Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
204-Pin DDR3 SDRAM Unbuffered SODIMM Design Specification |
MODULE4.20.18 | May 2014 |
Release No. 24; Item 2114.44 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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PC4-RDIMM_090_Annex-F |
PRN14-NM10 | May 2014 |
Item 2241.11 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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HSUL_12 LPDDR2 AND LPDDR3 I/O WITH OPTIONAL ODT |
JESD8-22B | Apr 2014 |
This standard defines the input, output specifications and ac test conditions for devices that are designed to operate in the High Speed Unterminated Logic (HSUL_12) logic switching range, nominally 0 V to 1.2 V. The standard may be applied to ICs operating with separate VDD and VDDQ supply voltages. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-16 Free download. Registration or login required. |
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Registration - Power Outline, Plastic Surface Mount C-Bend |
DO-218C | Apr 2014 |
Item No. 10-454 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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240-Pin, 72 bit-wide, PC3(L)-6400/PC3(L)-8500/PC3(L)-10600/PC3(L)-12800/PC3(L)-14900/PC3(L)-17000 DDR3 SDRAM Load Reduced DIMM Design Specification |
MODULE4.20.24 | Apr 2014 |
Release No. 24. Item 2192.48A A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Annex C, R/C C, in 240-Pin, 72 bit-wide, PC3(L)-6400/PC3(L)-8500/PC3(L)-10600/PC3(L)-12800/PC3(L)-14900/PC3(L)-17000 DDR3 SDRAM Load Reduced DIMM Design Specification |
MODULE4.20.24.C | Apr 2014 |
Release No. 24. Item 2192.54 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Annex K, R/C K, in 240-Pin, 72 bit-wide, PC3(L)-6400/PC3(L)-8500/PC3(L)-10600/PC3(L)-12800/PC3(L)-14900/PC3(L)-17000 DDR3 SDRAM Load Reduced DIMM Design Specification |
MODULE4.20.24.K | Apr 2014 |
Release No. 24. Item 2192.68 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Annex A, R/C A, in 240-Pin, 72 bit-wide, PC3(L)-6400/PC3(L)-8500/PC3(L)-10600/PC3(L)-12800/PC3(L)-14900/PC3(L)-17000 DDR3 SDRAM Load Reduced DIMM Design Specification |
MODULE4.20.24.A | Apr 2014 |
Release No. 24. Item 2192.58B A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Registration - 240 Pin DDR3 DIMM (Dual Inline Memory Module) Family with 1.00 mm pitch. DIM |
MO-269J | Apr 2014 |
Item 11.14-163 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPERATURESStatus: Reaffirmed September 2019 |
JEP153A | Mar 2014 |
This document provides an industry standard method for characterization and monitoring thermal stress test oven temperatures. The procedures described in this document should be used to insure thermal stress test conditions are being achieved and maintained during various test procedures. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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RELIABILITY QUALIFICATION OF POWER AMPLIFIER MODULESStatus: Reaffirmed October 2024 |
JESD237 | Mar 2014 |
This standard is intended to identify a core set of qualification tests that apply specifically for Power Amplifier Modules and their primary application in mobile devices such as cellular phones. This standard is intended to describe specific stresses and failure mechanisms that are specific to compound semiconductors and power amplifier modules. It is intended to establish more meaningful and efficient qualification testing. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14.7 Free download. Registration or login required. |
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Registration - 204 Pin DDR3 SODIMM w/ 0.60 mm Pitch. DIM |
MO-268E | Mar 2014 |
Item 11.14-151 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.14 Free download. Registration or login required. |
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SPD Annex K - Serial Presence Detect (SPD) for DDR3 SDRAM Modules, Release 6 |
SPD4.1.2.11 | Feb 2014 |
Release No. 24. Item 2065.47A A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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DDR4 UDIMM Design Specification Annex D |
PRN14-NM1 | Feb 2014 |
Item 2231.09 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Registration - 260 Pin DDR4 SODIMM, 0.50 mm Pitch. DIMM |
MO-310C | Feb 2014 |
Item No. 11.14-164 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - DDR3 Single Sided SODIMM 204 Pin Socket Outline with 0.60 mm Pitch. SKT |
SO-020A | Jan 2014 |
Item No. 11.14-153 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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SPD Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules, Release 2Release Number: 23A |
SPD4.1.2.L-2 | Jan 2014 |
This annex describes the serial presence detect (SPD) values for all DDR4 modules covered in Document Release 2. Differences between module types are encapsulated in subsections of this annex. These presence detect values are those referenced in the SPD standard document for ‘Specific Features’. (This release is editorial changes only). A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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RELIABILITY QUALIFICATION OF SEMICONDUCTOR DEVICES BASED ON PHYSICS OF FAILURE RISK AND OPPORTUNITY ASSESSMENTStatus: Reaffirmed September 2019 |
JEP148B | Jan 2014 |
A concept is outlined, which proactively integrates qualification into the development process and provides a systematic procedure as support tool to development and gives early focus on required activities. It converts requirements for a product into measures of development and qualification in combination with a risk and opportunity assessment step and accompanies the development process as guiding and recording tool for advanced quality planning and confirmation. The collected data enlarge the knowledge database for DFR / BIR (design for reliability / building-in reliability) to be used for future projects. The procedure challenges and promotes teamwork of all involved disciplines. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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Design Requirements - Die-Size Ball Grid Array Packages (DSBGA) Design Guide. |
DG-4.7F | Jan 2014 |
Item 11.2-829R A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.2 Free download. Registration or login required. |
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Addendum No. 3 to JESD79-3, 3D STACKED SDRAM |
JESD79-3-3 | Dec 2013 |
This addendum to JESD79-3 defines the 3DS DDR3 SDRAM specification, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this specification is to define the minimum set of requirements for compliant 8Gbit through 64Gbit x4 and x8 3DS DDR3 SDRAM devices. This document was created based on the E revision of the DDR standard (JESD79). Each aspect of the changes for 3DS DDR3 SDRAM operation was considered. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42.3 Free download. Registration or login required. |
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