Standards & Documents Search

Displaying 441 - 460 of 1449 documents. Show 5 | 10 | 20 | 40 | 60 results per page.

Title	Document #	Date
Registration - Rescission of 200 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family, 0.65 mm Pitch. Item 11.14-044. Status: Rescinded	MO-177-A	Jun 1999
Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Plastic Quad Flat Package, 1.0 mm Thick Body, 3.2 mm Footprint. Item 11.11-511.	MO-212-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB.	MO-264-A	Nov 2005
Item 11.4-731 Committee(s): JC-11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, 0.80 mm Pitch. AF1R-PDSB.	MO-242-C	Sep 2008
Item 11.4-800 Patents(): Micron and Staktek have stated that certain U.S. patents and patent applications may apply to configurations of this outline. These patents and applications are listed on sheet 9 of the outline. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433.	MO-157-C	Apr 2005
Committee(s): JC-11.10, JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Ceramic .375 inch Nominal Width Flatpack Family. Item 11.10-233.	MO-070-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variations AA-AB. Item 11.3-032/033.	MO-031-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variation AA-AB. Item 11.3-034/035	MO-029-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Quad-In-Line (QUIP) Family, 19.05/23.50 mm Row Spacing. Item 11.3-037.	MO-030-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Quad In Line (QUIP) Family 17.78/ 22.86 mm Row Spacing. Item 11.10-	MO-033-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Punch-Singulated, Fine Pitch, Square, Very Thin, Leadframe-Based Quad No-Lead Staggered Dual-Row (With Optional Thermal Enhancements) QFN Package Family. HVF-PQFN.	MO-267-B	Feb 2006
Item 11.11-745 Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Press Fit Case Family, Single-End, Solid Terminals. Ref. DO-24.	DO-209-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Press Fit Case Family, Single-End, Flanged, Axial Lead. Ref. DO-21.	DO-208-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power PQFP with Heat Slug. Item 11.11-559.	MO-188-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power Plastic Outline, Surface Mount with 1-Lead C-Bend Terminal. Includes Errata to DO-214, May 1998. Item 11.1-654(e).	DO-214-D	Apr 2003
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power Outline, Plastic Surface Mount C-Bend	DO-218C	Apr 2014
Item No. 10-454 Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power Module. Recission of Variation AB.	MO-040-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power Dual-In-Line Package. Item 11.10-297.	MO-127-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - PLCC Tray for Handling and Shipping. Variations AA-AL. Item 11.5-281.	CO-016-B	Feb 1991
Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Ultra, Extra and Super Thin, Fine Pitch, Dual Small Outline, Flat, Leaded Package. (U, X1, X2)F-PSOF, HX2-PSOF.	MO-293B	Sep 2021
Item 11.10-459 Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Rescission of 200 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family, 0.65 mm Pitch. Item 11.14-044.

Registration - Rectangular Plastic Quad Flat Package, 1.0 mm Thick Body, 3.2 mm Footprint. Item 11.11-511.

Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB.

Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, 0.80 mm Pitch. AF1R-PDSB.

Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433.

Registration - Rectangular Ceramic .375 inch Nominal Width Flatpack Family. Item 11.10-233.

Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variations AA-AB. Item 11.3-032/033.

Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variation AA-AB. Item 11.3-034/035

Registration - Quad-In-Line (QUIP) Family, 19.05/23.50 mm Row Spacing. Item 11.3-037.

Registration - Quad In Line (QUIP) Family 17.78/ 22.86 mm Row Spacing. Item 11.10-

Registration - Punch-Singulated, Fine Pitch, Square, Very Thin, Leadframe-Based Quad No-Lead Staggered Dual-Row (With Optional Thermal Enhancements) QFN Package Family. HVF-PQFN.

Registration - Press Fit Case Family, Single-End, Solid Terminals. Ref. DO-24.

Registration - Press Fit Case Family, Single-End, Flanged, Axial Lead. Ref. DO-21.

Registration - Power PQFP with Heat Slug. Item 11.11-559.

Registration - Power Plastic Outline, Surface Mount with 1-Lead C-Bend Terminal. Includes Errata to DO-214, May 1998. Item 11.1-654(e).

Registration - Power Outline, Plastic Surface Mount C-Bend

Registration - Power Module. Recission of Variation AB.

Registration - Power Dual-In-Line Package. Item 11.10-297.

Registration - PLCC Tray for Handling and Shipping. Variations AA-AL. Item 11.5-281.

Registration - Plastic, Ultra, Extra and Super Thin, Fine Pitch, Dual Small Outline, Flat, Leaded Package. (U, X1, X2)F-PSOF, HX2-PSOF.

Pages

Search by Keyword or Document Number

Filter by committees:

Filter by document type:

Filter by keywords: