Standards & Documents Search

Displaying 21 - 40 of 1471 documents. Show 5 | 10 | 20 | 40 | 60 results per page.

Title Document # Datesort ascending

DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard

Release Number: Version 1.1 		JESD309A Feb 2025

This standard defines the electrical and mechanical requirements for 262-pin, 1.1 V (VDD), Small Outline, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR5 SDRAM SODIMMs). These DDR5 SODIMMs are intended for use as main memory when installed in Computers, laptops and other systems.

Committee(s): JC-45, JC-45.3

Free download. Registration or required.

Graphics Double Data Rate 7 SGRAM Standard (GDDR7)

 JESD239B Feb 2025

This standard defines the Graphics Double Data Rate 7 (GDDR7) Synchronous Graphics Random Access Memory (SGRAM) specification, including features, functionality, package, and pin assignments.

 

Committee(s): JC-42, JC-42.1

Free download. Registration or required.

PMIC5120 Power Management IC Standard

Release Number: Version 1.0 		JESD301-6 Feb 2025

This standard defines the specification of interface parameters, signaling protocols, and features for PMIC devices used for memory module applications. The designation PMIC5120 refers to the device specified by this document.

The purpose is to provide a standard for the PMIC5120 device for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

Unless otherwise noted in the document, any illegal operation is not allowed and device operation is not guaranteed.

Committee(s): JC-40, JC-40.1

Free download. Registration or required.

SHIPPING AND HANDLING TRAY FOR DDR5 2U DIMM

 CO-042A Feb 2025

Designator: N/A

Item #: 5-1074

Committee(s): JC-11, JC-11.5

JEP95 Registrations Main Page

Free download. Registration or required.

STANDARD MANUFACTURER'S IDENTIFICATION CODE

 JEP106BL Feb 2025

The manufacturers identification code is defined by one or more 8 bit fields, each consisting of 7 data bits plus 1 odd parity bit. The manufacturers identification code is assigned, maintained and updated by the JEDEC Office. The intent of this identification code is that it may be used whenever a digital field is required, e.g., hardware, software, documentation, etc. To make a request for an ID Code please go to https://www.jedec.org/standards-documents/id-codes-order-form

Committee(s): JC-42, JC-42.3

Free download. Registration or required.

288 TERMINAL POSITIONS (287 TERMINALS) DDR5 DIMM SMT 0.85MM PITCH SOCKET

 SO-023E Feb 2025

Designator: PDXC-LO288-I0p85-R162p0x6p5Z21p3-N5p20S3p1Z0p2

Item: 11.14-233, Access STP Files for SO-023C

Cross Reference: MO-329, GS-010C

 

Patents(): CN 202759077 U

Committee(s): JC-11, JC-11.14

JEP95 Registrations Main Page

Free download. Registration or required.

DESIGN GUIDE 4.10, GENERIC SHIPPING & HANDLING MATRIX TRAY

 DG-4.10E Feb 2025

Item 102-1029S

Committee(s): JC-11, JC-11.2

JEP95 Registrations Main Page

Free download. Registration or required.

PART MODEL SCHEMAS

 JEP30-10v8-0-0 Feb 2025

This download includes all files under the parent schema JEP30-10v8-0-0 (Committees: JC-11, JC-11.2) including:

  • JEP30-A101v2-0-4 (Assembly Process),
    • Committees: JC-11, JC-11.2, JC-14
  • JEP30-E101v5-0-0 (Electrical),
    • Committees: JC-11, JC-11.2, JC-16
  • JEP30-P101v8-0-0 (Package),
    • Committees: JC-11, JC-11.2
  • JEP30-S101v1-1-1 (Supply Chain),
    • Committees: JC-11, JC-11.2, JC-14
  • JEP30-T101v2-0-4 (Thermal)
    • Committees: JC-11, JC-11.2, JC-15
  • JEP30-K101v1-0-0 (Design Rule Kits)
     
  • JEP30-M101v1-0-0 (ECAD Models Guidelines)
     
  • JEP30-D10v5-0-0 (Types Dictionary)
    • Committees: JC-11, JC-11.2

This will enable the user to validate the schemas. For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16

Free download. Registration or required.

Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-T100B.01 Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-15

Free download. Registration or required.

Part Model Package Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-P100G Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

Part Model Guidelines for Electronic-Device Packages – XML Requirements

 JEP30F Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

PartModel Generated ECAD - Models Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-M100 Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “generated ECAD model” subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

PartModel Design Rule Kits Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-K100 Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “Design Kit” subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

Part Model Supply Chain Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-S100A.02 Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14.4

Free download. Registration or required.

Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-E100G Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-16

Free download. Registration or required.

Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-A100B.01 Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts.  This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14.4

Free download. Registration or required.

Descriptive Designation System for Electronic-device Packages and Footprints

JESD30O Feb 2025

This standard establishes requirements for the generation of electronic-device package designators for JEDEC.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE

 MS-012H Feb 2025

Designator: PDSO-G#_I127-##...

Item 11-1061

Committee(s): JC-11, JC-11.11

JEP95 Registrations Main Page

Free download. Registration or required.

PLASTIC BOTTOM GRID ARRAY, BALL, 0.35 MM PITCH, RECTANGULAR FAMILY PACKAGE (UPPER POP)

 MO-366A Feb 2025

Designator: PBGA-B#[#]_I0p35...

Item: 11-1075

 

 

Committee(s): JC-11, JC-11.11

JEP95 Registrations Main Page

Free download. Registration or required.

PMIC5000/PMIC5010 Power Management IC Standard

 JESD301-1A.03 Feb 2025

This standard defines the specifications of interface parameters, signaling protocols, and features for PMIC device as used for memory module applications. The designation PMIC5000, PMIC5010 refers to the device specified by this document. The purpose is to provide a standard for the PMIC5000, PMIC5010 device for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

This is a minor update to correct the document name, and also remove the extraneous hard return in the middle of the description between “as” and “used”.

Committee(s): JC-40.1

Free download. Registration or required.

Pages

Search by Keyword or Document Number

or Reset

Filter by document type:

Filter by keywords: