Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Rescission of MO-036 Variations AB-AE, Update of Variation AA to a .288 inch Wide Body. Item 11.10-384/388. |
MO-036-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Rescission of 200 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family, 0.65 mm Pitch. Item 11.14-044.Status: Rescinded |
MO-177-A | Jun 1999 |
Free download. Registration or login required. |
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Registration - Rectangular Plastic Quad Flat Package, 1.0 mm Thick Body, 3.2 mm Footprint. Item 11.11-511. |
MO-212-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB. |
MO-264-A | Nov 2005 |
Item 11.4-731 Free download. Registration or login required. |
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Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, 0.80 mm Pitch. AF1R-PDSB. |
MO-242-C | Sep 2008 |
Item 11.4-800 Patents(): Micron and Staktek have stated that certain U.S. patents and patent applications may apply to configurations of this outline. These patents and applications are listed on sheet 9 of the outline. Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433. |
MO-157-C | Apr 2005 |
Free download. Registration or login required. |
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Registration - Rectangular Ceramic .375 inch Nominal Width Flatpack Family. Item 11.10-233. |
MO-070-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variations AA-AB. Item 11.3-032/033. |
MO-031-D | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variation AA-AB. Item 11.3-034/035 |
MO-029-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Quad-In-Line (QUIP) Family, 19.05/23.50 mm Row Spacing. Item 11.3-037. |
MO-030-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Quad In Line (QUIP) Family 17.78/ 22.86 mm Row Spacing. Item 11.10- |
MO-033-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Punch-Singulated, Fine Pitch, Square, Very Thin, Leadframe-Based Quad No-Lead Staggered Dual-Row (With Optional Thermal Enhancements) QFN Package Family. HVF-PQFN. |
MO-267-B | Feb 2006 |
Item 11.11-745 Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
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Registration - Press Fit Case Family, Single-End, Solid Terminals. Ref. DO-24. |
DO-209-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Press Fit Case Family, Single-End, Flanged, Axial Lead. Ref. DO-21. |
DO-208-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Power PQFP with Heat Slug. Item 11.11-559. |
MO-188-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Power Plastic Outline, Surface Mount with 1-Lead C-Bend Terminal. Includes Errata to DO-214, May 1998. Item 11.1-654(e). |
DO-214-D | Apr 2003 |
Free download. Registration or login required. |
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Registration - Power Outline, Plastic Surface Mount C-Bend |
DO-218C | Apr 2014 |
Item No. 10-454 Free download. Registration or login required. |
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Registration - Power Module. Recission of Variation AB. |
MO-040-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Power Dual-In-Line Package. Item 11.10-297. |
MO-127-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - PLCC Tray for Handling and Shipping. Variations AA-AL. Item 11.5-281. |
CO-016-B | Feb 1991 |
Free download. Registration or login required. |