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Title	Document #	Date
Zoned Storage for UFS	JESD220-5	Nov 2023
The purpose of this standard is to describe Zoned Storage for UFS, which enables higher bandwidth, lower latency and to reduce write amplification. Patents(): Huawei 201911209032.1; 116166570,A Memory Technologies LLC 101952808 104657284 2248023 3493067 602009056490.0 602009064847.0 HK1210296 5663720 6602823 10-1281326 10-1468824 2248023 3493067 2248023 3493067 8307180 8601228 9063850 9367486 10540094 11550476 Committee(s): JC-64, JC-64.1 Free download. Registration or login required.
ZENER AND VOLTAGE REGULATOR DIODE RATING VERIFICATION AND CHARACTERIZATION TESTING	JESD211.01	Nov 2012
This standard is applicable to diodes that are used as voltage regulators and voltage references. It describes terms and definitions and explains methods for verifying device ratings and measuring device characteristics. Committee(s): JC-22, JC-22.2 Free download. Registration or login required.
XFM Device, Version 2.0	JESD233A	Dec 2023
This standard specifies the mechanical and electrical characteristics of the XFM removable memory Device. Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-64, JC-64.1 Free download. Registration or login required.
Word Wide TTL and MOS SRAM	SRAM3.7.7	Apr 2007
Release No. 16. Item 1541.03 Committee(s): JC-42, JC-42.2 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Word Wide SDRAM.	SDRAM3.11.4	Feb 2008
Release No. 17. Item 1749.01 Committee(s): JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Word Wide ROM	ROM3.2.2	Dec 1992
Release No.6 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Word Wide PROM, DIP to SO Conversion	PROM3.3.3-4	Dec 1993
Release No.1 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Word Wide Graphics DRAM	MPDRAM3.10.3	Jan 2004
Release No.13 Committee(s): JC-42.3, JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Word Wide EPROM	EPROM3.4.2	Jun 1999
Release No.9 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Word Wide DRAM	DRAM3.9.4	Jul 2000
Release No. 10 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
WITHDRAWN: Standard Practices and Procedures - Rectangular Grid Array Terminal Position Numbering. Item 11.2-641(S) Status: SupersededAugust 2016 (11.2-924)	SPP-020A	Jul 2003
SPP-020 is a duplicate of SPP-010. SPP-010 has multiple solder ball pitch terminal numbering, SPP-020 does not. Since SPP-010 is more up to date than SPP-020 it is being withdrawn. SPP-010 covers both square and rectangular packages, SPP-020 covered only rectangular packages. Committee(s): JC-11.2, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
WIRE BOND SHEAR TEST	JESD22-B116B	May 2017
This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. Pictures have been added to enhance the fail mode diagrams. The wire bond shear test is destructive. The test method can also be used to shear aluminum and copper wedge bonds to a die or package bonding surface. It is appropriate for use in process development, process control and/or quality assurance. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
Wire Bond Pull Test Methods	JESD22-B120	Nov 2022
This test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on pre-encapsulation or post-encapsulation devices. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
WIDE I/O SINGLE DATA RATE (WIDE I/O SDR)	JESD229	Dec 2011
This standard defines the Wide I/O specification, including features, functionality, AC and DC characteristics, packages, and micropillar signal assignments. This standard covers the following technologies: Wide I/O. The purpose of this standard is to define the minimum set of requirements for JEDEC compliant, 1 Gb through 32 Gb SDRAM (monolithic density) devices with 4, 128b wide channels using direct chip-to-chip attach methods between 1 to 4 memory devices and a controller device. Committee(s): JC-42, JC-42.6 Free download. Registration or login required.
WIDE I/O 2 (WideIO2)	JESD229-2	Aug 2014
This standard defines Wide I/O 2 (WideIO2), including features, functionality, AC and DC characteristics, packages, and micropillar signal assignments. The purpose of this standard is to define the minimum set of requirements for JEDEC compliant, 8 Gb through 32 Gb SDRAM devices with 4 or 8 64-bit wide channels using direct chip-to-chip attach methods for between 1 and 4 memory devices and a controller/buffer device. The WideIO2 architecture is an evolution of the WIO architecture to enable bandwidth scaling with capacity. Committee(s): JC-42.6 Free download. Registration or login required.
VOLTAGE REGULATOR DIODE NOISE VOLTAGE MEASUREMENT Status: Reaffirmed January 1992, April 1999, April 2002	JESD307	May 1965
This standard is intended to cover the measurement of noise voltage in voltage regulator diodes in the reverse breakdown region. It describes noise voltage measurements at specified conditions, but may be used as a guide for making such measurements at other than specified conditions. Formerly known as RS-307 and/or EIA-307 Committee(s): JC-22.4 Free download. Registration or login required.
VIBRATION, VARIABLE FREQUENCY	JESD22-B103B.01	Sep 2016
The Vibration, Variable Frequency Test Method is intended to determine the ability of component(s) to withstand moderate to severe vibration as a result of motion produced by transportation or filed operation of electrical equipment. This is a destructive test that is intended for component qualification. This is a minor editorial change to JESD22-B103B, June 2002 (Reaffirmed September 2010). Committee(s): JC-14.1 Free download. Registration or login required.
VCSDRAM Specific SDRAM Functions	SDRAM3.11.5.4	Jun 1999
Release No. 9 Committee(s): JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
USER GUIDELINES FOR QUALITY AND RELIABILITY ASSURANCE OF LSI COMPONENTS Status: RescindedApr-87	JEB17	Jan 1970
USER GUIDELINES FOR IR THERMAL IMAGING DETERMINATION OF DIE TEMPERATURE:	JEP138	Sep 1999
The purpose of these user guidelines is to provide background and an example for the use of an infrared (IR) microscope to determine die temperature of electronic devices for calculations such as thermal resistance. Committee(s): JC-25 Free download. Registration or login required.

Standards & Documents Search

Zoned Storage for UFS

ZENER AND VOLTAGE REGULATOR DIODE RATING VERIFICATION AND CHARACTERIZATION TESTING

XFM Device, Version 2.0

Word Wide TTL and MOS SRAM

Word Wide SDRAM.

Word Wide ROM

Word Wide PROM, DIP to SO Conversion

Word Wide Graphics DRAM

Word Wide EPROM

Word Wide DRAM

WITHDRAWN: Standard Practices and Procedures - Rectangular Grid Array Terminal Position Numbering. Item 11.2-641(S)

WIRE BOND SHEAR TEST

Wire Bond Pull Test Methods

WIDE I/O SINGLE DATA RATE (WIDE I/O SDR)

WIDE I/O 2 (WideIO2)

VOLTAGE REGULATOR DIODE NOISE VOLTAGE MEASUREMENT

VIBRATION, VARIABLE FREQUENCY

VCSDRAM Specific SDRAM Functions

USER GUIDELINES FOR QUALITY AND RELIABILITY ASSURANCE OF LSI COMPONENTS

USER GUIDELINES FOR IR THERMAL IMAGING DETERMINATION OF DIE TEMPERATURE:

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