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Title	Document #	Date
GENERAL REQUIREMENTS FOR DISTRIBUTORS OF MILITARY SEMICONDUCTOR DEVICES: Status: Rescinded	JEP109-C	Mar 1995
Superseded by JESD31-A, June 2001. Committee(s): JC-13 Free download. Registration or login required.
General SDRAM Functions	SDRAM3.11.5.1	Jun 2002
Release No. 12 Committee(s): JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
GENERAL SPECIFICATION FOR PLASTIC ENCAPSULATED MICROCIRCUITS FOR USE IN RUGGED APPLICATIONS - RESCINDED, July 2001 Status: Rescinded	JESD26-A	Apr 1990
Committee(s): JC-13.2 Free download. Registration or login required.
GENERAL STANDARD FOR STATISTICAL PROCESS CONTROL (SPC) - SUPERSEDED by EIA-557-A Status: Rescinded	JESD19	Jul 1988
Committee(s): JC-13 Free download. Registration or login required.
GLOSSARY OF MICROELECTRONIC TERMS, DEFINITIONS, AND SYMBOLS: ELEVATED TO JESD99, June 1985. Status: Rescinded	JEP99	Jul 1977
Committee(s): JC-10 Free download. Registration or login required.
GLOSSARY OF THERMAL MEASUREMENT TERMS AND DEFINITIONS	JESD51-13	Jun 2009
This document provides a unified collection of the commonly used terms and definitions in the area of semiconductor thermal measurements. The terms and definitions provided herein extend beyond those used in the JESD51 family of documents to include other often used terms and definitions in the area of semiconductor thermal measurements. Committee(s): JC-15 Free download. Registration or login required.
Graphics Double Data (GDDR4) SGRAM Standard Release Number: 16	SDRAM3.11.5.8 R16.01	Mar 2023
Item 1600.41, Terminology Update This document defines the Graphics Double Data Rate 4 (GDDR4) Synchronous Graphics Random Access Memory (SGRAM) standard, including features, functionality, package, and pin assignments. This scope may be expanded in future to also include other higher density devices. Committee(s): JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
GRAPHICS DOUBLE DATA RATE (GDDR5) SGRAM STANDARD Release Number: C.01 - Terminology update	JESD212C.01	Jan 2023
Terminology update. This document defines the Graphics Double Data Rate 5 (GDDR5) Synchronous Graphics Random Access Memory (SGRAM), including features, functionality, package, and pin assignments. The purpose of this Standard is to define the minimum set of requirements for JEDEC standard compatible 512 Mb through 8 Gb x32 GDDR5 SGRAM devices. System designs based on the required aspects of this standard will be supported by all GDDR5 SGRAM vendors providing JEDEC standard compatible devices. Some aspects of the GDDR5 standard such as AC timings and capacitance values were not standardized. Some features are optional and therefore may vary among vendors. In all cases, vendor data sheets should be consulted for specifics. Item 1733.70B Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-42.3C Free download. Registration or login required.
GRAPHICS DOUBLE DATA RATE (GDDR5X) SGRAM STANDARD	JESD232A.01	Mar 2023
Terminology update. This standard defines the Graphics Double Data This standard defines the GDDR5X SGRAM memory standard, including features, device operation, electrical characteristics, timings, signal pin assignments, and package Committee(s): JC-42.3, JC-42.3C Free download. Registration or login required.
Graphics Double Data Rate (GDDR6) SGRAM Standard	JESD250D	May 2023
This document defines the Graphics Double Data Rate 6 (GDDR6) Synchronous Graphics Random Access Memory (SGRAM) specification, including features, functionality, package, and pin assignments. The purpose of this Standard is to define the minimum set of requirements for 8 Gb through 16 Gb x16 dual channel GDDR6 SGRAM devices. System designs based on the required aspects of this standard will be supported by all GDDR6 SGRAM vendors providing compatible devices. Some aspects of the GDDR6 standard such as AC timings and capacitance values were not standardized. Some features are optional and therefore may vary among vendors. In all cases, vendor data sheets should be consulted for specifics. This document was created based on some aspects of the GDDR5 Standard (JESD212). Committee(s): JC-42.3C Free download. Registration or login required.
Graphics Double Data Rate 7 SGRAM Standard (GDDR7)	JESD239A	Sep 2024
This standard defines the Graphics Double Data Rate 7 (GDDR7) Synchronous Graphics Random Access Memory (SGRAM) specification, including features, functionality, package, and pin assignments. Committee(s): JC-42, JC-42.1 Free download. Registration or login required.
GUIDE FOR STANDARD PROBE PAD SIZES AND LAYOUTS FOR WAFER LEVEL ELECTRICAL TESTING: Status: Rescinded September 2021 (JC-14.2-21-182)	JEP128	Nov 1996
This guide has been replaced by JESD241: September 2021. Committee(s): JC-14.2
GUIDE FOR THE PRODUCTION AND ACQUISITION OF RADIATION-HARDNESS ASSURED MULTICHIP MODULES AND HYBRID MICROCIRCUITS:	JEP133C	Jan 2010
A revised and expanded publication for suppliers and users of radiation hardness assured (RHA) multichip modules (MCMs) and hybrid microcircuits, is now available. The document provides guidance as to how to achieve, maintain and ensure required levels of radiation-hardness given the fact that the constituent dice can have different levels of hardness assurance. It also describes how to deal with the various radiation hardness situations that an MCM/Hybrid developer, procuring activity or user will encounter. The guide is intended to supplement three relevant performance specifications: MIL-PRF-38534, MIL-PRF-38535 and MIL-PRF-19500. Committee(s): JC-13.5, JC-13.4 Free download. Registration or login required.
GUIDE TO STANDARDS AND PUBLICATIONS RELATING TO QUALITY AND RELIABILITY OF ELECTRONIC HARDWARE	JEP70C	Oct 2013
This document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries. This is intended to facilitate access to the applicable documents when working with electronic hardware. This will have a positive effect on quality and reliability as users gain more access to proper methods in designing, producing, and testing parts. Committee(s): JC-14.4 Free download. Registration or login required.
GUIDELINE FOR ASSESSING THE CURRENT-CARRYING CAPABILITY OF THE LEADS IN A POWER PACKAGE SYSTEM:	JEP145	Feb 2003
This publication is intended as a guideline to establish procedures, consideration and common practices that will allow a manufacturer, an application entity, a system designer and other interested parties to define current capability limitations in the leads of components and power systems with semiconductor components. This is a guideline, not a standardized method, it was developed over several years to clarify questions that had been posed to committee members in their respective engineering functions. Committee(s): JC-25 Free download. Registration or login required.
Guideline for Characterizing Solder Bump Electromigration Under Constant Current and Temperature Stress	JEP154A	Mar 2024
This publication describes a method to test the electromigration susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
GUIDELINE FOR CONSTANT TEMPERATURE AGING TO CHARACTERIZE ALUMINUM INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING: Status: ReaffirmedOctober 2012	JEP139	Dec 2000
This document describes a constant temperature (isothermal) aging method for testing aluminum (Al) metallization test structures on microelectronics wafers for susceptibility to stress-induced voiding. This method is valid for metallization/dielectric systems in which the dielectric is deposited onto the metallization at a temperature considerably above the intended use temperature, and above or equal to the deposition temperature of the metal. Although this is a wafer test, it is not a fast (less than 5 minutes per probe) test. It is intended to be used for lifetime prediction and failure analysis, not for production Go-NoGo lot checking. Committee(s): JC-14.2 Free download. Registration or login required.
GUIDELINE FOR DEVELOPING AND DOCUMENTING PACKAGE ELECTRICAL MODELS DERIVED FROM COMPUTATIONAL ANALYSIS:	JEP126	May 1996
This publication provides a guideline to suppliers of IC components with a template for documenting the numerical simulation assumptions. In addition this guideline also suggests a model environment to reference when comparing various packages or component suppliers. This publication should improve the communication between the package model suppliers. This publication should improve the communication between the package model supplier and the end user. Committee(s): JC-15.2 Free download. Registration or login required.
Guideline for Evaluating Bipolar Degradation of Silicon Carbide Power Devices	JEP197	Nov 2023
This publication provides guidance to SiC product suppliers and related power electronic industries in their evaluation of bipolar degradation mechanism in SiC power devices. Committee(s): JC-70, JC-70.2 Free download. Registration or login required.
Guideline for Evaluating dv/dt Robustness of SiC Power Devices, Version 1.0	JEP190	Aug 2022
This document provides stress procedures, general failure criteria and documentation guidelines such that the dv/dt robustness can be demonstrated, evaluated and documented. This document gives examples for test setups which can be used and the corresponding test conditions. Additionally, criteria are explained under which device manufacturers can select an appropriate test setup. Committee(s): JC-70.2 Free download. Registration or login required.

Standards & Documents Search

GENERAL REQUIREMENTS FOR DISTRIBUTORS OF MILITARY SEMICONDUCTOR DEVICES:

General SDRAM Functions

GENERAL SPECIFICATION FOR PLASTIC ENCAPSULATED MICROCIRCUITS FOR USE IN RUGGED APPLICATIONS - RESCINDED, July 2001

GENERAL STANDARD FOR STATISTICAL PROCESS CONTROL (SPC) - SUPERSEDED by EIA-557-A

GLOSSARY OF MICROELECTRONIC TERMS, DEFINITIONS, AND SYMBOLS: ELEVATED TO JESD99, June 1985.

GLOSSARY OF THERMAL MEASUREMENT TERMS AND DEFINITIONS

Graphics Double Data (GDDR4) SGRAM Standard

GRAPHICS DOUBLE DATA RATE (GDDR5) SGRAM STANDARD

GRAPHICS DOUBLE DATA RATE (GDDR5X) SGRAM STANDARD

Graphics Double Data Rate (GDDR6) SGRAM Standard

Graphics Double Data Rate 7 SGRAM Standard (GDDR7)

GUIDE FOR STANDARD PROBE PAD SIZES AND LAYOUTS FOR WAFER LEVEL ELECTRICAL TESTING:

GUIDE FOR THE PRODUCTION AND ACQUISITION OF RADIATION-HARDNESS ASSURED MULTICHIP MODULES AND HYBRID MICROCIRCUITS:

GUIDE TO STANDARDS AND PUBLICATIONS RELATING TO QUALITY AND RELIABILITY OF ELECTRONIC HARDWARE

GUIDELINE FOR ASSESSING THE CURRENT-CARRYING CAPABILITY OF THE LEADS IN A POWER PACKAGE SYSTEM:

Guideline for Characterizing Solder Bump Electromigration Under Constant Current and Temperature Stress

GUIDELINE FOR CONSTANT TEMPERATURE AGING TO CHARACTERIZE ALUMINUM INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING:

GUIDELINE FOR DEVELOPING AND DOCUMENTING PACKAGE ELECTRICAL MODELS DERIVED FROM COMPUTATIONAL ANALYSIS:

Guideline for Evaluating Bipolar Degradation of Silicon Carbide Power Devices

Guideline for Evaluating dv/dt Robustness of SiC Power Devices, Version 1.0

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