Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
---|---|---|
Registration - Surface Mount Power Package with fused leads. H-PSOF |
MO-299B | Jan 2015 |
Item 11.11-902 Free download. Registration or login required. |
||
Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO. |
MO-286B | Jan 2015 |
Item 11.10-450 Committee(s): JC-11.10 Free download. Registration or login required. |
||
Dual Inline Memory Modules (DIMMs) Table of Contents |
MODULE4.20.TOC | Dec 2014 |
Release No. 24 Committee(s): JC-42.2, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
||
JOINT JEDEC/IPC/ECIA STANDARD - NOTIFICATION STANDARD FOR PRODUCT DISCONTINUANCE |
J-STD-048 | Nov 2014 |
This document supersedes JESD48. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. The goal of this notification standard is to better enable customers to manage and mitigate the disruption caused by the discontinuation of a product and ensure continuity of supply. This standard establishes the requirements for timely customer notification of planned product discontinuance, which will assist customers in managing end-of-life supply, or to transition ongoing requirements to alternate products. Committee(s): JC-14.4 Free download. Registration or login required. |
||
Standard Practices and Procedures - Registered and Standard Outlines |
SPP-013A | Oct 2014 |
Item 11.2-886(E). This document has been editorially updated to provide template examples. Committee(s): JC-11.2 Free download. Registration or login required. |
||
Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIMM |
MO-274D | Oct 2014 |
Item 11.14-171 Free download. Registration or login required. |
||
WIDE I/O 2 (WideIO2) |
JESD229-2 | Aug 2014 |
This standard defines Wide I/O 2 (WideIO2), including features, functionality, AC and DC characteristics, packages, and micropillar signal assignments. The purpose of this standard is to define the minimum set of requirements for JEDEC compliant, 8 Gb through 32 Gb SDRAM devices with 4 or 8 64-bit wide channels using direct chip-to-chip attach methods for between 1 and 4 memory devices and a controller/buffer device. The WideIO2 architecture is an evolution of the WIO architecture to enable bandwidth scaling with capacity. Committee(s): JC-42.6 Free download. Registration or login required. |
||
GDDR5 MEASUREMENT PROCEDURES |
JEP171 | Aug 2014 |
This publication is to inform all industry participants of a unified procedure to enable consistent measurement across the industry. This document contains the measurement procedures for testing GDDR5. Committee(s): JC-42.3 Free download. Registration or login required. |
||
Annex F, R/C F, in 260-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM SODIMM Design SpecificationRelease Number: 24 |
MODULE4.20.25.F | Aug 2014 |
Item 2228.02 Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
||
Registration - Fine Pitch Ball Grid Array Family, Square, 0.50 mm pitch. (T, V) F-SBGA |
MO-313A | Aug 2014 |
Item No. 11-892 Free download. Registration or login required. |
||
Standard Practices and Procedures - Grid Array Terminal Position Numbering |
SPP-010B | May 2014 |
Free download. Registration or login required. |
||
SOLDER BALL SHEARStatus: Reaffirmed September 2020 |
JESD22-B117B | May 2014 |
The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test. Free download. Registration or login required. |
||
204-Pin DDR3 SDRAM Unbuffered SODIMM Design Specification |
MODULE4.20.18 | May 2014 |
Release No. 24; Item 2114.44 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
||
PC4-RDIMM_090_Annex-F |
PRN14-NM10 | May 2014 |
Item 2241.11 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
||
HSUL_12 LPDDR2 AND LPDDR3 I/O WITH OPTIONAL ODT |
JESD8-22B | Apr 2014 |
This standard defines the input, output specifications and ac test conditions for devices that are designed to operate in the High Speed Unterminated Logic (HSUL_12) logic switching range, nominally 0 V to 1.2 V. The standard may be applied to ICs operating with separate VDD and VDDQ supply voltages. Committee(s): JC-16 Free download. Registration or login required. |
||
Registration - Power Outline, Plastic Surface Mount C-Bend |
DO-218C | Apr 2014 |
Item No. 10-454 Free download. Registration or login required. |
||
240-Pin, 72 bit-wide, PC3(L)-6400/PC3(L)-8500/PC3(L)-10600/PC3(L)-12800/PC3(L)-14900/PC3(L)-17000 DDR3 SDRAM Load Reduced DIMM Design Specification |
MODULE4.20.24 | Apr 2014 |
Release No. 24. Item 2192.48A Committee(s): JC-45.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
||
Annex C, R/C C, in 240-Pin, 72 bit-wide, PC3(L)-6400/PC3(L)-8500/PC3(L)-10600/PC3(L)-12800/PC3(L)-14900/PC3(L)-17000 DDR3 SDRAM Load Reduced DIMM Design Specification |
MODULE4.20.24.C | Apr 2014 |
Release No. 24. Item 2192.54 Committee(s): JC-45.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
||
Annex K, R/C K, in 240-Pin, 72 bit-wide, PC3(L)-6400/PC3(L)-8500/PC3(L)-10600/PC3(L)-12800/PC3(L)-14900/PC3(L)-17000 DDR3 SDRAM Load Reduced DIMM Design Specification |
MODULE4.20.24.K | Apr 2014 |
Release No. 24. Item 2192.68 Committee(s): JC-45.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
||
Annex A, R/C A, in 240-Pin, 72 bit-wide, PC3(L)-6400/PC3(L)-8500/PC3(L)-10600/PC3(L)-12800/PC3(L)-14900/PC3(L)-17000 DDR3 SDRAM Load Reduced DIMM Design Specification |
MODULE4.20.24.A | Apr 2014 |
Release No. 24. Item 2192.58B Committee(s): JC-45.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |