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Title	Document #	Date
Standard - Thin Small Outline Package. TSOPII Package. This revision modifies leadframe thickness for 10.16 mm body SOIC family. Item 11.11-753(S)	MS-024H	Jun 2006
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
DDR2 SPD INTERPRETATION OF TEMPERATURE RANGE AND (SELF-) REFRESH OPERATION	JEP179	Jun 2006
The purpose of this document is to explain the meaning of SPD setting (JESD21 SPD section) for DDR2 SDRAM (JESD79-2) in normal and extended temperature operationy67. Committee(s): JC-42.3 Free download. Registration or login required.
ADDENDUM No. 7 to JESD8 - 1.8 V + -0.15 V (NORMAL RANGE), AND 1.2 V - 1.95 V (WIDE RANGE) POWER SUPPLY VOLTAGE AND INTERFACE STANDARD FOR NONTERMINATED DIGITAL INTEGRATED CIRCUIT:	JESD8-7A	Jun 2006
This standard continues the voltage specification migration to the next level beyond the 2.5 V specification already established. Since this migration is driven by both process changes and performance/power, more entries can be expected in supporting required voltage levels. The rapidity of this evolution is expecting to increase because of the same feature sizes expected. Committee(s): JC-16 Free download. Registration or login required.
Registration - Small outline packages (7.60 mm body width) with an exposed pad. (F)-PDSO / SOIC, SOP.	MO-271-A	Jun 2006
Item 11.11-738 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.	MO-248-E	Jun 2006
Item 11.11-744. Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
SPD Annex G, Serial Presence Detect for FBDIMM, Revision 1.1	SPD4.1.2.7	Jun 2006
Release No. 16A. Item 2003.02A Committee(s): JC-45 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.	MO-205-G	Jul 2006
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - DDR3 DIMM Socket Insertion and Extraction Force Gauge. Item 11.14-098	GS-005A	Jul 2006
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - FBDIMM, 240 Position Socket Outline with 1.00 mm Contact Centers. Item 11.14-082 and 11.14-087.	SO-003B	Aug 2006
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 10 Pin Micro Size MultiMediaCard (MMC) Outline - MMCmicro 14 x 12 x 1.1 mm. RT-PLGA/MMCmicro.	MO-279A	Sep 2006
Item 11.14-093 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 13 Pin Reduced Size MultiMediaCard (MMC) Outline - MMCmobile 18 x 24 x 1.4 mm. RL-PLGA/MMCmobile.	MO-278A	Sep 2006
Item 11.14-092 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 13 Pin Full Size MultiMediaCard (MMC) Outline - MMCplus 32 x 24 x 1.4 mm. RL-PLGA/MMCplus.	MO-277A	Sep 2006
Item 11.14-091 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA.	MO-280-A	Sep 2006
Item 11-759 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N.	DG-4.8C	Sep 2006
Item 11.2-713(s) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
STANDARD - FBDIMM Socket Insertion and Extraction Force Gauge. Item 11.14-083(S)	GS-004A	Oct 2006
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Silicon Pad Sequence (x16/x32 LPDRAM, x16 PSRAM, x16 NAND). Item JC-63-029	MCP3.12.3	Nov 2006
Release No. 16A Committee(s): JC-63 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Registration - Thin profile, 3 lead, Plastic Small Outline, Surface Mount. T-PSOF-3. Item 11.10-441(E).	TO-278B	Nov 2006
Patents(): STMicroelectronics Inc. Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR2 SDRAM DIMM (Dual Inline memory Module) Family, Flex-Based, 1.00 mm Contact Centers.	MO-281-A	Nov 2006
Item 11.14-100 Patents(): STAKTEK: See Outline Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 200 Pin DDR Small Outline Dual-In-Line Memory Module (SODIMM) Family, 0.60 mm Contact Centers. Item 11.14-077. Key tolerance corrected	MO-224-E	Nov 2006
Item 11-074(e) and 14-106(e) Patents(): Hatachi: 5,227,664 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR and DDR2 Micro DIMM Mezzanine, 214 pin, 0.4 mm Lead Centers.	MO-260-C	Dec 2006
Item 11.14-101 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Standard - Thin Small Outline Package. TSOPII Package. This revision modifies leadframe thickness for 10.16 mm body SOIC family. Item 11.11-753(S)

DDR2 SPD INTERPRETATION OF TEMPERATURE RANGE AND (SELF-) REFRESH OPERATION

ADDENDUM No. 7 to JESD8 - 1.8 V + -0.15 V (NORMAL RANGE), AND 1.2 V - 1.95 V (WIDE RANGE) POWER SUPPLY VOLTAGE AND INTERFACE STANDARD FOR NONTERMINATED DIGITAL INTEGRATED CIRCUIT:

Registration - Small outline packages (7.60 mm body width) with an exposed pad. (F)-PDSO / SOIC, SOP.

Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.

SPD Annex G, Serial Presence Detect for FBDIMM, Revision 1.1

Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.

Standard - DDR3 DIMM Socket Insertion and Extraction Force Gauge. Item 11.14-098

Registration - FBDIMM, 240 Position Socket Outline with 1.00 mm Contact Centers. Item 11.14-082 and 11.14-087.

Registration - 10 Pin Micro Size MultiMediaCard (MMC) Outline - MMCmicro 14 x 12 x 1.1 mm. RT-PLGA/MMCmicro.

Registration - 13 Pin Reduced Size MultiMediaCard (MMC) Outline - MMCmobile 18 x 24 x 1.4 mm. RL-PLGA/MMCmobile.

Registration - 13 Pin Full Size MultiMediaCard (MMC) Outline - MMCplus 32 x 24 x 1.4 mm. RL-PLGA/MMCplus.

Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA.

Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N.

STANDARD - FBDIMM Socket Insertion and Extraction Force Gauge. Item 11.14-083(S)

Silicon Pad Sequence (x16/x32 LPDRAM, x16 PSRAM, x16 NAND). Item JC-63-029

Registration - Thin profile, 3 lead, Plastic Small Outline, Surface Mount. T-PSOF-3. Item 11.10-441(E).

Registration - DDR2 SDRAM DIMM (Dual Inline memory Module) Family, Flex-Based, 1.00 mm Contact Centers.

Registration - 200 Pin DDR Small Outline Dual-In-Line Memory Module (SODIMM) Family, 0.60 mm Contact Centers. Item 11.14-077. Key tolerance corrected

Registration - DDR and DDR2 Micro DIMM Mezzanine, 214 pin, 0.4 mm Lead Centers.

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