family, 3.18 mm Pitch. Variations AA-AB.	MO-005-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Gullwing Plastic Surface Mount. Item 11.10-359.	DO-216-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family .200 inch Pin Circle. Variations AA-AH. Ref. TO-76, TO-73, TO-74, TO-75, TO-77, TO-78, TO-79.	MO-002-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family .200 inch Pin Circle. Variations AJ-AL. Ref. TO-80, TO-99.	MO-002-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family Flat Index.	TO-226-G	May 1983
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family, .100 Pin Circle. Variations AA-AG. Item 11.2-109.	TO-206-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family, .200 Pin Circle. Variations AA-AG. Item 11.2-109.	TO-205-E
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family, 5.842 mm Pin Circle. Variations AA-AD. Ref. TO-96, TO-97, TO-100.	MO-006-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family, 5.842 mm Pin Circle. Variations AE-AH. Ref. TO-101.	MO-006-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family, Flat Index. See TO-226AA	TO-237-B	Oct 1979
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family, Peripheral Terminal. Variations AA-AB. (SOT-89). Item 11.10-213.	TO-243-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .100 mil Pitch, 5 Leads. Item 11.10-249.	MO-078-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .200 inch Wide, 5.08 Spacing, 3 Leads. Item 11.10-251.	TO-258-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638.	MO-245-A	Sep 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Horizontal Staggered Surface Mount Package 0.40 mm Lead Pitch. Item 11.11-514.	MO-213-A	Dec 1969
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - J-Lead Ceramic CERQUAD Package Family .050 inch Pitch. Item 11.10-286.	MO-087-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Land Grid Array Family, Rectangular, 0.50 mm Pitch	MO-303B	Mar 2012
Item No. 11.11-857 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lead Mounted Family (Round Lead Axial). Item 78, 73, 128.	DO-204B-D	Jul 1985
The file is a combination of Issue B, Issue C, and Issue D, containing variations AA through AR. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lead Mounted Family, Axial Type, Chamfer (Round) Body Diode. PALF (Ref. DO-27, DO-32, DO-39)	DO-201B	Nov 2013
Item 11.10-453 Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leaded Ceramic Chip Carrier .050 inch Center, 68 and 84 Terminals. Item 11.11-138.	MO-044-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leadless Flatpack Family, 1.27 mm Terminal Spacing. Item 11.3-055.	MO-027-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.	MO-144-A
Committee(s): JC-11 Free download. Registration or login required.
Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.	MO-144-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leadless Small Outline Ceramic Chip Carrier, .400 inch Body, .050 inch Pitch. 28, 32, 26 Leads. Variations AA-AC. Item 11.10-318.	MO-126-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Plastic Quad Flatpack Family .025 Lead Spacing (Gullwing). Item 11.11-267.	MO-086-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Small Outline J-Lead Package (LSOJ). Addition of 66 Lead Variation. Item 11.11-512.	MO-199-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Square Ball Grid Array Family. S-LBGA-B/LBGA.	MO-192-F	Jul 2003
Item 11.11-659 Patents(): National Semiconductor, Citizen Watch Company: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.	MO-272-A	May 2006
Item 11.11-737 Patents(): STMicroelectronics Inc.: European Patent EP1557881. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E.	MO-275-A.01	Jul 2011
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.	MO-205-G	Jul 2006
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile, Fine Pitch, Ball Grid Array (FBGA) Registration, 0.80 mm pitch (Square and Rectangle). LF-XBGA, LFR-XBGA.	MO-219-G	Jan 2007
Item 11.11-763 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, SQUARE, 0.40 mm Top, 0.40 mm Bottom Pitch. S-XBGA.	MO-302C	Aug 2016
Item No.11-930 Patents(): Amkor: 7,185,426; ASAT: 7,372,151; Texas Instruments: 7,675,152, 7,944034; Micron: 7,671,459 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, Square, 0.65 mm Top, 0.50 mm Bottom Pitch. S-XBGA	MO-325A	Aug 2016
Item No. 11-927 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, Square, 0.80 mm Top, 0.50 mm Bottom Pitch. S-XBGA	MO-326A	Aug 2016
Item No. 11-928 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Magazine Family, Dual-In-Line (DIP), 7.620 mm Row Spacing. Variation AA.	CO-003-B	May 1978
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Magazine Family, Dual-In-Line (DIP), 7.620 mm Row Spacing. Variations AA-AB.	CO-001-B	May 1978
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Magazine for Dual-In-Line Product (DIP), 7.62, 10.16, 15.24 mm Row Spacing. Variations AA-AF.	CO-005-A	May 1979
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Magazine, Type A, B and D, 68 Pin Leadless Ceramic Chip Carrier.	CO-006-A	Nov 1982
Item 11.5-81-39B Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Fully Molded Flange Header Family, Full-Pak. B2E-PSIP-F

Registration - Generic Carrier Family. Variations AA-AC. Item 11.5-314.

Registration - Grid Array Family, 3.18 mm Pitch. Variations AA-AB.

Registration - Gullwing Plastic Surface Mount. Item 11.10-359.

Registration - Header Family .200 inch Pin Circle. Variations AA-AH. Ref. TO-76, TO-73, TO-74, TO-75, TO-77, TO-78, TO-79.

Registration - Header Family .200 inch Pin Circle. Variations AJ-AL. Ref. TO-80, TO-99.

Registration - Header Family Flat Index.

Registration - Header Family, .100 Pin Circle. Variations AA-AG. Item 11.2-109.

Registration - Header Family, .200 Pin Circle. Variations AA-AG. Item 11.2-109.

Registration - Header Family, 5.842 mm Pin Circle. Variations AA-AD. Ref. TO-96, TO-97, TO-100.

Registration - Header Family, 5.842 mm Pin Circle. Variations AE-AH. Ref. TO-101.

Registration - Header Family, Flat Index. See TO-226AA

Registration - Header Family, Peripheral Terminal. Variations AA-AB. (SOT-89). Item 11.10-213.

Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .100 mil Pitch, 5 Leads. Item 11.10-249.

Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .200 inch Wide, 5.08 Spacing, 3 Leads. Item 11.10-251.

Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638.

Registration - Horizontal Staggered Surface Mount Package 0.40 mm Lead Pitch. Item 11.11-514.

Registration - J-Lead Ceramic CERQUAD Package Family .050 inch Pitch. Item 11.10-286.

Registration - Land Grid Array Family, Rectangular, 0.50 mm Pitch

Registration - Lead Mounted Family (Round Lead Axial). Item 78, 73, 128.

Registration - Lead Mounted Family, Axial Type, Chamfer (Round) Body Diode. PALF (Ref. DO-27, DO-32, DO-39)

Registration - Leaded Ceramic Chip Carrier .050 inch Center, 68 and 84 Terminals. Item 11.11-138.

Registration - Leadless Flatpack Family, 1.27 mm Terminal Spacing. Item 11.3-055.

Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.

Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.

Registration - Leadless Small Outline Ceramic Chip Carrier, .400 inch Body, .050 inch Pitch. 28, 32, 26 Leads. Variations AA-AC. Item 11.10-318.

Registration - Low Profile Plastic Quad Flatpack Family .025 Lead Spacing (Gullwing). Item 11.11-267.

Registration - Low Profile Small Outline J-Lead Package (LSOJ). Addition of 66 Lead Variation. Item 11.11-512.

Registration - Low Profile Square Ball Grid Array Family. S-LBGA-B/LBGA.

Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.

Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E.

Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.

Registration - Low Profile, Fine Pitch, Ball Grid Array (FBGA) Registration, 0.80 mm pitch (Square and Rectangle). LF-XBGA, LFR-XBGA.

Registration - Lower PoP Ball Grid Array Family, SQUARE, 0.40 mm Top, 0.40 mm Bottom Pitch. S-XBGA.

Registration - Lower PoP Ball Grid Array Family, Square, 0.65 mm Top, 0.50 mm Bottom Pitch. S-XBGA

Registration - Lower PoP Ball Grid Array Family, Square, 0.80 mm Top, 0.50 mm Bottom Pitch. S-XBGA

Registration - Magazine Family, Dual-In-Line (DIP), 7.620 mm Row Spacing. Variation AA.

Registration - Magazine Family, Dual-In-Line (DIP), 7.620 mm Row Spacing. Variations AA-AB.

Registration - Magazine for Dual-In-Line Product (DIP), 7.62, 10.16, 15.24 mm Row Spacing. Variations AA-AF.

Registration - Magazine, Type A, B and D, 68 Pin Leadless Ceramic Chip Carrier.

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