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This document defines the Graphics Double Data Rate 6 (GDDR6) Synchronous Graphics Random Access Memory (SGRAM) specification, including features, functionality, package, and pin assignments. The purpose of this Standard is to define the minimum set of requirements for 8 Gb through 16 Gb x16 dual channel GDDR6 SGRAM devices. System designs based on the required aspects of this standard will be supported by all GDDR6 SGRAM vendors providing compatible devices. Some aspects of the GDDR6 standard such as AC timings and capacitance values were not standardized. Some features are optional and therefore may vary among vendors. In all cases, vendor data sheets should be consulted for specifics. This document was created based on some aspects of the GDDR5 Standard (JESD212).

Committee(s): JC-42.3C

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This publication is a guideline to test facilities in their efforts to establish and maintain consistent particle impact noise detection (PIND) testing.

Committee(s): JC-13, JC-13.5

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This standard was jointly developed by JEDEC and the Open NAND Flash Interface Workgroup, hereafter referred to as ONFI. This standard defines a standard NAND flash device interface interoperability standard that provides means for system be designed that can support Asynchronous SDR, Synchronous DDR and Toggle DDR NAND flash devices that are interoperable between JEDEC and ONFI member implementations.

Committee(s): JC-42.4

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This document defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the DDR5 Clock Driver (CKD) for re-driving the DCK for CUDIMM, CSODIMM and CAMM applications. The DDR5CK01 Device ID is DID = 0x0531. (5 = DDR5, 3= Clock Driver, 1= rev 01).

Committee(s): JC-40.4

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The manufacturers identification code is defined by one or more 8 bit fields, each consisting of 7 data bits plus 1 odd parity bit. The manufacturers identification code is assigned, maintained and updated by the JEDEC Office. The intent of this identification code is that it may be used whenever a digital field is required, e.g., hardware, software, documentation, etc. To make a request for an ID Code please go to https://www.jedec.org/standards-documents/id-codes-order-form

Committee(s): JC-42, JC-42.3

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This document describes design of test structures needed to assess the reliability of aluminum-copper, refractory metal barrier interconnect systems. This includes any metal interconnect system where a refractory metal barrier or other barrier material prevents the flow of aluminum and/or copper metal ions from moving between interconnect layers. This document is not intended to show design of test structures to assess aluminum or aluminum-copper alloy systems, without barriers to Al and Cu ion movement, nor for Cu only metal systems. Some total interconnect systems might not include barrier materials on all metal layers. The structures in this standard are designed for cases where a barrier material separates two Al or Al alloy metal layers. The purpose of this document is to describe the design of test structures needed to assess electromigration (EM) and stress-induced-void (SIV) reliability of AlCu barrier metal systems.

Committee(s): JC-14.2, JC-14.21

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Designator: N/A
Item: 11.5-1001, Access STP File for CO-038A
Cross Reference: N/A

Committee(s): JC-11.5

JEP95 Registrations Main Page

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This standard defines the specifications of interface parameters, signaling protocols, and features for PMIC device asused for memory module applications. The designation PMIC5000, PMIC5010 refers to the device specified by this document. The purpose is to provide a standard for the PMIC5000, PMIC5010 device for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

Committee(s): JC-40.1

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Designator: PQFP-E#_I0p65-R...
Item: 11.11-1028, Access STP File for MO-355A
Cross Reference: N/A

Committee(s): JC-11.11

JEP95 Registrations Main Page

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Item 140.07B.

This section provides electrical interface items related to Multi-Chip Packages (MCP) and Stacked-Chip Scale Packages (SCSP) of mixed memory technologies including Flash (NOR and NAND), SRAM, PSRAM, LPDRAM, USF, etc. These items include die-on-die stacking within a single encapsulated package, package-on-package or module-in-package technologies, etc. The Section also contains Silicon Pad Sequence information for the various memory technologies to aid in the design and electrical optimization of the memory sub-system or complete memory stacked solution.

Committee(s): JC-64.2

JESD21-C Solid State Memory Documents Main Page

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Terminology update.  This FBDIMM DFx standard covers Design for Test, Design for Manufacturing, and Design for Validation (“DFx”) requirements and implementation guidelines for Fully Buffered DIMM technology.

Patents(): There are known patent issues that are common to all FBDIMM related specifications. See document for link to FBDIMM Patents.

Committee(s): JC-40, JC-40.5

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Terminology update.  

This standard defines the Graphics Double Data This standard defines the GDDR5X SGRAM memory standard, including features, device operation, electrical characteristics, timings, signal pin assignments, and package

Committee(s): JC-42.3, JC-42.3C

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Terminology update.   Definition of the SSTVN16859 2.5-2.6 V 13-Bit to 26-Bit SSTL_2 Registered Buffer for PC1600, PC2100, PC2700, and PC3200 DDR DIMM Applications

Committee(s): JC-40

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Terminology update.This document should be used in conjunction with the parent document, and is intended to function as an overview to support the effective use of Compact Thermal Model (CTM) methodologies as specified in the companion methods documents.

Committee(s): JC-15, JC-15.1

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This standard defines the specifications of interface parameters, signaling protocols, environmental requirements, packaging, and other features as reference for specific target implementations of CXL™-attached memory modules.The purpose is to provide certain reference base targets for CXL™-attached memory modules to enable system design simplification, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

Committee(s): JC-45

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Designator: PBGA-B#[#}_I0p4...
Item: 11.11-1006E (Minor editorial Change), Access STP File for MO-352A.01
Cross Reference: N/A

Committee(s): JC-11.11

JEP95 Registrations Main Page

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This download includes all files under the parent schema JEP30-10v2-0-0 (Committees: JC-11, JC-11.2) including:

• JEP30-A101v2-0-0 (Assembly Process),
  
  • Committees: JC-11, JC-11.2, JC-14
• JEP30-E101v2-0-0 (Electrical),
  
  • Committees: JC-11, JC-11.2, JC-16
• JEP30-P101v2-0-0 (Package),
  
  • Committees: JC-11, JC-11.2
• JEP30-S101v1-0-0 (Supply Chain),
  
  • Committees: JC-11, JC-11.2, JC-14
• JEP30-T101v2-0-0 (Thermal)
  
  • Committees: JC-11, JC-11.2, JC-15
• JEP30-D10v2-0-0 (Types Dictionary)
  
  • Committees: JC-11, JC-11.2

This will enable the user to validate the schemas. For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16

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This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-15

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This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-16

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