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Title	Document #	Date
Registration - Header Family, Flat Index. See TO-226AA	TO-237-B	Oct 1979
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family, Peripheral Terminal. Variations AA-AB. (SOT-89). Item 11.10-213.	TO-243-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .100 mil Pitch, 5 Leads. Item 11.10-249.	MO-078-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .200 inch Wide, 5.08 Spacing, 3 Leads. Item 11.10-251.	TO-258-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638.	MO-245-A	Sep 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Horizontal Staggered Surface Mount Package 0.40 mm Lead Pitch. Item 11.11-514.	MO-213-A	Dec 1969
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - J-Lead Ceramic CERQUAD Package Family .050 inch Pitch. Item 11.10-286.	MO-087-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Land Grid Array Family, Rectangular, 0.50 mm Pitch	MO-303B	Mar 2012
Item No. 11.11-857 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lead Mounted Family (Round Lead Axial). Item 78, 73, 128.	DO-204B-D	Jul 1985
The file is a combination of Issue B, Issue C, and Issue D, containing variations AA through AR. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lead Mounted Family, Axial Type, Chamfer (Round) Body Diode. PALF (Ref. DO-27, DO-32, DO-39)	DO-201B	Nov 2013
Item 11.10-453 Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leaded Ceramic Chip Carrier .050 inch Center, 68 and 84 Terminals. Item 11.11-138.	MO-044-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leadless Flatpack Family, 1.27 mm Terminal Spacing. Item 11.3-055.	MO-027-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.	MO-144-A
Committee(s): JC-11 Free download. Registration or login required.
Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.	MO-144-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leadless Small Outline Ceramic Chip Carrier, .400 inch Body, .050 inch Pitch. 28, 32, 26 Leads. Variations AA-AC. Item 11.10-318.	MO-126-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Plastic Quad Flatpack Family .025 Lead Spacing (Gullwing). Item 11.11-267.	MO-086-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Small Outline J-Lead Package (LSOJ). Addition of 66 Lead Variation. Item 11.11-512.	MO-199-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Square Ball Grid Array Family. S-LBGA-B/LBGA.	MO-192-F	Jul 2003
Item 11.11-659 Patents(): National Semiconductor, Citizen Watch Company: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.	MO-272-A	May 2006
Item 11.11-737 Patents(): STMicroelectronics Inc.: European Patent EP1557881. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E.	MO-275-A.01	Jul 2011
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.	MO-205-G	Jul 2006
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile, Fine Pitch, Ball Grid Array (FBGA) Registration, 0.80 mm pitch (Square and Rectangle). LF-XBGA, LFR-XBGA.	MO-219-G	Jan 2007
Item 11.11-763 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, SQUARE, 0.40 mm Top, 0.40 mm Bottom Pitch. S-XBGA.	MO-302C	Aug 2016
Item No.11-930 Patents(): Amkor: 7,185,426; ASAT: 7,372,151; Texas Instruments: 7,675,152, 7,944034; Micron: 7,671,459 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, Square, 0.65 mm Top, 0.50 mm Bottom Pitch. S-XBGA	MO-325A	Aug 2016
Item No. 11-927 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, Square, 0.80 mm Top, 0.50 mm Bottom Pitch. S-XBGA	MO-326A	Aug 2016
Item No. 11-928 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Magazine Family, Dual-In-Line (DIP), 7.620 mm Row Spacing. Variation AA.	CO-003-B	May 1978
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Magazine Family, Dual-In-Line (DIP), 7.620 mm Row Spacing. Variations AA-AB.	CO-001-B	May 1978
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Magazine for Dual-In-Line Product (DIP), 7.62, 10.16, 15.24 mm Row Spacing. Variations AA-AF.	CO-005-A	May 1979
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Magazine, Type A, B and D, 68 Pin Leadless Ceramic Chip Carrier.	CO-006-A	Nov 1982
Item 11.5-81-39B Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - MCR Plug Family, 36 mm, 46 mm and 56 mm Flat Plastic Tube Sizes, Magazine. Variations AA-AC. Item 11.5-351.	CO-025-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - MCR Tube Family, 36 mm, 46 mm and 56 mm Flat Plastic Tube Sizes, Magazine. Variations AA-AC. Item 11.5-350.	CO-026-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metal Enclosure for SSD Devices, E1.S and M.2	MO-348A	Jul 2021
Designator: MMXH-R(##)x36p75Z(##) Item: 11.14-205, Access STP Files for MO-348A Cross Reference: N/A Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric Plastic Quad Flatpack, 1.0, 0.8, 0.65 mm. Item 11.11-449.	MO-108-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric Quad Flatpack Family (Plastic) 3.9 mm Footprint. Item 11.11-422.	MO-112-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric Super Format Tape Automated Bonding (TAB) Package Family.	UO-018-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric TSOP II, 16 mm Body Width, 40 and 62 Leads. Item 11.11-454.	MO-182-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Mixed Pitch (0.80 & 1.00 mm), Rectangular Die Size, Fine Dual Pitch Ball Grid Array (DSBGA) family. TFR-XBGA-N. Item 11.4-611	MO-233-C	Feb 2003
Includes editorial correction of the ball array identification lettering (replace S with T). Item 11.1-652(E). Committee(s): JC-11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - mSATA SSD 0.80 mm Pitch Socket Outline. SKT	SO-015A	Dec 2011
Item 11.14-133 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - mSATA SSD Assembly. DIM.	MO-300C	Mar 2015
Item 11.14-175 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Multichip Module (MCM) Ceramic Quad Flatpack Family. S-CQFP.	MO-148-A	Jun 1993
Item 11.10-334 Committee(s): JC-11.10, JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Header Family, Flat Index. See TO-226AA

Registration - Header Family, Peripheral Terminal. Variations AA-AB. (SOT-89). Item 11.10-213.

Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .100 mil Pitch, 5 Leads. Item 11.10-249.

Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .200 inch Wide, 5.08 Spacing, 3 Leads. Item 11.10-251.

Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638.

Registration - Horizontal Staggered Surface Mount Package 0.40 mm Lead Pitch. Item 11.11-514.

Registration - J-Lead Ceramic CERQUAD Package Family .050 inch Pitch. Item 11.10-286.

Registration - Land Grid Array Family, Rectangular, 0.50 mm Pitch

Registration - Lead Mounted Family (Round Lead Axial). Item 78, 73, 128.

Registration - Lead Mounted Family, Axial Type, Chamfer (Round) Body Diode. PALF (Ref. DO-27, DO-32, DO-39)

Registration - Leaded Ceramic Chip Carrier .050 inch Center, 68 and 84 Terminals. Item 11.11-138.

Registration - Leadless Flatpack Family, 1.27 mm Terminal Spacing. Item 11.3-055.

Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.

Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.

Registration - Leadless Small Outline Ceramic Chip Carrier, .400 inch Body, .050 inch Pitch. 28, 32, 26 Leads. Variations AA-AC. Item 11.10-318.

Registration - Low Profile Plastic Quad Flatpack Family .025 Lead Spacing (Gullwing). Item 11.11-267.

Registration - Low Profile Small Outline J-Lead Package (LSOJ). Addition of 66 Lead Variation. Item 11.11-512.

Registration - Low Profile Square Ball Grid Array Family. S-LBGA-B/LBGA.

Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.

Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E.

Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.

Registration - Low Profile, Fine Pitch, Ball Grid Array (FBGA) Registration, 0.80 mm pitch (Square and Rectangle). LF-XBGA, LFR-XBGA.

Registration - Lower PoP Ball Grid Array Family, SQUARE, 0.40 mm Top, 0.40 mm Bottom Pitch. S-XBGA.

Registration - Lower PoP Ball Grid Array Family, Square, 0.65 mm Top, 0.50 mm Bottom Pitch. S-XBGA

Registration - Lower PoP Ball Grid Array Family, Square, 0.80 mm Top, 0.50 mm Bottom Pitch. S-XBGA

Registration - Magazine Family, Dual-In-Line (DIP), 7.620 mm Row Spacing. Variation AA.

Registration - Magazine Family, Dual-In-Line (DIP), 7.620 mm Row Spacing. Variations AA-AB.

Registration - Magazine for Dual-In-Line Product (DIP), 7.62, 10.16, 15.24 mm Row Spacing. Variations AA-AF.

Registration - Magazine, Type A, B and D, 68 Pin Leadless Ceramic Chip Carrier.

Registration - MCR Plug Family, 36 mm, 46 mm and 56 mm Flat Plastic Tube Sizes, Magazine. Variations AA-AC. Item 11.5-351.

Registration - MCR Tube Family, 36 mm, 46 mm and 56 mm Flat Plastic Tube Sizes, Magazine. Variations AA-AC. Item 11.5-350.

Registration - Metal Enclosure for SSD Devices, E1.S and M.2

Registration - Metric Plastic Quad Flatpack, 1.0, 0.8, 0.65 mm. Item 11.11-449.

Registration - Metric Quad Flatpack Family (Plastic) 3.9 mm Footprint. Item 11.11-422.

Registration - Metric Super Format Tape Automated Bonding (TAB) Package Family.

Registration - Metric TSOP II, 16 mm Body Width, 40 and 62 Leads. Item 11.11-454.

Registration - Mixed Pitch (0.80 & 1.00 mm), Rectangular Die Size, Fine Dual Pitch Ball Grid Array (DSBGA) family. TFR-XBGA-N. Item 11.4-611

Registration - mSATA SSD 0.80 mm Pitch Socket Outline. SKT

Registration - mSATA SSD Assembly. DIM.

Registration - Multichip Module (MCM) Ceramic Quad Flatpack Family. S-CQFP.

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