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Title	Document #	Date
DDR4 NVDIMM-P BUSS PROTOCOL	JESD304-4	Nov 2020
TEMPORARILY REMOVED 12/8/20. If your downloaded proir to this date please discard this iwill be republished shortly as JESD304-4.01An NVDIMM-P device is defined as a LRDIMM memory module which provides host controller access to DRAM and/or other memory devices such as persistent memory. A transactional protocol is described for NVDIMM-P, which may be used on a DDR interface allowing operation of both standard DRAM modules and NVDIMM-P modules on the same channel. Item 2233.98K. Committee(s): JC-45.6
Annex A, R/C A, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Unbuffered DIMM Design Specification Release Number: 30A	MODULE4.20.26.A	Nov 2020
This document defines the electrical and mechanical requirements for Raw Card A, 288-pin, 1.2 Volt (VDD), Unbuffered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM UDIMMs). These DDR4 Unbuffered DIMMs (UDIMMs) are intended for use as main memory when installed in PCs. Committee Item 2231.38A. Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Registration - Plastic Multi Position Flange Mount Mixed Technology, 0.10 in. Pitch Package	TO-220L.01	Nov 2020
Item 11.10-456(E) Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
SPD Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules, Release 6 Release Number: 30	SPD4.1.2.L-6	Nov 2020
This annex describes the serial presence detect (SPD) values for all DDR4 modules covered in Document Release 6. Differences between module types are encapsulated in subsections of this annex. These presence detect values are those referenced in the SPD standard document for ‘Specific Features’. Item 2220.01H. Committee(s): JC-45 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Registration - Plastic Quad Flatpack, 0.65 mm Pitch, 3.30 mm Body, Square Family Package	MO-346A	Nov 2020
Designator: PQFP-B#[#]_I0p65... Item: 11.11-981, Access STP Files for MO-346A Cross Reference: N/A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
UNIVERSAL FLASH STORAGE (UFS) CARD EXTENSION, Version 3.0	JESD220-2B	Nov 2020
This standard specifies the characteristics of the UFS card electrical interface and the memory device. This document defines the added/modified features in UFS card compared to embedded UFS device. For other common features JESD220, UFS, will be referenced. Patents(): Samsung: US D727910, US D736212, US D736215, US D736214, US D736213, US 29/546125, US 29/546150 Committee(s): JC-64.1 Available for purchase: $76.00 Add to Cart To help cover the costs of producing standards, JEDEC is now charging for non-member access to selected standards and design files. Most of the content on this site remains free to download with registration. Paying JEDEC member companies enjoy free access to all content. Learn more and apply today. Paying JEDEC Members may login for free access.
TEMPERATURE CYCLING	JESD22-A104F	Nov 2020
This standard provides a method for determining solid state devices capability to withstand extreme temperature cycling. This standard applies to single-, dual- and triple-chamber temperature cycling and covers component and solder interconnection testing. It should be noted that this standard does not cover or apply to thermal shock chambers. This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high- and low-temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Committee(s): JC-14.1 Free download. Registration or login required.
CYCLED TEMPERATURE HUMIDITY-BIAS WITH SURFACE CONDENSATION LIFE TEST	JESD22-A100E	Nov 2020
The Cycled Temperature-humidity-bias Life Test is performed for the purpose of evaluating the reliability of nonhermetic packaged solid state devices in humid environments. It employs conditions of temperature cycling, humidity, and bias that accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors that pass through it. The Cycled Temperature-Humidity-Bias Life Test is typically performed on cavity packages (e.g., MQUADs, lidded ceramic pin grid arrays, etc.) as an alternative to JESD22-A101 or JESD22-A110. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
CHARACTERIZATION OF INTERFACIAL ADHESION IN SEMICONDUCTOR PACKAGES	JEP167A	Nov 2020
This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle. Committee(s): JC-14.1 Free download. Registration or login required.
DDRx SPREAD SPECTRUM CLOCKING (SSC) STANDARD	JESD404-1	Nov 2020
Definition for all DDRx component documents to reference. This is generic to any DDRxtechnology. Item 1842.34 Committee(s): JC-42.3C Free download. Registration or login required.
Standard - Plastic Dual Small Outline, 1.27 mm pitch, 7.50 mm Body Width Rectangular Package Family	MS-013G	Oct 2020
Designator: PDSO-G#-I1p27... Item 11.11-967(S). Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
JEDEC MODULE SIDEBAND BUS (SidebandBus)	JESD403-1	Oct 2020
This standard defines the assumptions for the system management bus for next generation memory solutions; covering the interface protocol, use of hub devices, and voltages appropriate to these usages. Item 2260.37C. Committee(s): JC-45 Free download. Registration or login required.
Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick	MO-345A	Oct 2020
Designator: PDSO-G#_I0P5-##... Item: 11.11-984, Access STP Files for MO-345A Cross Reference: SO-023, GS-010C Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
JEDEC Manual of Organization and Procedure	JM21T	Oct 2020
The mission of JEDEC is to serve the solid state industry by creating, publishing, and promoting global acceptance of standards, and by providing a forum for technical exchange on leading industry topics. This manual provides guidance for JEDEC members and staff to perform their functions correctly in the standardization process. Committee(s): JC-BOD Free download. Registration or login required.
ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements	JEP181	Sep 2020
This standard establishes the requirements for the exchange of electronic thermal system level simulation models between supplier and end user in a single neutral file format. The data is held in an XML format, conforming to an XML schema that this document describes. Get the XML Schema: JEP181_Schema_R1p0. Committee(s): JC-15 Free download. Registration or login required.
Standard - Plastic Dual Small Outline (SO) Gull Wing, 1.27 mm Pitch Package	MS-012G.02	Sep 2020
Designator: PDSO-G#_I127-##... Item 11.11-972(E), Minor editorial correction. Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 12 Pin UFS Card, 0.91 mm Pitch	MO-320B	Sep 2020
Designator: PBMA-N11-I0p91-CturZ1p0 Item 11.11-985 Patents(): Samsung: US D727910, US D736212, US D736215, US D736214, US D736213, US 29/546125, US 29/546150 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick	MO-193F	Sep 2020
Designator: PDSO-G#_I0P##-##... Item 11.11-983 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline Gull Wing Package, 1.45 mm Thick	MO-178D	Sep 2020
Item 11.10-458 Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - 288 PIN DDR5 DIMM SMT, 0.85 MM PITCH SOCKET OUTLINE	SO-023C	Sep 2020
Designator: PDXC-LO288-I0p85-R162p0x6p5Z21p3-N5p20S3p1Z0p2 Item: 11.14-202, Access STP Files for SO-023C Cross Reference: MO-329, GS-010C Patents(): CN 202759077 U Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 288 Pin DDR5 DIMM, 0.85 mm Pitch Microelectronic Assembly	MO-329C	Sep 2020
Designator: PDMA-N288-I0p85-R133p8x... Item: 11.14-201, Access STP Files for MO-329C Cross Reference: SO-023, GS-010C Patents(): Micron: 7,547,213. Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
UNIVERSAL FLASH STORAGE, UFS 2.2	JESD220C-2.2	Aug 2020
The purpose of this standard is definition of a UFS Universal Flash Storage electrical interface and a UFS memory device. This standard defines a unique UFS feature set and includes the feature set of eMMC standard as a subset. This standard replaces JESD220C, UFS 2.1, and introduces a feature called WriteBooster. Item 138.88. Committee(s): JC-64.1 Free download. Registration or login required.
Annex E, R/C E, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Registered DIMM Design Specification Release Number: 30	MODULE4.20.28.E	Aug 2020
This specification defines the electrical and mechanical requirements for Raw Card E, 288-pin, 1.2 Volt (VDD), Registered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM RDIMMs). These DDR4 Registered DIMMs (RDIMMs) are intended for use as main memory when installed in PCs. Committee Item 2149.34a Committee(s): JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Annex D, Raw Card D, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Registered DIMM Design Specification Release Number: 30	MODULE4.20.28.D	Aug 2020
This specification defines the electrical and mechanical requirements for Raw Card D, 288-pin, 1.2 Volt (VDD), Registered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM RDIMMs). These DDR4 Registered DIMMs (RDIMMs) are intended for use as main memory when installed in PCs. Item 2149.08c Committee(s): JC-45, JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Annex B, R/C B, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Registered DIMM Design Specification Release Number: 30	MODULE4.20.28.B	Aug 2020
This document defines the electrical and mechanical requirements for Raw Card B, 288-pin, 1.2 Volt (VDD), Registered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM RDIMMs). These DDR4 Registered DIMMs (RDIMMs) are intended for use as main memory when installed in PCs. Committee Item 2149.38a. Committee(s): JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Annex A, R/C A, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Registered DIMM Design Specification Release Number: 30	MODULE4.20.28.A	Aug 2020
This specification defines the electrical and mechanical requirements for Raw Card A, 288-pin, 1.2 Volt (VDD), Registered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM RDIMMs). These DDR4 Registered DIMMs (RDIMMs) are intended for use as main memory when installed in PCs. Item 2149.40a. Committee(s): JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
REGISTRATION - Upper PoP, Plastic Bottom Grid Array Ball, 0.40 mm Pitch Rectangular Family Package	MO-344A	Aug 2020
Designator: PBGA-B#[#]_I0p40... Item: 11.11-976, Access STP File for MO-344A Cross Reference: DR4.18 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
UFS Card Socket Performance Standard	PS-004A	Jul 2020
For UFS Card 6 Gb/sItem 11.14-195S Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
BYTE ADDRESSABLE ENERGY BACKED INTERFACE	JESD245D	Jul 2020
The purpose of this standard is definition of an energy backed byte addressable function on a nonvolatile dual in-line memory module (NVDIMM). This standard defines the feature set and commands implemented by the energy backed byte addressable function on the NVDIMM. This standard is used in conjunction with JESD248. Item 2233.54F * A minor editorial change has been made to the table under 8.1.3.2, on page 47 on 9/1/2020, from the original posted version 8/18/2020. If you downloaded prior to 9/1/2020, please discard and use the current version. Committee(s): JC-45.6 Free download. Registration or login required.
Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch, Rectangular Family Package	MO-276O	Jul 2020
Designator: PBGA-B#[#]_I0p5... Item: 11.11-977, Access STP File for MO-276O Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
DDR5 SDRAM	JESD79-5	Jul 2020
This document defines the DDR5 SDRAM specification, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this Standard is to define the minimum set of requirements for JEDEC compliant 8Gb through 32Gb for x4, x8, and x16 DDR5 SDRAM devices. This standard was created based on the DDR4 standards (JESD79-4) and some aspects of the DDR, DDR2, DDR3 & LPDDR4 standards (JESD79, JESD79-2, JESD79-3 & JESD209-4). Item 1848.99G. Committee(s): JC-42.3B Available for purchase: $369.00 Add to Cart Paying JEDEC Members may login for free access.
TEMPERATURE GRADE AND MEASUREMENT SPECIFICATIONS FOR COMPONENTS AND MODULES	JESD402-1	Jul 2020
This document specifies standard temperature ranges that may be used, by way of referencing JESD402-1, in other standards, specifications, and datasheets when defining temperature related specifications. Item 1855.01A Committee(s): JC-42 Free download. Registration or login required.
PMIC50x0 POWER MANAGEMENT IC SPECIFICATION, Rev. 1	JESD301-1	Jun 2020
Definition of PMIC5000, PMIC5010 Voltage Regulator Device for Memory Module Applications Committee(s): JC-40.1 Free download. Registration or login required.
STANDARD MANUFACTURERS IDENTIFICATION CODE NOTE: JEP106U was in error starting with bank two an additional continuation code was added, JEP106U should be discarded.	JEP106BB	Jun 2020
The manufacturers identification code is defined by one or more 8 bit fields, each consisting of 7 data bits plus 1 odd parity bit. The manufacturers identification code is assigned, maintained and updated by the JEDEC Office. The intent of this identification code is that it may be used whenever a digital field is required, e.g., hardware, software, documentation, etc. To make a request for an ID Code please go to http://www.jedec.org/Home/MIDCODE_request.cfm Committee(s): JC-42, JC-42.3 Free download. Registration or login required.
Annex E, R/C E, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Unbuffered DIMM Design Specification Release Number: 30	MODULE4.20.26.E	Jun 2020
This specification defines the electrical and mechanical requirements for Raw Card E, 288-pin, 1.2 Volt (VDD), Unbuffered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM UDIMMs). These DDR4 Unbuffered DIMMs (UDIMMs) are intended for use as main memory when installed in PCs. Item 2231.17B. Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Annex B, R/C B, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Unbuffered DIMM Design Specification Release Number: 30	MODULE4.20.26.B	Jun 2020
This document defines the electrical and mechanical requirements for Raw Card B, 288-pin, 1.2 Volt (VDD), Unbuffered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM UDIMMs). These DDR4 Unbuffered DIMMs (UDIMMs) are intended for use as main memory when installed in PCs. Item 2231.29A. Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Annex G, Raw Card G, in 260-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM SODIMM Design Specification Release Number: 30	MODULE4.20.25.G	May 2020
This annex defines the electrical and mechanical requirements for Raw Card G, 260-pin, 1.2 Volt (VDD), Small Outline, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM SODIMMs). These DDR4 SODIMMs are intended for use as main memory when installed in PCs, laptops, and other systems. Item No. 2228.34C Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Annex E, R/C E, in 260-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM SODIMM Design Specification Release Number: 30	MODULE4.20.25.E	May 2020
This specification defines the electrical and mechanical requirements for Raw Card E, 260-pin, 1.2 Volt (VDD), Small Outline, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM SODIMMs). These DDR4 SODIMMs are intended for use as main memory when installed in PCs, laptops, and other systems. Item 2228.33C. Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Annex C, R/C C, in 260-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM SODIMM Design Specification Release Number: 30	MODULE4.20.25.C	May 2020
This annex defines the electrical and mechanical requirements for Raw Card C, 260-pin, 1.2 Volt (VDD), Small Outline, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR4 SDRAM SODIMMs). These DDR4 SODIMMs are intended for use as main memory when installed in PCs, laptops, and other systems. Item 2228.31B Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
1.05 V CMOS	JESD8-34	Apr 2020
This standard defines the input, output specifications and ac test conditions for devices that are designed to operate narrow range 1.05 V CMOS level. Item 159.01 Committee(s): JC-16 Free download. Registration or login required.

Standards & Documents Search

DDR4 NVDIMM-P BUSS PROTOCOL

Annex A, R/C A, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Unbuffered DIMM Design Specification

Registration - Plastic Multi Position Flange Mount Mixed Technology, 0.10 in. Pitch Package

SPD Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules, Release 6

Registration - Plastic Quad Flatpack, 0.65 mm Pitch, 3.30 mm Body, Square Family Package

UNIVERSAL FLASH STORAGE (UFS) CARD EXTENSION, Version 3.0

TEMPERATURE CYCLING

CYCLED TEMPERATURE HUMIDITY-BIAS WITH SURFACE CONDENSATION LIFE TEST

CHARACTERIZATION OF INTERFACIAL ADHESION IN SEMICONDUCTOR PACKAGES

DDRx SPREAD SPECTRUM CLOCKING (SSC) STANDARD

Standard - Plastic Dual Small Outline, 1.27 mm pitch, 7.50 mm Body Width Rectangular Package Family

JEDEC MODULE SIDEBAND BUS (SidebandBus)

Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick

JEDEC Manual of Organization and Procedure

ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements

Standard - Plastic Dual Small Outline (SO) Gull Wing, 1.27 mm Pitch Package

Registration - 12 Pin UFS Card, 0.91 mm Pitch

Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick

Registration - Plastic Dual Small Outline Gull Wing Package, 1.45 mm Thick

REGISTRATION - 288 PIN DDR5 DIMM SMT, 0.85 MM PITCH SOCKET OUTLINE

Registration - 288 Pin DDR5 DIMM, 0.85 mm Pitch Microelectronic Assembly

UNIVERSAL FLASH STORAGE, UFS 2.2

Annex E, R/C E, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Registered DIMM Design Specification

Annex D, Raw Card D, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Registered DIMM Design Specification

Annex B, R/C B, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Registered DIMM Design Specification

Annex A, R/C A, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Registered DIMM Design Specification

REGISTRATION - Upper PoP, Plastic Bottom Grid Array Ball, 0.40 mm Pitch Rectangular Family Package

UFS Card Socket Performance Standard

BYTE ADDRESSABLE ENERGY BACKED INTERFACE

Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch, Rectangular Family Package

DDR5 SDRAM

TEMPERATURE GRADE AND MEASUREMENT SPECIFICATIONS FOR COMPONENTS AND MODULES

PMIC50x0 POWER MANAGEMENT IC SPECIFICATION, Rev. 1

STANDARD MANUFACTURERS IDENTIFICATION CODE

Annex E, R/C E, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Unbuffered DIMM Design Specification

Annex B, R/C B, in 288-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM Unbuffered DIMM Design Specification

Annex G, Raw Card G, in 260-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM SODIMM Design Specification

Annex E, R/C E, in 260-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM SODIMM Design Specification

Annex C, R/C C, in 260-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM SODIMM Design Specification

1.05 V CMOS

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