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Title	Document #	Date
Registration - DDR2 SDRAM DIMM (Dual Inline Memory Module) Family with 1.00 mm Contact Centers.	MO-237-G.01	Apr 2011
Item 11.14-128, 11.14-128E Patents(): Hitachi: 5,227,664 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR2 SDRAM DIMM (Dual Inline memory Module) Family, Flex-Based, 1.00 mm Contact Centers.	MO-281-A	Nov 2006
Item 11.14-100 Patents(): STAKTEK: See Outline Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR3 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. SKT. Item 11.14-123	SO-014A	Jul 2008
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR3 DIMM 240 Position Socket Outline, 1.00 mm Contact centers	SO-007B	Sep 2008
Item 11.14-119 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR3 DIMM Connector Insertion Force Gauge. Item 11.14-110.	GS-008-A	Oct 2007
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR3 SDRAM DIMM (Dual Inline Memory Module) Family, Flex-Based, 1.00 mm contact Centers	MO-290-A	Nov 2007
Item 11.14-118 Patents(): STAKTEK, See Outline Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR3 Single Sided SODIMM 204 Pin Socket Outline with 0.60 mm Pitch. SKT	SO-020A	Jan 2014
Item No. 11.14-153 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - DDR4 DIMM Press Fit 288 Pin Socket Outline, 0.85 mm Pitch. SKT	SO-019C.01	Apr 2016
Item 14-181(E) Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR4 DIMM PTH 288 Pin Socket Outline, 0.85 mm Pitch. SKT	SO-016C.01	Apr 2016
Item No. 14-181(E) Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR4 DIMM SMT, 288 Pin Socket Outline, 0.85 mm Pitch. SKT	SO-017C.01	Apr 2016
Item No. 14-181(E) Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR4 MiniDIMM SMT 288 pin socket outline 0.50 mm pitch	SO-021A	Feb 2015
Item No. 11.14-174 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR4 Small Outline Dual Inline Memory Module (SODIMM), 260 pin, 0.50 mm pitch Socket Outline	SO-018D	Oct 2015
Item No. 14-180 Patents(): Foxconn: 5,882,211; 6,126,472; 6,113,398 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631.	MO-211-C	Jun 2004
Committee(s): JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dimensional update and removal of land pattern from the SOP/SOT registration. R-PDSO-G. Item 11.10-416	TO-261-C	May 2002
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Disc Type Family. Variation AE. Item 118.	DO-200-E
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Disc Type Family. Variations AA-AD.	DO-200-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Disc Type Family. Variations AE-AF. Item 92-3/119.	TO-200-J
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual in-line compatible, thermally enhanced, plastic very thin fine pitch, QFN package family, includes addition of Very Thin Profile variations. HW-PQFP-N/HV-PQFP-N/PSO-N. Item 11.11-662.	MO-241-B	Aug 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual in-line Family. 7.62 mm Row Spacing. Variations: AJ-AM.	MO-001-F	Jun 1983
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual Inline Memory Module (DIMM) Family, 184 Pin DDR w/ 1.27 mm Contact Centers. Item 11.14-078	MO-206-E	Jan 2006
Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual Pitch Number Ball Grid Array Family, Square, 0.80 mm Major, 0.65 mm Minor Pitch. (T,V)F-SBGA	MO-315A	Feb 2015
Item No. 11-903 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line (DIP) Family Plastic Shrink Package, .400 inch Row Spacing, .070 inch Pitch, 30, 32 and 36 Leads. Item 11.11-274.	MO-026-D	Jul 1991
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line (DIP) Family, .300 inch Row Spacing, 4 Lead. Item 120.	TO-250-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line (DIP) Family, 12.70 mm Row Spacing, Variations AA-AB.	MO-024-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line (DIP) Family, 5.08 mm Row Spacing. 10 Pin. Item 11.3-027.	MO-028-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line (Wide Body) Plastic Family .300 inch Row Spacing. Item 11.11-262/266.	MO-095-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line Cerdip Family .600 inch Row Spacing. Item 11.10-383	MO-103-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line Gauge, 4 Lead, Axial Type.	GS-001
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line Gauge, 4 Lead, Axial Type.	GS-002
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line Package 19.05 mm Row Spacing. Item 11.11-143.	MO-043-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line Plastic (DIP) Family, .600 inch Row Spacing. Item 11.11-293.	MO-015-G
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line Plastic (DIP) Family, .900 inch Row Spacing. Addition of 50, 52 and 64 Leads. Item 11.11-276	MO-016-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-Pitch, rectangular Ball Grid Array package, 0.50 mm x 0.65 mm Pitch. LFR-XBGA	MO-307A	Dec 2011
Item 11.11-856 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Edge Clip SIP Module Family, .100 Row Centers. Addition of Variation AF. Item 11.14-004.	MO-068-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Enclosure Form Factor for Automotive SSD Connector, Board Mount	SO-030A	Feb 2022
Designator: PBCX-K4_... Item: 11.14-211, Access STP Files for SO-030A Cross Reference: MO-348 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Enclosure Form Factor for Automotive SSD Connector, Cable Mount	SO-029A	Jan 2022
Designator: PBXC-K4_D#p##-MR36p05x14p5Z10p25-HS Item: 11.14-210, Access STP Files for SO-029A Cross Reference: MO-348 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Extra Thin Profile, Fine Pitch, Internal Stacking Module (ISM) with Single Interconnect Array (0.75/0.80 mm Pitch, Square, Rectangular). X1F-XLGA.	MO-270-B	Jun 2008
Item 11.11-790 Patents(): 7,056,476; 7,057,269; 6,933,598; 7,045,887; 6,906,416; 7,049,691; 7,053,477; 7,034,387; 6,838,761; 6,972,481; 7,061,088; 7,064,425; 7,101,731; 7,253,511; Applications: 20060226536; 20070278658 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Extremely Thin, Two Row Cavity Down, 0.50 mm Pitch BGA Family. The addition of -2, max matrix, variations to XFBGA. Item 11.11-604.	MO-221-C	Jun 2001
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Family of Round Leads, .050 inch Pitch, Gullwing Leadform, Center Ceramic Chip Carrier. Item 11.10-293.	MO-111-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - FBDIMM (Dual In-Line Memory Module) Family, Flex-Based, 1.00 mm Contact Centers.	MO-282-A	Jan 2007
Item 11.14-099 Patents(): STAKTEK: See Outline Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - DDR2 SDRAM DIMM (Dual Inline Memory Module) Family with 1.00 mm Contact Centers.

Registration - DDR2 SDRAM DIMM (Dual Inline memory Module) Family, Flex-Based, 1.00 mm Contact Centers.

Registration - DDR3 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. SKT. Item 11.14-123

Registration - DDR3 DIMM 240 Position Socket Outline, 1.00 mm Contact centers

Registration - DDR3 DIMM Connector Insertion Force Gauge. Item 11.14-110.

Registration - DDR3 SDRAM DIMM (Dual Inline Memory Module) Family, Flex-Based, 1.00 mm contact Centers

Registration - DDR3 Single Sided SODIMM 204 Pin Socket Outline with 0.60 mm Pitch. SKT

REGISTRATION - DDR4 DIMM Press Fit 288 Pin Socket Outline, 0.85 mm Pitch. SKT

Registration - DDR4 DIMM PTH 288 Pin Socket Outline, 0.85 mm Pitch. SKT

Registration - DDR4 DIMM SMT, 288 Pin Socket Outline, 0.85 mm Pitch. SKT

Registration - DDR4 MiniDIMM SMT 288 pin socket outline 0.50 mm pitch

Registration - DDR4 Small Outline Dual Inline Memory Module (SODIMM), 260 pin, 0.50 mm pitch Socket Outline

Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631.

Registration - Dimensional update and removal of land pattern from the SOP/SOT registration. R-PDSO-G. Item 11.10-416

Registration - Disc Type Family. Variation AE. Item 118.

Registration - Disc Type Family. Variations AA-AD.

Registration - Disc Type Family. Variations AE-AF. Item 92-3/119.

Registration - Dual in-line compatible, thermally enhanced, plastic very thin fine pitch, QFN package family, includes addition of Very Thin Profile variations. HW-PQFP-N/HV-PQFP-N/PSO-N. Item 11.11-662.

Registration - Dual in-line Family. 7.62 mm Row Spacing. Variations: AJ-AM.

Registration - Dual Inline Memory Module (DIMM) Family, 184 Pin DDR w/ 1.27 mm Contact Centers. Item 11.14-078

Registration - Dual Pitch Number Ball Grid Array Family, Square, 0.80 mm Major, 0.65 mm Minor Pitch. (T,V)F-SBGA

Registration - Dual-In-Line (DIP) Family Plastic Shrink Package, .400 inch Row Spacing, .070 inch Pitch, 30, 32 and 36 Leads. Item 11.11-274.

Registration - Dual-In-Line (DIP) Family, .300 inch Row Spacing, 4 Lead. Item 120.

Registration - Dual-In-Line (DIP) Family, 12.70 mm Row Spacing, Variations AA-AB.

Registration - Dual-In-Line (DIP) Family, 5.08 mm Row Spacing. 10 Pin. Item 11.3-027.

Registration - Dual-In-Line (Wide Body) Plastic Family .300 inch Row Spacing. Item 11.11-262/266.

Registration - Dual-In-Line Cerdip Family .600 inch Row Spacing. Item 11.10-383

Registration - Dual-In-Line Gauge, 4 Lead, Axial Type.

Registration - Dual-In-Line Gauge, 4 Lead, Axial Type.

Registration - Dual-In-Line Package 19.05 mm Row Spacing. Item 11.11-143.

Registration - Dual-In-Line Plastic (DIP) Family, .600 inch Row Spacing. Item 11.11-293.

Registration - Dual-In-Line Plastic (DIP) Family, .900 inch Row Spacing. Addition of 50, 52 and 64 Leads. Item 11.11-276

Registration - Dual-Pitch, rectangular Ball Grid Array package, 0.50 mm x 0.65 mm Pitch. LFR-XBGA

Registration - Edge Clip SIP Module Family, .100 Row Centers. Addition of Variation AF. Item 11.14-004.

Registration - Enclosure Form Factor for Automotive SSD Connector, Board Mount

Registration - Enclosure Form Factor for Automotive SSD Connector, Cable Mount

Registration - Extra Thin Profile, Fine Pitch, Internal Stacking Module (ISM) with Single Interconnect Array (0.75/0.80 mm Pitch, Square, Rectangular). X1F-XLGA.

Registration - Extremely Thin, Two Row Cavity Down, 0.50 mm Pitch BGA Family. The addition of -2, max matrix, variations to XFBGA. Item 11.11-604.

Registration - Family of Round Leads, .050 inch Pitch, Gullwing Leadform, Center Ceramic Chip Carrier. Item 11.10-293.

Registration - FBDIMM (Dual In-Line Memory Module) Family, Flex-Based, 1.00 mm Contact Centers.

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