Standards & Documents Search

Displaying 161 - 200 of 1471 documents. Show 5 | 10 | 20 | 40 | 60 results per page.

Title	Document #	Date
Registration - 88 Pin Memory Card. Item 11.14-012.	MO-171-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 68 Pin (Type I), 68-Pin (Type II) and 88 Pin Memory Card. Item 11.14-010.	MO-170-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 112 & 200 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Pitch. Item 11.14-041.	MO-172-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Quad Flatpack Family with Integral Heat Spreader. Item 11.11-403.	MO-173-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 44 and 48 Pin Plastic SOP, 12.6 mm Body, 1.27 mm Pitch. Item 11.11-412.	MO-175-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Shrink Small Outline Package (SSOP), 70-pin .8 mm Pitch, 3.9 mm Wide Body. Addition of 0.4 mm Variation. Item 11.11-401.	MO-174-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Zig Zag In-Line Family (2.54 mm Row Spacing). Item 11.10-353.	MO-176-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 278 Pin Dual-In-Line Meory module (DIMM) Family with 1.00 Lead Centers. Item 11.14-021.	MO-179-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Metric Small Outline J-Lead (MSOJ) Package, 16 mm Wide Body, 40 Pin. R-PDSO-J/SOJ. Item 11.11-418.	MO-181-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric TSOP II, 16 mm Body Width, 40 and 62 Leads. Item 11.11-454.	MO-182-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - TSOP I, 0.55 mm Pitch, 28 Leads. Item 11.11-426.	MO-183-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline Heat Slug Variation B: Addition of Longer Foot (L) Variations to SOP. Item 11.11-548.	MO-184-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 72 Pin Staggered Dual-Inline Module (SDIM) Family. Item 11.14-022.	MO-185-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Solid State Floppy Disk Card, 32Contact. Item 11.14-035. Editorial Correction of the TAB Clearance Dimension in Detail A from 0.01 mm to 0.10 mm. Item 11.14-035E.	MO-186-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic QFP/Heat Slug (H-LQP/G) 2.00 mm Thick/2.00 mm Footprint. Item 11.11-451.	MO-189-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power PQFP with Heat Slug. Item 11.11-559.	MO-188-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 160 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-027.	MO-191-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - TSSOP/HSSOP, 0Plastic Thin Shrink Small Outline Package. 0.40 mm Lead Pitch. Item 11.11-492.	MO-194-B
JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Ultra-Thin Small Outline No-Lead Package 0.5mm Pitch. Item 11.11-498.	MO-197-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Ultra-Thin Small Outline, No Lead Package. Item 11.11-508.	MO-196-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 3-Tier Family. PQFP-B. Item 11.11-473.	MO-198-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Small Outline J-Lead Package (LSOJ). Addition of 66 Lead Variation. Item 11.11-512.	MO-199-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead Package Assembly 2 High/4 High Stack. Item 11.11-513.	MO-200-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496.	MO-202-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Thin Shrink Fine Pitch Small Outline No Lead (TFSON) Package. Item 11.11-507.	MO-209-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Plastic Quad Flat Package, 1.0 mm Thick Body, 3.2 mm Footprint. Item 11.11-511.	MO-212-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Flange-Mounted Staggered Header Family, 7 & 9 Lead TO Style Package. Item 11.10-393	MO-218-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402.	MO-223-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050 inch Leadless Chip Carrier, Type A. Variations AA-AH.	MS-002-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050 inch Leadless Chip Carrier, Type B. Variation BA-BH.	MS-003-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050 inch Center Leadless Chip Carrier, Type C. Variations CA-CH. Item 11.10-237.	MS-004-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050 inch Center Leaded Chip Carrier, 24 Terminal Leaded, Type A.	MS-006-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050inch Center Leadless Chip Carrier, Type D. Variations DA-DH.	MS-005-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050 inch Center Lead Chip Carrier, Type B. Variations BA-BH.	MS-008-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050 inch Center Lead Chip Carrier, Type A. Variations AA-AH.	MS-007-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic DIP .400 inch Row Spacing, 28 and 32 Leads. Addition of Variations AC and AD. Item 11.11-306.	MS-010-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .040 inch Center Leadless Chip Carrier Packages. Variations AA-AJ.	MS-009-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic DIP .600 inch Row Spacing, 48 Lead. Addition of Variation AD. Item 11.4-238.	MS-011-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Single Layer Chip Carrier Family, .040 inch Terminal Spacing, Ceramic. Variations AA-AJ. Item 11.3-112.	MS-014-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Side Brazed Ceramic DIPs in .300 inch, .400 inch and .900 inch Center Line Row-to-Row Spacing. Item 11.10-272.	MS-015-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - 88 Pin Memory Card. Item 11.14-012.

Registration - 68 Pin (Type I), 68-Pin (Type II) and 88 Pin Memory Card. Item 11.14-010.

Registration - 112 & 200 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Pitch. Item 11.14-041.

Registration - Thin Quad Flatpack Family with Integral Heat Spreader. Item 11.11-403.

Registration - 44 and 48 Pin Plastic SOP, 12.6 mm Body, 1.27 mm Pitch. Item 11.11-412.

Registration - Plastic Shrink Small Outline Package (SSOP), 70-pin .8 mm Pitch, 3.9 mm Wide Body. Addition of 0.4 mm Variation. Item 11.11-401.

Registration - Ceramic Zig Zag In-Line Family (2.54 mm Row Spacing). Item 11.10-353.

Registration - 278 Pin Dual-In-Line Meory module (DIMM) Family with 1.00 Lead Centers. Item 11.14-021.

Registration - Plastic Metric Small Outline J-Lead (MSOJ) Package, 16 mm Wide Body, 40 Pin. R-PDSO-J/SOJ. Item 11.11-418.

Registration - Metric TSOP II, 16 mm Body Width, 40 and 62 Leads. Item 11.11-454.

Registration - TSOP I, 0.55 mm Pitch, 28 Leads. Item 11.11-426.

Registration - Small Outline Heat Slug Variation B: Addition of Longer Foot (L) Variations to SOP. Item 11.11-548.

Registration - 72 Pin Staggered Dual-Inline Module (SDIM) Family. Item 11.14-022.

Registration - Solid State Floppy Disk Card, 32Contact. Item 11.14-035. Editorial Correction of the TAB Clearance Dimension in Detail A from 0.01 mm to 0.10 mm. Item 11.14-035E.

Registration - Plastic QFP/Heat Slug (H-LQP/G) 2.00 mm Thick/2.00 mm Footprint. Item 11.11-451.

Registration - Power PQFP with Heat Slug. Item 11.11-559.

Registration - 160 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-027.

Registration - TSSOP/HSSOP, 0Plastic Thin Shrink Small Outline Package. 0.40 mm Lead Pitch. Item 11.11-492.

Registration - Plastic Ultra-Thin Small Outline No-Lead Package 0.5mm Pitch. Item 11.11-498.

Registration - Plastic Ultra-Thin Small Outline, No Lead Package. Item 11.11-508.

Registration - 3-Tier Family. PQFP-B. Item 11.11-473.

Registration - Low Profile Small Outline J-Lead Package (LSOJ). Addition of 66 Lead Variation. Item 11.11-512.

Registration - Small Outline J-Lead Package Assembly 2 High/4 High Stack. Item 11.11-513.

Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496.

Registration - Plastic Thin Shrink Fine Pitch Small Outline No Lead (TFSON) Package. Item 11.11-507.

Registration - Rectangular Plastic Quad Flat Package, 1.0 mm Thick Body, 3.2 mm Footprint. Item 11.11-511.

Registration - Plastic Flange-Mounted Staggered Header Family, 7 & 9 Lead TO Style Package. Item 11.10-393

Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402.

Standard - .050 inch Leadless Chip Carrier, Type A. Variations AA-AH.

Standard - .050 inch Leadless Chip Carrier, Type B. Variation BA-BH.

Standard - .050 inch Center Leadless Chip Carrier, Type C. Variations CA-CH. Item 11.10-237.

Standard - .050 inch Center Leaded Chip Carrier, 24 Terminal Leaded, Type A.

Standard - .050inch Center Leadless Chip Carrier, Type D. Variations DA-DH.

Standard - .050 inch Center Lead Chip Carrier, Type B. Variations BA-BH.

Standard - .050 inch Center Lead Chip Carrier, Type A. Variations AA-AH.

Standard - Plastic DIP .400 inch Row Spacing, 28 and 32 Leads. Addition of Variations AC and AD. Item 11.11-306.

Standard - .040 inch Center Leadless Chip Carrier Packages. Variations AA-AJ.

Standard - Plastic DIP .600 inch Row Spacing, 48 Lead. Addition of Variation AD. Item 11.4-238.

Standard - Single Layer Chip Carrier Family, .040 inch Terminal Spacing, Ceramic. Variations AA-AJ. Item 11.3-112.

Standard - Side Brazed Ceramic DIPs in .300 inch, .400 inch and .900 inch Center Line Row-to-Row Spacing. Item 11.10-272.

Pages

Search by Keyword or Document Number

Filter by committees:

Filter by document type:

Filter by keywords: