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This standard defines the form, fit and function of SODIMM DDR5 connectors for modules supporting channels with transfer rates 6.4 GT/S and beyond. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.20 mm. The intent of this document is to provide performance standards to enable connector, system designers and manufacturers to build, qualify and use the SODIMM DDR5 connectors in client and server platforms. Item 14-226

Committee(s): JC-11, JC-11.14

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This standard defines the Graphics Double Data Rate 7 (GDDR7) Synchronous Graphics Random Access Memory (SGRAM) specification, including features, functionality, package, and pin assignments.

Committee(s): JC-42, JC-42.1

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This standard defines the overall specifications, interface parameters, signaling protocols, and features for a CXL® Memory Controller ASIC. The standard includes pinout information, functional description, and configuration interface. This standard, along with other Referenced Specifications, should be treated as a whole for the purposes of defining overall functionality for CXL® Memory Controller (referred to as CMC).

Committee(s): JC-40

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This standard provides a reference specification for systems and device management capabilities found in CXL memory devices. It is intended to target, but may not be limited to, CXL memory FRUs that are based on PCIe Gen 5 and compliant to the CXL 2.0 Specification or later.

Committee(s): JC-40, JC-45

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This document specifies standard temperature ranges that may be used, by way of referencing JESD402-1, in other standards, specifications, and datasheets when defining temperature related specifications.

Committee(s): JC-42

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The publication provides methodologies for measurements to qualify a new semiconductor wafer process.

Committee(s): JC-14, JC-14.2

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Designator: PBGA-B#[#]_I80...

Item: 11-1064

Cross Reference: DR4.5

Committee(s): JC-11, JC-11.11

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This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model.

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Committee(s): JC-11, JC-11.2, JC-16

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This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure.

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Committee(s): JC-11, JC-11.2

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Terminology Update, see Annex. This standard defines JEDEC requirements for solid state drives. For each defined class of solid state drive, the standard defines the conditions of use and the corresponding endurance verification requirements. Although endurance is to be rated based upon the standard conditions of use for the class, the standard also sets out requirements for possible additional use conditions as agreed to between manufacturer and purchaser.  Revision A includes further information on SSD Capacity. Items 303.19, 303.20, 303.21, 303.22, 303.23, 303.26, 303.27, 303.28, and 303.32

Committee(s): JC-64.8

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Designator:PDFN-N[#]_I1p27...

Item #: 11-1063

Committee(s): JC-11, JC-11.11

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This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model.

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Committee(s): JC-11, JC-11.2, JC-14.4

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This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model.

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Committee(s): JC-11, JC-11.2

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Designator: PBGA-B#[#]_I0p5...

Item #: 11-1066

Committee(s): JC-11, JC-11.11

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This standard establishes requirements for the generation of electronic-device package designators.

Committee(s): JC-11, JC-11.2

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Version 1.31

This standard defines the DDR5 SDRAM specification, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this Standard is to define the minimum set of requirements for JEDEC compliant 8 Gb through 32 Gb for x4, x8, and x16 DDR5 SDRAM devices. This standard was created based on the DDR4 standards (JESD79-4) and some aspects of the DDR, DDR2, DDR3, and LPDDR4 standards (JESD79, JESD79-2, JESD79-3, and JESD209-4).

Committee(s): JC-42, JC-42.3

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Item 142.12

This section provides electrical interface items related to Multi-Chip Packages (MCP) and Stacked-Chip Scale Packages (SCSP) of mixed memory technologies including Flash (NOR and NAND), SRAM, PSRAM, LPDRAM, USF, etc. These items include die-on-die stacking within a single encapsulated package, package-on-package or module-in-package technologies, etc. The Section also contains Silicon Pad Sequence information for the various memory technologies to aid in the design and electrical optimization of the memory sub-system or complete memory stacked solution.

Committee(s): JC-64.2

JESD21-C Solid State Memory Documents Main Page

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Designator: SO-032B_PDUtBXC-H644_I1p0-R17p15x78p0Z1p05
Item: 14-227
Cross Reference: N/A

Patents(): Patent NO: 9,425,525

Committee(s): JC-11, JC-11.14

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Designator:  XBNA-N#_I1p0_...

Item No:  14-229

Committee(s): JC-11, JC-11.14

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