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This Test Method standardizes the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components.

Committee(s): JC-14, JC-14.1

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This document defines the LPDDR4 standard, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this specification is to define the minimum set of requirements for a JEDEC compliant 16 bit per channel SDRAM device with either one or two channels. LPDDR4 dual channel device density ranges from 2 Gb through 32 Gb and single channel density ranges from 1 Gb through 16 Gb.

Committee(s): JC-42, JC-42.6

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Item 11-1051

Package Designator:  PDSO-G#_...

Committee(s): JC-11, JC-11.11

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Item 11-1054

Package Designator: PQFP-N28_I4p0...

Committee(s): JC-11, JC-11.10

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Item #11.5-1057

Committee(s): JC-11, JC-11.5

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Designator: N/A

Item #: 11.5-1041

Committee(s): JC-11, JC-11.5

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This standard defines the specifications of interface parameters, signaling protocols, and features for PMIC device as used for memory module applications. The designation PMIC5020 refers to the device specified by this document.

The purpose is to provide a standard for the PMIC5020 device for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

Committee(s): JC-40, JC-40.1

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Designator: PBGA--B264[294]_I0p60-R8p7X14p4Z1p0-C0p3Z#

Item: 11-1050 

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Committee(s): JC-11, JC-11.11

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This standard defines the specifications of interface parameters, signaling protocols, environmental requirements, packaging, and other features as reference for specific target implementations of CXL-attached memory modules.

Committee(s): JC-45

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This publication describes a method to test the electromigration susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages.

Committee(s): JC-14, JC-14.1

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This document defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the DDR5 Clock Driver (CKD) for re-driving the DCK for CUDIMM, CSODIMM and CAMM applications. The DDR5CKD01 Device ID is DID = 0x0531. (5 = DDR5,
3= Clock Driver, 1= rev 01)

Committee(s): JC-40, JC-40.4

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Package Designator: PMSO-E17_I1p2...

Item 11.11-1046, 

Committee(s): JC-11, JC-11.11

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This standard defines the electrical and mechanical requirements for 288-pin, 1.1 V (VDD), Clocked, Unbuffered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR5 SDRAM CUDIMMs). These DDR5 Clocked Unbuffered DIMMs (CUDIMMs) are intended for use as main memory when installed in Computers.

Committee(s): JC-45, JC-45.3

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This standard defines the electrical and mechanical requirements for 262-pin, 1.1 V (VDD), Clocked Small Outline, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR5 SDRAM CSODIMMs). These DDR5 CSODIMMs are intended for use as main memory when installed in Computers, laptops and other systems.

Committee(s): JC-45, JC-45.3

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This standard describes a serialized interface between data converters and logic devices. It contains normative information to enable designers to implement devices that communicate with other devices covered by this specification. Informative annexes are included to clarify and exemplify the document.

Committee(s): JC-16

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This publication contains frequently recommended and accepted JEDEC reliability stress tests applied to surface-mount solid state devices.

Committee(s): JC-14, JC-14.3

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This Test Method establishes a uniform method for performing solid state device package power cycling stress test.

Committee(s): JC-14, JC-14.1

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This standard establishes the procedure for testing, evaluation and classification of devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined latch-up stress.

This standard has been adopted by the Defense Logistics Agency (DLA) as project 5962-1880.

Committee(s): JC-14, JC-14.1

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The purpose of this standard is to describe Zoned Storage for UFS, which enables higher bandwidth, lower latency and to reduce write amplification.

Patents(): Huawei 201911209032.1; 116166570,A Memory Technologies LLC 101952808 104657284 2248023 3493067 602009056490.0 602009064847.0 HK1210296 5663720 6602823 10-1281326 10-1468824 2248023 3493067 2248023 3493067 8307180 8601228 9063850 9367486 10540094 11550476

Committee(s): JC-64, JC-64.1

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