Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Common SpecificationRelease Number: Version 1.0 |
JESD323 | Jan 2024 |
This standard defines the electrical and mechanical requirements for 288-pin, 1.1 V (VDD), Clocked, Unbuffered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR5 SDRAM CUDIMMs). These DDR5 Clocked Unbuffered DIMMs (CUDIMMs) are intended for use as main memory when installed in Computers. Free download. Registration or login required. |
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DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common StandardRelease Number: Version 1.1 |
JESD308A | Jan 2024 |
This standard defines the electrical and mechanical requirements for 288-pin, 1.1 V (VDD), Unbuffered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR5 SDRAM UDIMMs). These DDR5 Unbuffered DIMMs (UDIMMs) are intended for use as main memory when installed in Computers. Free download. Registration or login required. |
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DDR5 Clocked Small Outline Dual Inline Memory Module (CSODIMM) Common SpecificationRelease Number: Version 1.0 |
JESD324 | Jan 2024 |
This standard defines the electrical and mechanical requirements for 262-pin, 1.1 V (VDD), Clocked Small Outline, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR5 SDRAM CSODIMMs). These DDR5 CSODIMMs are intended for use as main memory when installed in Computers, laptops and other systems. Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, SURFACE TERMINAL, WETTABLE FLANK PACKAGE |
MO-340D | Dec 2023 |
Designator: PDSO_N#[#]_I#-R#x#Z#-CturET0p04
Item: 11-1044 Cross Reference: DR4.8, DR4.16, DR4.20 Patents(): Nexperia BV: 8809121B2 Committee(s): JC-11.11 Free download. Registration or login required. |
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Serial Interface for Data Converters |
JESD204D | Dec 2023 |
This standard describes a serialized interface between data converters and logic devices. It contains normative information to enable designers to implement devices that communicate with other devices covered by this specification. Informative annexes are included to clarify and exemplify the document. Committee(s): JC-16 Free download. Registration or login required. |
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XFM Device, Version 2.0 |
JESD233A | Dec 2023 |
This standard specifies the mechanical and electrical characteristics of the XFM removable memory Device. Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Free download. Registration or login required. |
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Stress-Test-Driven Qualification of and Failure Mechanisms Associated with Assembled Solid State Surface-Mount Devices |
JEP150A | Dec 2023 |
This publication contains frequently recommended and accepted JEDEC reliability stress tests applied to surface-mount solid state devices. Free download. Registration or login required. |
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Power Cycling |
JESD22-A122B | Nov 2023 |
This Test Method establishes a uniform method for performing solid state device package power cycling stress test. Free download. Registration or login required. |
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Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature |
JESD22-B112C | Nov 2023 |
This test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of thermal conditions experienced during the surface-mount soldering operation. Free download. Registration or login required. |
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IC LATCH-UP TEST |
JESD78F.02 | Nov 2023 |
This standard establishes the procedure for testing, evaluation and classification of devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined latch-up stress. This standard has been adopted by the Defense Logistics Agency (DLA) as project 5962-1880. Free download. Registration or login required. |
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Test Method for Total Ionizing Dose (TID) from X-ray Exposure in Terrestrial Applications |
JESD22-B121 | Nov 2023 |
This test method covers X-ray imaging for terrestrial applications on packaged devices. Free download. Registration or login required. |
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Zoned Storage for UFS |
JESD220-5 | Nov 2023 |
The purpose of this standard is to describe Zoned Storage for UFS, which enables higher bandwidth, lower latency and to reduce write amplification. Patents(): Huawei 201911209032.1; 116166570,A Memory Technologies LLC 101952808 104657284 2248023 3493067 602009056490.0 602009064847.0 HK1210296 5663720 6602823 10-1281326 10-1468824 2248023 3493067 2248023 3493067 8307180 8601228 9063850 9367486 10540094 11550476 Free download. Registration or login required. |
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Universal Flash Storage (UFS) File Based Optimizations (FBO) Extension |
JESD220-4 Version 1.01 | Nov 2023 |
This standard specifies the extension specification of the UFS electrical interface and the memory device. PLEASE NOTE: Revision and renumbering of JESD231 Version 1.0, August 2022 Free download. Registration or login required. |
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Guideline for Reverse Bias Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices |
JEP198 | Nov 2023 |
This publication presents guidelines for evaluating the Time Dependent Breakdown (TDB) reliability of GaN power switches. Free download. Registration or login required. |
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Guideline for Evaluating Bipolar Degradation of Silicon Carbide Power Devices |
JEP197 | Nov 2023 |
This publication provides guidance to SiC product suppliers and related power electronic industries in their evaluation of bipolar degradation mechanism in SiC power devices. Free download. Registration or login required. |
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A Case for Lowering Component-level CDM ESD Specifications and Requirements Part II: Die-to-Die Interfaces |
JEP196 | Nov 2023 |
This white paper presents an industry-wide survey on the relevance of industry-aligned D2D CDM targets and the currently used targets for D2D interfaces. Free download. Registration or login required. |
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ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements Schema |
JEP181_Schema_R2p0 | Nov 2023 |
In conjunction with JEP181A, for user support this file is the entire “XML Requirements Schema”. Committee(s): JC-15 Free download. Registration or login required. |
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ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements |
JEP181A | Nov 2023 |
This publication establishes the requirements for the exchange of electronic thermal system level simulation models between supplier and end user in a single neutral file format. Committee(s): JC-15 Free download. Registration or login required. |
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JEDEC Manual of Organization and Procedure |
JM21V | Nov 2023 |
This Manual sets forth the mission and requirements of JEDEC as an independent incorporated Association governed by a Board of Directors.
Committee(s): JC-BOD Free download. Registration or login required. |
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Design Requirements - BALL GRID ARRAY PACKAGE BALL PITCH ≤ 0.80 MM BODY SIZES ≤ 21 MM |
DR-4.5O | Nov 2023 |
BALL GRID ARRAY PACKAGE Item 2-1038 Committee(s): JC-11.2 Free download. Registration or login required. |
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PROCUREMENT STANDARD FOR KNOWN GOOD DIE (KGD) |
JESD49B.01 | Oct 2023 |
This standard facilitates the procurement and use of semiconductor die products provided in bare or bumped die form, and provides requirements and guidance to die suppliers as to the levels of as-delivered performance, quality and reliability expected. It also reflects the special needs of die product customers in terms of design and application data. Committee(s): JC-13 Free download. Registration or login required. |
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JEDEC COMMITTEE SCOPE MANUAL |
JM18U | Oct 2023 |
The JEDEC Board of Directors is responsible for establishing appropriate committees to conduct its standardization activities. This publication identifies the service and product committees established by the Board of Directors and defines their scopes. Committee(s): JC-COUN Free download. Registration or login required. |
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Annex K, Raw Card K, in 260-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM SODIMM Design SpecificationRelease Number: 33 |
MODULE4.20.25.K.01 | Aug 2023 |
This revision is to add R/C K1 for up to Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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PLASTIC QUAD FLATPACK 1.27 MM PITCH, 5.00 MM X 6.00 MM RECTANGULAR FAMILY PACKAGE |
MO-356A | Aug 2023 |
Designator: PQFP-B#[#]_Ip27... Item #: 11-1037 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch Rectangular Family |
MO-276U | Aug 2023 |
Designator: PBGA-B#[#]I0p5...
Item JC11.11-1036 Cross Reference: DR4.5 Committee(s): JC-11.11 Free download. Registration or login required. |
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TS511X, TS521X Serial Bus Thermal Sensor Device Standard |
JESD302-1A | Aug 2023 |
This standard defines the specifications of interface parameters, signaling protocols, and features for fifth generation Temperature Sensor (TS5) as used for memory module applications. These device operate on I2C and I3C two-wire serial bus interface. The designation TS521X and TS511X refers to the device specified by this document. Committee(s): JC-40.1 Free download. Registration or login required. |
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REGISTRATION - Upper PoP, Plastic Bottom Grid Array Ball, 0.40 mm Pitch Rectangular Family Package |
MO-344B | Aug 2023 |
Designator: PBGA-B#[#]_I0p40... Cross Reference: DR4.18 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Quad Flatpack, 8 Terminal, 1.27 mm Pitch Package |
MO-341B | Aug 2023 |
Designator: PQFP-F8[10]_I127-R5p51x6.54Z1P1
Item: 11-1030 Committee(s): JC-11.11 Free download. Registration or login required. |
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JC-42.6 MANUFACTURER IDENTIFICATION (ID) CODE FOR LOW POWER MEMORIES |
JEP166E | Jul 2023 |
This document defines the JC-42.6 Manufacturer ID. This document covers Manufacturer ID Codes for the following technologies: LPDDR (JESD209), LPDDR2 (JESD209-2), LPDDR3 (JESD209-3), LPDDR4 (JESD209-4), Wide-IO (JESD229), and Wide-IO2 (JESD229-2). The purpose of this document is to define the Manufacturer ID for these devices. Item No. 1725.03C. See Annex for additions/changes. To make a request for an ID code: https://www.jedec.org/id-codes-low-power-memories Committee(s): JC-42.6 Free download. Registration or login required. |
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LOW POWER DOUBLE DATA RATE (LPDDR) 5/5X |
JESD209-5C | Jul 2023 |
This document defines the LPDDR5/LPDDR5X standard, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this specification is to define the minimum set of requirements for a JEDEC compliant x16 one channel SDRAM device and x8 one channel SDRAM device. LPDDR5/LPDDR5X device density ranges from 2 Gb through 32 Gb. This document was created using aspects of the following standards: DDR2 (JESD79-2), DDR3 (JESD79-3), DDR4 (JESD79-4), LPDDR (JESD209), LPDDR2 (JESD209-2), LPDDR3 (JESD209-3), and LPDDR4 (JESD209-4). Available for purchase: $459.00 Add to Cart Paying JEDEC Members may login for free access. |
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Registration - Plastic Quad Flatpack, 0.65 mm Pitch, 3.30 mm Body, Square Family Package |
MO-346A.01 | Jun 2023 |
Designator: PQFP-B#[#]_I0p65... Item: 11-981E, Access STP Files for MO-346A Cross Reference: N/A Committee(s): JC-11.11 Free download. Registration or login required. |
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ESDA/JEDEC JOINT STANDARD FOR ELECTROSTATIC DISCHARGE SENSITIVITY TESTING – CHARGED DEVICE MODEL (CDM) – DEVICE LEVEL |
JS-002-2022 | Jun 2023 |
This standard establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this standard. This test method combines the main features of JEDEC JESD22-C101 and ANSI/ESD S5.3.1. Free download. Registration or login required. |
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GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID/MCM PRODUCTSStatus: Reaffirmed May 2023 |
JEP142 | May 2023 |
This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid/MCM Products. As part of the risk assessment process, both technical requirements and cost should be carefully considered with regard to testing/evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybrid / MCM manufacturer and provide associated guidance, not to impose a specific set of tests. Free download. Registration or login required. |
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Graphics Double Data Rate (GDDR6) SGRAM Standard |
JESD250D | May 2023 |
This document defines the Graphics Double Data Rate 6 (GDDR6) Synchronous Graphics Random Access Memory (SGRAM) specification, including features, functionality, package, and pin assignments. The purpose of this Standard is to define the minimum set of requirements for 8 Gb through 16 Gb x16 dual channel GDDR6 SGRAM devices. System designs based on the required aspects of this standard will be supported by all GDDR6 SGRAM vendors providing compatible devices. Some aspects of the GDDR6 standard such as AC timings and capacitance values were not standardized. Some features are optional and therefore may vary among vendors. In all cases, vendor data sheets should be consulted for specifics. This document was created based on some aspects of the GDDR5 Standard (JESD212). Committee(s): JC-42.3C Free download. Registration or login required. |
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Statistical Process Control Systems |
JESD557D | May 2023 |
This standard specifies the general requirements of a statistical process control (SPC) system. Committee(s): JC-14 Free download. Registration or login required. |
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Guidelines for Particle Impact Noise Detection (PIND) Testing, Operator Training, and Certification |
JEP114A | May 2023 |
This publication is a guideline to test facilities in their efforts to establish and maintain consistent particle impact noise detection (PIND) testing. Free download. Registration or login required. |
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Guidelines for Supplier Performance Rating |
JEP146B | May 2023 |
This publication establishes guidelines and provides examples by which customers can measure their suppliers based on mutually agreed upon objective criteria. Free download. Registration or login required. |
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HYBRIDS/MCM |
JESD93A | May 2023 |
This specification establishes the general requirements for hybrid microcircuits, RF/microwave hybrid microcircuits and MCMs (hereafter referred to as devices). Detailed performance requirements for a specific device are specified in the applicable device acquisition document. In the event of a conflict between this document and the device acquisition document, the device acquisition document will take precedence. Committee(s): JC-14.3 Free download. Registration or login required. |
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SPD5118 HUB and SERIAL PRESENCE DETECT DEVICE STANDARDRelease Number: Version 1.5.1 |
JESD300-5B.01 | May 2023 |
This standard defines the specifications of interface parameters, signaling protocols, and features for DDR5 Serial Presence Detect EEPROM with Hub function (SPD5 Hub) and integrated Temperature Sensor (TS) as used for memory module applications. The Hub feature allows isolation of a local bus from a Controller host bus. The designation SPD5118 or generic term SPD5 Hub refers to the devices specified by this standard. Committee(s): JC-40.1 Free download. Registration or login required. |
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REGISTRATION - 288 PIN DDR5 DIMM SMT, 0.85 MM PITCH SOCKET OUTLINE |
SO-023D | May 2023 |
Designator: PDXC-LO288-I0p85-R162p0x6p5Z21p3-N5p20S3p1Z0p2 Item: 11.14-216, Access STP Files for SO-023C Cross Reference: MO-329, GS-010C
Patents(): CN 202759077 U Committee(s): JC-11.14 Free download. Registration or login required. |