Standards & Documents Search

Displaying 681 - 700 of 1464 documents. Show 5 | 10 | 20 | 40 | 60 results per page.

Title	Document #	Date
RECOMMENDED STANDARD FOR THYRISTORS:	EIA397	Jun 1972
One section of this standard presents a thorough explanation of thyristor principals, defining thedifferent classes of these devices, their Physical structure and detailing the numerous test methods and ratings required in their application to electronic and power circuitry. Another section presents a universally accepted listing of letter symbols. Considerable effort is devoted to the use of JEDEC Type Registration System as related to thyristors. This will permit the device manufacturer to employ a uniform procedure in the development of maximum rating and presentation of performance data. Committee(s): JC-22.1 Free download. Registration or login required.
REFERENCE GUIDE TO LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES:	JEP104C.01	May 2003
This publication provides a quick reference to the letter symbols and corresponding terms that are defined in JESD77-B, Terms, Definitions, and Letter Symbols for Discrete Semiconductor and Optoelectronic Devices; JESD99-A, Terms, Definitions, and Letter Symbols for Microelectronic Devices, and JESD100-B, Terms, Definitions, and Letter Symbols for Microcomputers, Microprocessors, and Memory Integrated Circuits. It is intended to simplify interpretation of data sheets and specifications and to promote the uniform use of these symbols. The symbols relate to ratings and characteristics found in data sheets and other specifications. Some abbreviations used in lieu of symbols are also included. The newly added Annex B is provided as an aid to determining what symbol should be used and is organized by term, whereas the main body of the publication is organized by symbol or abbreviation as in previous versions. This version contains minor revisions Committee(s): JC-10 Free download. Registration or login required.
Registration - 3 Lead Plastic Flange-Mounted Package. Item 11.10-401	TO-274-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, Square, 0.50 mm Top, 0.50 mm Bottom Pitch. S-XBGA	MO-324A	Aug 2016
Item No. 11-926 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .040 inch Center Rectangular Leadless Package (Staggered Terminals). Item 11.10-165.D270	MO-085-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .040 inch, 132 Pin Quad Flatpack. Item 11.10-278.	MO-060-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Ceramic Surface Mount Pin Grid Array (PGA) Family. S-CPGA-B/SMTPGA. Item 11.10-324.	MO-145-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350.	MO-041-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Leadless Rectangular Chip Carrier Type F. Item 11.3-101.	MO-042-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier Quad Series, Square. Item 11.11-221.	MO-075-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier SO Series, Rectangular. Item 11.11-222.	MO-076-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .100 inch Center Ceramic Pin Grid Array Family (Large Outline). Item 11.10-122.	MO-067-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .100 inch Center Ceramic Pin Grid Array Family (Small Outline). Item 11.10-122.	MO-066-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .100 inch Center Plastic Pin Grid Array Family (Nonhermetic). Item 11.11-243.	MO-083-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 0.50 and 0.40 mm pitch Very Thin and Very-Very Thin Flange-Molded QFNs. VF-PQFN, WF-PFQN.	MO-263-A	Sep 2005
Item 11.11-734 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 0.50 mm pitch Very Thin and Very-Very Thin Flange-Molded Thermally Enhanced (Top Side) QFNs. HVF-PQFN, HWF-PQFN.	MO-262-A	Sep 2005
Item 11.11-733 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 10 Pin Micro Size MultiMediaCard (MMC) Outline - MMCmicro 14 x 12 x 1.1 mm. RT-PLGA/MMCmicro.	MO-279A	Sep 2006
Item 11.14-093 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 112 & 200 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Pitch. Item 11.14-041.	MO-172-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 12 Pin UFS Card, 0.91 mm Pitch	MO-320B	Sep 2020
Designator: PBMA-N11-I0p91-CturZ1p0 Item 11.11-985 Patents(): Samsung: US D727910, US D736212, US D736215, US D736214, US D736213, US 29/546125, US 29/546150 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 12 Pin UFS Socket Outline, 0.91 mm Pitch. SKT	SO-022A	Aug 2016
Item No. 14-182 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

RECOMMENDED STANDARD FOR THYRISTORS:

REFERENCE GUIDE TO LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES:

Registration - 3 Lead Plastic Flange-Mounted Package. Item 11.10-401

Registration - Lower PoP Ball Grid Array Family, Square, 0.50 mm Top, 0.50 mm Bottom Pitch. S-XBGA

Registration - .040 inch Center Rectangular Leadless Package (Staggered Terminals). Item 11.10-165.D270

Registration - .040 inch, 132 Pin Quad Flatpack. Item 11.10-278.

Registration - .050 inch Center Ceramic Surface Mount Pin Grid Array (PGA) Family. S-CPGA-B/SMTPGA. Item 11.10-324.

Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350.

Registration - .050 inch Center Leadless Rectangular Chip Carrier Type F. Item 11.3-101.

Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier Quad Series, Square. Item 11.11-221.

Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier SO Series, Rectangular. Item 11.11-222.

Registration - .100 inch Center Ceramic Pin Grid Array Family (Large Outline). Item 11.10-122.

Registration - .100 inch Center Ceramic Pin Grid Array Family (Small Outline). Item 11.10-122.

Registration - .100 inch Center Plastic Pin Grid Array Family (Nonhermetic). Item 11.11-243.

Registration - 0.50 and 0.40 mm pitch Very Thin and Very-Very Thin Flange-Molded QFNs. VF-PQFN, WF-PFQN.

Registration - 0.50 mm pitch Very Thin and Very-Very Thin Flange-Molded Thermally Enhanced (Top Side) QFNs. HVF-PQFN, HWF-PQFN.

Registration - 10 Pin Micro Size MultiMediaCard (MMC) Outline - MMCmicro 14 x 12 x 1.1 mm. RT-PLGA/MMCmicro.

Registration - 112 & 200 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Pitch. Item 11.14-041.

Registration - 12 Pin UFS Card, 0.91 mm Pitch

Registration - 12 Pin UFS Socket Outline, 0.91 mm Pitch. SKT

Pages

Search by Keyword or Document Number

Filter by committees:

Filter by document type:

Filter by keywords: