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Title	Document #	Date
Annex AB, R/C AB in 240-Pin PC3-6400/PC3-8500/PC3-10600/PC3-12800/PC3-14900/PC3-17000 DDR3 SDRAM Registered DIMM Design Specification	MODULE4.20.20.AB	May 2011
Release No. 21 Item 2202.01 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Annex A, R/C A in 240-Pin PC3-6400/PC3-8500/PC3-10600/PC3-12800/PC3-14900/PC3-17000 DDR3 SDRAM Registered DIMM Design Specification	MODULE4.20.20.A	May 2011
Release No. 21 Item 2082.28B, 2082.69, 2082.78, 2082.90 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45, JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Annex K, R/C K in 240-Pin PC3-6400/PC3-8500/PC3-10600/PC3-12800/PC3-14900/PC3-17000 DDR3 SDRAM Registered DIMM Design Specification (1Rx8 VLP).	MODULE4.20.20.K	May 2011
Release No. 21. Item 2145.12A, 2145.30 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45, JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
DDR3 Unbuffered Mini-DIMM, Annex B	PRN11-NM2	Jun 2011
Preliminary publication of BoD-approved ballot material, prior to its inclusion in the next release JESD21C. Item 2201.10 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
DDR3 Unbuffered Mini-DIMM, Annex A	PRN11-NM1	Jun 2011
Preliminary publication of BoD-approved ballot material, prior to its inclusion in the next release of JESD21C. Item 2207.11 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
DDR3 240-Pin Connector S-Parameters Specification This document was originally published in Section 4.20.19 of JESD21C, it is now placed in its own section, Section 4.8, in 21C. A cross-reference to Section 4.8 has been placed in Section 4.20.19.	MODULE4.8	Jun 2011
Release No. 21 Item 2170 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45.5 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E.	MO-275-A.01	Jul 2011
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
POD12 ‐ 1.2 V PSEUDO OPEN DRAIN INTERFACE	JESD8-24	Aug 2011
This document defines the 1.2 V Pseudo Open Drain Interface family of interface standards, POD12, which are generally expected to be implemented with differential amp-based input buffers that, when in single-ended mode, employ an externally supplied (or internal supplied) reference voltage controlled trip-point. Although this standard is named for the nominal value of VDDQ to be used, it is the input trip-point value that provides for inter operability of POD12 compliant devices. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-16 Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN.	MO-220-K.01	Aug 2011
Item 11.11-743(E). This outline replaces all previous issues. This is an editorial correction to modify the lead counts in Table 5C to match those of Table 9C for 12x12mm body 0.40 mm lead pitch. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
POD10-1.0 V PSUEDO OPEN DRAIN INTERFACE	JESD8-25	Sep 2011
This document defines the 1.0 V Pseudo Open Drain Interface family of interface standards, POD10, which are generally expected to be implemented with differential amp-based input buffers that, when in single-ended mode, employ an externally supplied (or internal supplied) reference voltage controlled trip-point. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-16 Free download. Registration or login required.
1.2 V HIGH-SPEED LVCMOS (HS_LVCMOS) INTERFACE	JESD8-26	Sep 2011
This standard defines the dc and ac input levels, output levels, and input overshoot and undershoot specifications for the 1.2 V High-speed LVCMOS (HS_LVCMOS) interface. The non-terminated interface has a switching range that is nominally expected to be 0 V to 1.2 V and is primarily intended to support communications with Wide I/O SDRAM devices. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-16 Free download. Registration or login required.
Addendum No. 2 to JESD79-3, 1.25 V DDR3U-800, DDR3U-1066, DDR3U-1333, and DDR3U-1600	JESD79-3-2	Oct 2011
The purpose of this addendum is to define the DDR3U specifications that supersede the DDR3 specifications in the JESD79-3. The use of DDR3-800, DDR3-1066, DDR3-1333, and DDR3-1600 titles in JESD79-3 are to be interpreted as DDR3U-800, DDR3U-1066, DDR3U-1333, and DDR3U-1600, respectively, when applying towards DDR3U definition; unless specifically stated otherwise. Item 1769.01 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42.3 Free download. Registration or login required.
GUIDELINE FOR INTERNAL GAS ANALYSIS FOR MICROELECTRONIC PACKAGES Status: Reaffirmed November 2020	JEP144A	Nov 2011
This guideline is applicable to hermetically sealed microelectronic components (including discrete semiconductors, monolithic and hybrid microcircuits). Specific cases with unique packaging, materials, or environmental constraints may not find all of the following information and procedures applicable. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-13 Free download. Registration or login required.
Registration - Fully Molded Flange Header Family, Full-Pak. B2E-PSIP-F	TO-281A	Nov 2011
Item 11.11-854 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
HERMETICITY Status: Reaffirmed September 2017	JESD22-A109B	Nov 2011
Testing for hermeticity on commercial product is not normally done on standard molded devices that are not hermetic. Commercial product that this test method applies to has a construction that produces a hermetic package; examples of this are ceramic and metal packages. Most of these tests are controlled and updated in the military standards, the two standards that apply are MIL-STD-750 for discretes, & MIL-STD-883 for microcircuits. The test within these standards can be used for all package types. Within these standards the tests are similar; MIL-STD-750 Test Method 1071 Hermetic Seal is recommended for any commercial hermetic requirements. For MIL-STD-883 the applicable test method is 1014 Seal. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14.1 Free download. Registration or login required.
Registration - mSATA SSD 0.80 mm Pitch Socket Outline. SKT	SO-015A	Dec 2011
Item 11.14-133 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-Pitch, rectangular Ball Grid Array package, 0.50 mm x 0.65 mm Pitch. LFR-XBGA	MO-307A	Dec 2011
Item 11.11-856 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
CUSTOMER NOTIFICATION OF PRODUCT/PROCESS CHANGES BY SOLID-STATE SUPPLIERS Status: SupersededBy J-STD-046, July 2016	JESD46D	Dec 2011
This standard establishes procedures to notify customers of semiconductor product and process changes. Requirements include: documentation; procedures for classification, notification and customer response; content; and records. Documentation of a suppliers change notification system should set clear and understandable expectations for both the originators of the change and their end customers. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14, JC-14.4
WIDE I/O SINGLE DATA RATE (WIDE I/O SDR)	JESD229	Dec 2011
This standard defines the Wide I/O specification, including features, functionality, AC and DC characteristics, packages, and micropillar signal assignments. This standard covers the following technologies: Wide I/O. The purpose of this standard is to define the minimum set of requirements for JEDEC compliant, 1 Gb through 32 Gb SDRAM (monolithic density) devices with 4, 128b wide channels using direct chip-to-chip attach methods between 1 to 4 memory devices and a controller device. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.6 Free download. Registration or login required.
PRODUCT DISCONTINUANCE Status: Supersededby J-STD-048, November 2014	JESD48C	Dec 2011
This standard establishes the requirements for timely customer notification of planned product discontinuance, which will assist customers in managing end-of-life supply, or to transition on-going requirements to alternate products. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14, JC-14.4
Registration - Scalable Quad Flat No-lead Packages, Square and Rectangular. H-PQFN, HL-PQFN.	MO-296B	Jan 2012
Item 11.11-849 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
IPC/JEDEC-9704A: PRINTED WIRING BOARD (PWB) STRAIN GAGE TEST GUIDELINE	JS9704A	Jan 2012
This document describes specific guidelines for strain gage testing for Printed Wiring Board (PWB)assemblies. The suggested procedures enables board manufacturers to conduct required strain gage testing independently, and provides a quantitative method for measuring board flexure, and assessing risk levels. The topics covered include: Test setup and equipment; requirements; Strain measurement; Report format A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
Package-on-Package (PoP) and Internal Stacked Module (ISM)	MCP3.12.2	Jan 2012
Release No. 22. Item 48.18, 48.24, 48.26, 38.21b, 48.06a, 38.26, 48.28, 48.29 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-63 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
144-Pin EP3-3200/EP3-4200/EP3-5300/EP3-6400 Unbuffered 32b-SO-DIMM Design Specification	MODULE4.20.22	Feb 2012
Release 22 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
240-Pin PC3-6400/PC3-8500/PC3-10600/PC3-12800/PC3-14900/PC3-17000 DDR3 SDRAM Registered DIMM Design Specification	MODULE4.20.20	Feb 2012
Release No. 22. Item 2082.94A A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45, JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Registration - Land Grid Array Family, Rectangular, 0.50 mm Pitch	MO-303B	Mar 2012
Item No. 11.11-857 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thick Thermally Enhanced Fine Pitch Square Ball Grid Array Family. BF-XBGA	MO-308A	Apr 2012
Item 11.11-853 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
MASTER TRACE FOR 128 GB SSD	JESD219A_MT	Jul 2012
The Master Trace file is a supporting file for implementation of the endurance verification client workload and is used in conjunction with JESD219A. This Master Trace represents actual SSD activity over a period of seven months. It is used as the client workload for endurance verification per JESD218 of SSDs with user capacities greater than or equal to 64 GB. This Master Trace may be used as the Test Trace for endurance verification of a 128 GB to 256 GB SSD with its existing LBA range. This Master trace may be compressed or expanded to be used with capacities less than 128 GB or greater than 256 GB, respectively. The compressed or expanded Test Trace shall be applicable to SSDs with a maximum LBA that is less than or equal to 2x the maximum LBA of the Test Trace (e.g., a user capacity from 1x to 2x of the Test Trace capacity supported). A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-64.8 Free download. Registration or login required.
TEST TRACE FOR 64 GB - 128 GB SSD	JESD219A_TT	Jul 2012
The Test Trace file is a supporting file for implementation of the endurance verification client workload and is used in conjunction with JESD219A. This Test Trace is derived from the 128 GB Master Trace using the compression method described in JESD219 to enable testing on SSDs with a capacity range of 64 GB to 128 GB. All characteristics of this Test Trace are identical to the Master Trace except that the maximum LBA represents an SSD user capacity of 64 GB. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-64.8 Free download. Registration or login required.
Registration - 244 Pin DDR2/DDR3 Mini Dual-In-Line Memory Module (DIMM) Family, 0.60 mm Lead Centers.	MO-244D	Jul 2012
Item No. 14-136 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Fine pitch, Rectangular Ball Grid Array Packages (FRBGA). Status: RescindedFebruary 2015	DR-4.6D.01	Jul 2012
This outline has been replaced by Design Registration 4.5J and Design Registration 4.27C. Item 11.2-838(S), 11-893R, 11-894R A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page
DDR3 SDRAM STANDARD	JESD79-3F	Jul 2012
This document defines the DDR3 SDRAM standard, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this Standard is to define the minimum set of requirements for JEDEC compliant 512 Mb through 8 Gb for x4, x8, and x16 DDR3 SDRAM devices. This document was created based on the DDR2 standard (JESD79-2) and some aspects of the DDR standard (JESD79). Each aspect of the changes for DDR3 SDRAM operation were considered and approved by committee ballots). The accumulation of these ballots were then incorporated to prepare this standard (JESD79-3), replacing whole sections and incorporating the changes into Functional Description and Operation. Item 1627.14 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42.3 Available for purchase: $247.00 Add to Cart To help cover the costs of producing standards, JEDEC is now charging for non-member access to selected standards and design files. Most of the content on this site remains free to download with registration. Paying JEDEC member companies enjoy free access to all content. Learn more and apply today. Paying JEDEC Members may login for free access.
Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON	MO-229F	Aug 2012
Item 11.11-861 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON.	MO-240C	Aug 2012
Item 11.11-860 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
TERMS, DEFINITIONS, AND LETTER SYMBOLS FOR DISCRETE SEMICONDUCTOR AND OPTOELECTRONIC DEVICES	JESD77D	Aug 2012
A revised and significantly expanded reference for technical writers and educators, manufacturers, buyers and users of discrete semiconductor and optoelectronic devices, is now available. This document includes extensive information on: letter symbol conventions; diodes and rectifiers (including signal, rectifier, microwave, tunnel and backward, voltage-regulator, voltage-reference, current regulator, and varactor diodes); transistors (including FETs, JFETs, and IGBTs); photosensitive devices, photoemitters, and optocouplers; thyristors and PUTs; and transient voltage suppressors. Terms and symbols, with their definitions, are arranged alphabetically by product type. Where applicable, graphical symbols are also included. The purpose of this standard is to promote the uniform use of symbols, abbreviations, terms, and definitions throughout the semiconductor industry. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-10 Free download. Registration or login required.
204-Pin EP3-6400/EP3-8500/EP3-10600/EP3-12800 DDR3 SDRAM 72b-S0-DIMM Design Specification	MODULE4.20.21	Aug 2012
Release 22. Item 2189.17 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45, JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Annex L, R/C L, in 240-Pin PC3-6400/PC3-8500/PC3-10600/PC3-12800 DDR3 SDRAM Registered DIMM Design Specification. Item 2145.13B	MODULE4.20.20.L	Sep 2012
Release No. 22. Item 2145.38 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45, JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Annex N, R/C N, in 240-Pin PC3-6400/PC3-8500/PC3-10600/PC3-12800 DDR3 SDRAM Registered DIMM Design Specification. Item 2145.22	MODULE4.20.20.N	Sep 2012
Release No. 22. Item 2145.35 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45, JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
R/C U, in 240-Pin PC3-6400/PC3-8500/PC3-10600/PC3-12800 DDR3 SDRAM Registered DIMM Design Specification	MODULE4.20.20.U	Sep 2012
Release 22. Item 2145.37 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45.1 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM), 0.8 mm Pitch, Socket Outline.	SO-008B	Oct 2012
Item 11.14-141 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Annex AB, R/C AB in 240-Pin PC3-6400/PC3-8500/PC3-10600/PC3-12800/PC3-14900/PC3-17000 DDR3 SDRAM Registered DIMM Design Specification

Annex A, R/C A in 240-Pin PC3-6400/PC3-8500/PC3-10600/PC3-12800/PC3-14900/PC3-17000 DDR3 SDRAM Registered DIMM Design Specification

Annex K, R/C K in 240-Pin PC3-6400/PC3-8500/PC3-10600/PC3-12800/PC3-14900/PC3-17000 DDR3 SDRAM Registered DIMM Design Specification (1Rx8 VLP).

DDR3 Unbuffered Mini-DIMM, Annex B

DDR3 Unbuffered Mini-DIMM, Annex A

DDR3 240-Pin Connector S-Parameters Specification

Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E.

POD12 ‐ 1.2 V PSEUDO OPEN DRAIN INTERFACE

Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN.

POD10-1.0 V PSUEDO OPEN DRAIN INTERFACE

1.2 V HIGH-SPEED LVCMOS (HS_LVCMOS) INTERFACE

Addendum No. 2 to JESD79-3, 1.25 V DDR3U-800, DDR3U-1066, DDR3U-1333, and DDR3U-1600

GUIDELINE FOR INTERNAL GAS ANALYSIS FOR MICROELECTRONIC PACKAGES

Registration - Fully Molded Flange Header Family, Full-Pak. B2E-PSIP-F

HERMETICITY

Registration - mSATA SSD 0.80 mm Pitch Socket Outline. SKT

Registration - Dual-Pitch, rectangular Ball Grid Array package, 0.50 mm x 0.65 mm Pitch. LFR-XBGA

CUSTOMER NOTIFICATION OF PRODUCT/PROCESS CHANGES BY SOLID-STATE SUPPLIERS

WIDE I/O SINGLE DATA RATE (WIDE I/O SDR)

PRODUCT DISCONTINUANCE

Registration - Scalable Quad Flat No-lead Packages, Square and Rectangular. H-PQFN, HL-PQFN.

IPC/JEDEC-9704A: PRINTED WIRING BOARD (PWB) STRAIN GAGE TEST GUIDELINE

Package-on-Package (PoP) and Internal Stacked Module (ISM)

144-Pin EP3-3200/EP3-4200/EP3-5300/EP3-6400 Unbuffered 32b-SO-DIMM Design Specification

240-Pin PC3-6400/PC3-8500/PC3-10600/PC3-12800/PC3-14900/PC3-17000 DDR3 SDRAM Registered DIMM Design Specification

Registration - Land Grid Array Family, Rectangular, 0.50 mm Pitch

Registration - Thick Thermally Enhanced Fine Pitch Square Ball Grid Array Family. BF-XBGA

MASTER TRACE FOR 128 GB SSD

TEST TRACE FOR 64 GB - 128 GB SSD

Registration - 244 Pin DDR2/DDR3 Mini Dual-In-Line Memory Module (DIMM) Family, 0.60 mm Lead Centers.

Design Requirements - Fine pitch, Rectangular Ball Grid Array Packages (FRBGA).

DDR3 SDRAM STANDARD

Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON

Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON.

TERMS, DEFINITIONS, AND LETTER SYMBOLS FOR DISCRETE SEMICONDUCTOR AND OPTOELECTRONIC DEVICES

204-Pin EP3-6400/EP3-8500/EP3-10600/EP3-12800 DDR3 SDRAM 72b-S0-DIMM Design Specification

Annex L, R/C L, in 240-Pin PC3-6400/PC3-8500/PC3-10600/PC3-12800 DDR3 SDRAM Registered DIMM Design Specification. Item 2145.13B

Annex N, R/C N, in 240-Pin PC3-6400/PC3-8500/PC3-10600/PC3-12800 DDR3 SDRAM Registered DIMM Design Specification. Item 2145.22

R/C U, in 240-Pin PC3-6400/PC3-8500/PC3-10600/PC3-12800 DDR3 SDRAM Registered DIMM Design Specification

Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM), 0.8 mm Pitch, Socket Outline.

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